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公开(公告)号：US20120040146A1
公开(公告)日：2012-02-16
申请号：US13266548
申请日：2010-05-21
CPC分类号： C03C17/002 , C03B33/091 , C03C17/28 , C03C2217/78 , C03C2218/365 , C04B41/009 , C04B41/4572 , C04B41/82 , Y02P40/57 , Y10T428/24777 , C04B41/48 , C04B41/4961 , C04B35/00
摘要： A substrate (100) comprising a sheet of either a glass, a glass ceramic, or a ceramic and having increased edge strength. A polymeric edge coating (120) prevents creation of strength limiting defects along the edges of the substrate and protects the bend strength of the edges. The substrate may also have at least two parallel high strength edges (110, 112) and an edge coating (120) of a polymeric material covering at least a portion of each of the high strength edges to preserve the high strength edges from the introduction of defects and damage to the edges. Each of the two parallel high strength edges has a bend strength that is capable of less than about 2% failure probability at a stress level of 200 MPa over a test length of 50 mm. A method of making the substrate is also provided.
摘要翻译： 一种基板（100），其包括玻璃，玻璃陶瓷或陶瓷的片材，并具有增加的边缘强度。 聚合物边缘涂层（120）防止沿着基底的边缘产生强度限制缺陷并保护边缘的弯曲强度。 衬底还可以具有至少两个平行的高强度边缘（110,112）和覆盖每个高强度边缘的至少一部分的聚合材料的边缘涂层（120），以保持高强度边缘不被引入 缺陷和损坏边缘。 两个平行的高强度边缘中的每一个具有在50mm的测试长度下在200MPa的应力水平下能够小于约2％的故障概率的弯曲强度。 还提供了制造基板的方法。
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公开(公告)号：US09422188B2
公开(公告)日：2016-08-23
申请号：US13266548
申请日：2010-05-21
CPC分类号： C03C17/002 , C03B33/091 , C03C17/28 , C03C2217/78 , C03C2218/365 , C04B41/009 , C04B41/4572 , C04B41/82 , Y02P40/57 , Y10T428/24777 , C04B41/48 , C04B41/4961 , C04B35/00
摘要： A substrate (100) comprising a sheet of either a glass, a glass ceramic, or a ceramic and having increased edge strength. A polymeric edge coating (120) prevents creation of strength limiting defects along the edges of the substrate and protects the bend strength of the edges. The substrate may also have at least two parallel high strength edges (110, 112) and an edge coating (120) of a polymeric material covering at least a portion of each of the high strength edges to preserve the high strength edges from the introduction of defects and damage to the edges. Each of the two parallel high strength edges has a bend strength that is capable of less than about 2% failure probability at a stress level of 200 MPa over a test length of 50 mm. A method of making the substrate is also provided.
摘要翻译： 一种基板（100），其包括玻璃，玻璃陶瓷或陶瓷的片材，并具有增加的边缘强度。 聚合物边缘涂层（120）防止沿着基底的边缘产生强度限制缺陷并保护边缘的弯曲强度。 衬底还可以具有至少两个平行的高强度边缘（110,112）和覆盖每个高强度边缘的至少一部分的聚合材料的边缘涂层（120），以保持高强度边缘不被引入 缺陷和损坏边缘。 两个平行的高强度边缘中的每一个具有在50mm的测试长度下在200MPa的应力水平下能够小于约2％的故障概率的弯曲强度。 还提供了制造基板的方法。
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公开(公告)号：US09434642B2
公开(公告)日：2016-09-06
申请号：US11804865
申请日：2007-05-21
IPC分类号： B32B7/02 , C03C17/34 , C03C4/00 , H01L51/00 , H01L31/0392
CPC分类号： H01L51/0097 , C03C4/00 , C03C17/34 , H01L31/03926 , H01L2251/5338 , Y02E10/549
摘要： A flexible substrate are disclosed comprising an amorphous inorganic composition, wherein the substrate has a thickness of less than about 250 μm and has at least one of: a) a brittleness ratio less than about 9.5 (μm)−1/2, or b) a fracture toughness of at least about 0.75 MPa·(m)1/2. Electronic devices comprising such flexible devices are also disclosed. Also disclosed is a method for making a flexible substrate comprising selecting an amorphous inorganic material capable of forming a substrate having a thickness of less than about 250 μm and having at least one of: a) a brittleness ratio of less than about 9.5 (μm)−1/2, or b) a fracture toughness of at least about 0.75 MPa·(m)1/2; and then forming a substrate from the selected inorganic material.
