公开(公告)号：US07977580B2

公开(公告)日：2011-07-12

申请号：US12473609

申请日：2009-05-28

申请人： Seigo Ueno ,  Toshiya Asano

发明人： Seigo Ueno ,  Toshiya Asano

IPC分类号： H05K1/16

CPC分类号： H05K3/0052 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2221/68345 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1461 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/007 ,  H05K3/4644 ,  H05K2201/0909 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2203/016 ,  Y10T29/49124 ,  H01L2924/00 ,  H01L2224/05599

摘要： An intermediate multilayer wiring board product includes: a stack of a plurality of resin insulating layers, a first conductor layer, and a second conductor layer. The stack includes: a product forming region comprising a plurality of product portions arranged along a major surface of the stack, each of the plurality of product portions to become a product of the multilayer wiring board; and a frame portion surrounding the product forming region. The first conductor layer is formed on at least one of the plurality of resin insulating layers within each of the plurality of product portions. The second conductor layer is formed on at least one of the plurality of resin insulating layers within the frame portion. The frame portion has a plurality of cuts penetrating the frame portion in a thickness direction thereof, the plurality of cuts being arranged at substantially equal intervals.

摘要翻译： 中间多层布线板产品包括：多个树脂绝缘层，第一导体层和第二导体层的叠层。 堆叠包括：产品形成区域，包括沿着堆叠的主表面布置的多个产品部分，多个产品部分中的每一个成为多层布线板的产品; 以及围绕产品形成区域的框架部分。 第一导体层形成在多个产品部分的每一个内的多个树脂绝缘层中的至少一个上。 第二导体层形成在框架部分内的多个树脂绝缘层中的至少一个上。 框架部分具有在其厚度方向上穿透框架部分的多个切口，多个切口以基本相等的间隔布置。

公开(公告)号：US08964403B2

公开(公告)日：2015-02-24

申请号：US13294763

申请日：2011-11-11

申请人： Seigo Ueno

发明人： Seigo Ueno

IPC分类号： H05K1/18 ,  H01L23/498 ,  H05K1/02 ,  H05K1/16 ,  H05K3/46

CPC分类号： H05K1/183 ,  H01L23/49833 ,  H01L2224/16225 ,  H05K1/0231 ,  H05K1/162 ,  H05K1/181 ,  H05K3/4614 ,  H05K2201/10318 ,  H05K2201/10674 ,  H05K2201/2018

摘要： There is provided a wiring board including a multilayer substrate and a reinforcing member. The multilayer substrate has a first main substrate surface formed with a chip mounting area to which an electronic chip is mounted and a second main substrate surface opposed to the first main substrate surface. The reinforcing member is fixed to either an area of the first main substrate surface other than the chip mounting area or the second main substrate surface and has a body predominantly formed of ceramic material and incorporating therein at least one capacitor.

摘要翻译： 提供了一种包括多层基板和加强件的布线板。 多层基板具有形成有安装有电子芯片的芯片安装区域的第一主基板表面和与第一主基板表面相对的第二主基板表面。 加强构件固定在除了芯片安装区域或第二主基板表面之外的第一主基板表面的区域中，并且具有主要由陶瓷材料形成并且内置有至少一个电容器的主体。