公开(公告)号：US08575744B2

公开(公告)日：2013-11-05

申请号：US12939000

申请日：2010-11-03

申请人： Seiji Fujiwara ,  Zhuoyan Sun ,  Atsushi Watanabe

发明人： Seiji Fujiwara ,  Zhuoyan Sun ,  Atsushi Watanabe

IPC分类号： H01L23/495

CPC分类号： H01L23/3142 ,  H01L23/3107 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/48639 ,  H01L2224/48647 ,  H01L2224/48739 ,  H01L2224/48747 ,  H01L2224/4903 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/85439 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device includes a semiconductor element and a lead frame. The lead frame includes a first lead, a second lead, a third lead, a fourth lead, and a fifth lead placed parallel to one another. The first and second leads are placed adjoining to each other and constitute a first lead group, and the third and fourth leads are placed adjoining to each other and constitute a second lead group. The spacing between the first lead group and the fifth lead, the spacing between the second lead group and the fifth lead, and the spacing between the first lead group and the second lead group are larger than the spacing between the first lead and the second lead and the spacing between the third lead and the fourth lead.

摘要翻译： 半导体器件包括半导体元件和引线框架。 引线框架包括彼此平行放置的第一引线，第二引线，第三引线，第四引线和第五引线。 第一和第二引线彼此相邻放置并构成第一引线组，并且第三和第四引线彼此相邻放置并构成第二引线组。 第一引线组和第五引线之间的间隔，第二引线组和第五引线之间的间隔以及第一引线组和第二引线组之间的间隔大于第一引线与第二引线之间的间隔 以及第三引线与第四引线之间的间隔。

公开(公告)号：US20110121440A1

公开(公告)日：2011-05-26

申请号：US12939000

申请日：2010-11-03

申请人： Seiji FUJIWARA ,  Zhuoyan Sun ,  Atsushi Watanabe

发明人： Seiji FUJIWARA ,  Zhuoyan Sun ,  Atsushi Watanabe

IPC分类号： H01L23/495

CPC分类号： H01L23/3142 ,  H01L23/3107 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/48639 ,  H01L2224/48647 ,  H01L2224/48739 ,  H01L2224/48747 ,  H01L2224/4903 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/85439 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device includes a semiconductor element and a lead frame. The lead frame includes a first lead, a second lead, a third lead, a fourth lead, and a fifth lead placed parallel to one another. The first and second leads are placed adjoining to each other and constitute a first lead group, and the third and fourth leads are placed adjoining to each other and constitute a second lead group. The spacing between the first lead group and the fifth lead, the spacing between the second lead group and the fifth lead, and the spacing between the first lead group and the second lead group are larger than the spacing between the first lead and the second lead and the spacing between the third lead and the fourth lead.

摘要翻译： 半导体器件包括半导体元件和引线框架。 引线框架包括彼此平行放置的第一引线，第二引线，第三引线，第四引线和第五引线。 第一和第二引线彼此相邻放置并构成第一引线组，并且第三和第四引线彼此相邻放置并构成第二引线组。 第一引线组和第五引线之间的间隔，第二引线组和第五引线之间的间隔以及第一引线组和第二引线组之间的间隔大于第一引线与第二引线之间的间隔 以及第三引线与第四引线之间的间隔。