摘要翻译： 公开了一种柔性基底，其包括无定形无机组合物，其中所述基底具有小于约250μm的厚度，并且具有以下至少一种：a）脆性比小于约9.5（μm）-1/2，或b） 断裂韧性至少约为0.75MPa·（m）1/2。 还公开了包括这种柔性装置的电子设备。 还公开了一种制造柔性基材的方法，包括选择能够形成厚度小于约250μm的基材的无定形无机材料，并具有以下中的至少一种：a）小于约9.5（μm）的脆性比， -1/2，或b）断裂韧性为至少约0.75MPa·（m）1/2; 然后从所选择的无机材料形成衬底。
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公开(公告)号：US20110318859A1
公开(公告)日：2011-12-29
申请号：US13206050
申请日：2011-08-09
IPC分类号： H01L51/56
CPC分类号： H01L51/0097 , G02F2001/133302 , H01L2251/5338 , H01L2251/566 , Y02E10/549 , Y02P70/521 , Y10T428/10 , Y10T428/24777
摘要： Disclosed is an electronic device comprising a glass, glass ceramic, or ceramic sheet having a thickness less than about 0.4 mm and wherein a minimum strength of the inorganic substrate is greater than about 500 MPa. Also disclosed is a method of making an electronic device including drawing a viscous inorganic material to form an inorganic ribbon having opposing as-formed edges along a length of the ribbon, separating the ribbon to form a substrate sheet of inorganic material comprising two as-formed edges and forming a device element on the inorganic substrate.
摘要翻译： 公开了一种电子器件，其包括厚度小于约0.4mm的玻璃，玻璃陶瓷或陶瓷片，其中无机基底的最小强度大于约500MPa。 还公开了一种制造电子装置的方法，包括拉伸粘性无机材料以形成沿着带的长度具有相对的成形边缘的无机带，分离带以形成无机材料的基片，其包括两个形成 边缘并在无机基底上形成器件元件。
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公开(公告)号：US09315412B2
公开(公告)日：2016-04-19
申请号：US13541206
申请日：2012-07-03
申请人： Jeanne Spadinger Cavuoti , Donald A. Clark , Sean Matthew Garner , Gregory Scott Glaesemann , Jun Hou , Jum Sik Kim , Toshihiko Ono , Daniel Arthur Sternquist
发明人： Jeanne Spadinger Cavuoti , Donald A. Clark , Sean Matthew Garner , Gregory Scott Glaesemann , Jun Hou , Jum Sik Kim , Toshihiko Ono , Daniel Arthur Sternquist
IPC分类号： H01L21/00 , C03C15/02 , H01L33/58 , G02F1/1333
CPC分类号： H01L27/1262 , C03C15/02 , G02F1/1333 , H01L21/02019 , H01L33/58 , Y10T428/1095
摘要： Disclosed are controlled chemical etching processes used to modify the geometry of surface flaws in thin glass substrates and glass substrate assemblies formed therefrom, and in particular glass substrates suitable for the manufacture of active matrix displays that are essentially free of alkali metal oxides such as Na2O, K2O and Li2O.
摘要翻译： 公开了用于改变由其形成的薄玻璃基板和玻璃基板组件中的表面缺陷的几何形状的受控化学蚀刻工艺，特别是适用于制造基本上不含碱金属氧化物如Na 2 O， K2O和Li2O。
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公开(公告)号：US08017220B2
公开(公告)日：2011-09-13
申请号：US11888169
申请日：2007-07-31
CPC分类号： H01L51/0097 , G02F2001/133302 , H01L2251/5338 , H01L2251/566 , Y02E10/549 , Y02P70/521 , Y10T428/10 , Y10T428/24777
摘要： Disclosed is an electronic device comprising a glass, glass ceramic, or ceramic sheet having a thickness less than about 0.4 mm and wherein a minimum strength of the inorganic substrate is greater than about 500 MPa. Also disclosed is a method of making an electronic device including drawing a viscous inorganic material to form an inorganic ribbon having opposing as-formed edges along a length of the ribbon, separating the ribbon to form a substrate sheet of inorganic material comprising two as-formed edges and forming a device element on the inorganic substrate.
摘要翻译： 公开了一种电子器件，其包括厚度小于约0.4mm的玻璃，玻璃陶瓷或陶瓷片，其中无机基底的最小强度大于约500MPa。 还公开了一种制造电子装置的方法，包括拉伸粘性无机材料以形成沿着带的长度具有相对的成形边缘的无机带，分离带以形成无机材料的基片，其包括两个形成 边缘并在无机基底上形成器件元件。
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公开(公告)号：US20130109116A1
公开(公告)日：2013-05-02
申请号：US13541206
申请日：2012-07-03
申请人： Jeanne Spadinger Cavuoti , Donald A. Clark , Sean Matthew Garner , Gregory Scott Glaesemann , Jun Hou , Jum Sik Kim , Toshihiko Ono , Daniel Arthur Sternquist
发明人： Jeanne Spadinger Cavuoti , Donald A. Clark , Sean Matthew Garner , Gregory Scott Glaesemann , Jun Hou , Jum Sik Kim , Toshihiko Ono , Daniel Arthur Sternquist
CPC分类号： H01L27/1262 , C03C15/02 , G02F1/1333 , H01L21/02019 , H01L33/58 , Y10T428/1095
摘要： Disclosed are controlled chemical etching processes used to modify the geometry of surface flaws in thin glass substrates and glass substrate assemblies formed therefrom, and in particular glass substrates suitable for the manufacture of active matrix displays that are essentially free of alkali metal oxides such as Na2O, K2O and Li2O.
摘要翻译： 公开了用于改变由其形成的薄玻璃基板和玻璃基板组件中的表面缺陷的几何形状的受控化学蚀刻工艺，特别是适用于制造基本上不含碱金属氧化物如Na 2 O， K2O和Li2O。
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公开(公告)号：US20080292856A1
公开(公告)日：2008-11-27
申请号：US11804865
申请日：2007-05-21
IPC分类号： B32B9/00
CPC分类号： H01L51/0097 , C03C4/00 , C03C17/34 , H01L31/03926 , H01L2251/5338 , Y02E10/549
摘要： A flexible substrate are disclosed comprising an amorphous inorganic composition, wherein the substrate has a thickness of less than about 250 μm and has at least one of: a) a brittleness ratio less than about 9.5 (μm)−1/2, or b) a fracture toughness of at least about 0.75 MPa·(m)1/2. Electronic devices comprising such flexible devices are also disclosed. Also disclosed is a method for making a flexible substrate comprising selecting an amorphous inorganic material capable of forming a substrate having a thickness of less than about 250 μm and having at least one of: a) a brittleness ratio of less than about 9.5 (μm)−1/2, or b) a fracture toughness of at least about 0.75 MPa·(m)1/2; and then forming a substrate from the selected inorganic material.
摘要翻译： 公开了一种柔性基底，其包含无定形无机组合物，其中所述基底具有小于约250μm的厚度，并且具有以下至少一种：a）小于约9.5（mum）-1/2的脆性比，或b） 断裂韧性为至少约0.75MPa（m）1/2。 还公开了包括这种柔性装置的电子设备。 还公开了一种制造柔性基材的方法，包括选择能形成厚度小于约250μm的基材的无定形无机材料，并具有以下至少一种：a）小于约9.5（mum）的脆性比， -1/2，或b）断裂韧性为至少约0.75MPa（m）1/2; 然后从所选择的无机材料形成衬底。
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公开(公告)号：US08927053B2
公开(公告)日：2015-01-06
申请号：US13206050
申请日：2011-08-09
IPC分类号： H01L51/56 , H01L51/00 , G02F1/1333
CPC分类号： H01L51/0097 , G02F2001/133302 , H01L2251/5338 , H01L2251/566 , Y02E10/549 , Y02P70/521 , Y10T428/10 , Y10T428/24777
摘要： Disclosed is an electronic device comprising a glass, glass ceramic, or ceramic sheet having a thickness less than about 0.4 mm and wherein a minimum strength of the inorganic substrate is greater than about 500 MPa. Also disclosed is a method of making an electronic device including drawing a viscous inorganic material to form an inorganic ribbon having opposing as-formed edges along a length of the ribbon, separating the ribbon to form a substrate sheet of inorganic material comprising two as-formed edges and forming a device element on the inorganic substrate.
摘要翻译： 公开了一种电子器件，其包括厚度小于约0.4mm的玻璃，玻璃陶瓷或陶瓷片，其中无机基底的最小强度大于约500MPa。 还公开了一种制造电子装置的方法，包括拉伸粘性无机材料以形成沿着带的长度具有相对的成形边缘的无机带，分离带以形成无机材料的基片，其包括两个形成 边缘并在无机基底上形成器件元件。
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公开(公告)号：US20080085401A1
公开(公告)日：2008-04-10
申请号：US11888169
申请日：2007-07-31
CPC分类号： H01L51/0097 , G02F2001/133302 , H01L2251/5338 , H01L2251/566 , Y02E10/549 , Y02P70/521 , Y10T428/10 , Y10T428/24777
摘要： Disclosed is an electronic device comprising a glass, glass ceramic, or ceramic sheet having a thickness less than about 0.4 mm and wherein a minimum strength of the inorganic substrate is greater than about 500 MPa. Also disclosed is a method of making an electronic device including drawing a viscous inorganic material to form an inorganic ribbon having opposing as-formed edges along a length of the ribbon, separating the ribbon to form a substrate sheet of inorganic material comprising two as-formed edges and forming a device element on the inorganic substrate.
摘要翻译： 公开了一种电子器件，其包括厚度小于约0.4mm的玻璃，玻璃陶瓷或陶瓷片，其中无机基底的最小强度大于约500MPa。 还公开了一种制造电子装置的方法，包括拉伸粘性无机材料以形成沿着带的长度具有相对的成形边缘的无机带，分离带以形成无机材料的基片，其包括两个形成 边缘并在无机基底上形成器件元件。
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