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    Semiconductor device and test method for the same
    1.
    发明授权
    Semiconductor device and test method for the same 失效
    半导体器件及其测试方法相同

    公开(公告)号：US06885212B2

    公开(公告)日：2005-04-26

    申请号：US10356489

    申请日：2003-02-03

    申请人： Seiji Yamamoto ,  Hirosuke Koumyoji ,  Tohru Yasuda ,  Mikio Ishikawa ,  Isaya Sobue ,  Hajime Sato ,  Chiaki Furukawa ,  Akira Sugiura ,  Akihiro Iwase

    发明人： Seiji Yamamoto ,  Hirosuke Koumyoji ,  Tohru Yasuda ,  Mikio Ishikawa ,  Isaya Sobue ,  Hajime Sato ,  Chiaki Furukawa ,  Akira Sugiura ,  Akihiro Iwase

    IPC分类号： G01R31/28 ,  G01R31/04 ,  G11C7/10 ,  H01L21/822 ,  H01L27/04 ,  G01R31/26

    CPC分类号： G01R31/04 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A multi-bus semiconductor device and a method of its probing test perform the DC test for individual pads of a device while dealing with an adequate number of devices for simultaneous measurement based on the scheme of input/output pad number compressive test. The semiconductor device includes switch elements SW0-SW4 connected between input/output pads P0-P4 and a testing line L0 so that pads in an arbitrary combination, among the off-probe pads P1-P4 that are not made in contact with the tester probe Pr0, are selected for testing in correspondence to the combination of switch elements that are turned on. The input/output buffers of the pads under test are deactivated to block their internal current paths. The corresponding switch elements are turned on to connect the off-probe pads under test to the probe pad P0 that is made in contact with the tester probe Pr0, and the leak current of the probes is measured with the tester TS.

    摘要翻译： 多总线半导体器件及其探测测试方法基于输入/输出焊盘数压缩测试的方案，处理设备的各个焊盘的DC测试，同时处理足够数量的用于同时测量的设备。 半导体器件包括连接在输入/输出焊盘P 0 -P 4和测试线L 0之间的开关元件SW 0 -SW 4，使得不是非探针焊盘P 1 -P 4中的任意组合的焊盘 与测试仪探头Pr 0接触的选择被选择用于与打开的开关元件的组合相对应的测试。 被测试焊盘的输入/输出缓冲器被禁用以阻止其内部电流路径。 将相应的开关元件接通，将被测试的探针焊盘连接到与测试仪探头Pr 0接触的探针焊盘P 0，并用测试仪TS测量探头的漏电流。

    Semiconductor device and test method for the same
    2.
    发明授权
    Semiconductor device and test method for the same 有权
    半导体器件及其测试方法相同

    公开(公告)号：US07330043B2

    公开(公告)日：2008-02-12

    申请号：US11079142

    申请日：2005-03-15

    申请人： Seiji Yamamoto ,  Hirosuke Koumyoji ,  Tohru Yasuda ,  Mikio Ishikawa ,  Isaya Sobue ,  Hajime Sato ,  Chiaki Furukawa ,  Akira Sugiura ,  Akihiro Iwase

    发明人： Seiji Yamamoto ,  Hirosuke Koumyoji ,  Tohru Yasuda ,  Mikio Ishikawa ,  Isaya Sobue ,  Hajime Sato ,  Chiaki Furukawa ,  Akira Sugiura ,  Akihiro Iwase

    IPC分类号： G01R31/26 ,  G01R31/28

    CPC分类号： G01R31/04 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A multi-bus semiconductor device and a method of its probing test perform the DC test for individual pads of a device while dealing with an adequate number of devices for simultaneous measurement based on the scheme of input/output pad number compressive test. The semiconductor device includes switch elements SW0-SW4 connected between input/output pads P0-P4 and a testing line L0 so that pads in an arbitrary combination, among the off-probe pads P1-P4 that are not made in contact with the tester probe Pr0, are selected for testing in correspondence to the combination of switch elements that are turned on. The input/output buffers of the pads under test are deactivated to block their internal current paths. The corresponding switch elements are turned on to connect the off-probe pads under test to the probe pad P0 that is made in contact with the tester probe Pr0, and the leak current of the probes is measured with the tester TS.

    摘要翻译： 多总线半导体器件及其探测测试方法基于输入/输出焊盘数压缩测试的方案，处理设备的各个焊盘的DC测试，同时处理足够数量的用于同时测量的设备。 半导体器件包括连接在输入/输出焊盘P 0 -P 4和测试线L 0之间的开关元件SW 0 -SW 4，使得不是非探针焊盘P 1 -P 4中的任意组合的焊盘 与测试仪探头Pr 0接触的选择被选择用于与打开的开关元件的组合相对应的测试。 被测试焊盘的输入/输出缓冲器被禁用以阻止其内部电流路径。 将相应的开关元件接通，将被测试的探针焊盘连接到与测试仪探头Pr 0接触的探针焊盘P 0，并用测试仪TS测量探头的漏电流。

    Semiconductor device and test method for the same
    3.
    发明申请
    Semiconductor device and test method for the same 有权
    半导体器件及其测试方法相同

    公开(公告)号：US20050156589A1

    公开(公告)日：2005-07-21

    申请号：US11079142

    申请日：2005-03-15

    申请人： Seiji Yamamoto ,  Hirosuke Koumyoji ,  Tohru Yasuda ,  Mikio Ishikawa ,  Isaya Sobue ,  Hajime Sato ,  Chiaki Furukawa ,  Akira Sugiura ,  Akihiro Iwase

    发明人： Seiji Yamamoto ,  Hirosuke Koumyoji ,  Tohru Yasuda ,  Mikio Ishikawa ,  Isaya Sobue ,  Hajime Sato ,  Chiaki Furukawa ,  Akira Sugiura ,  Akihiro Iwase

    IPC分类号： G01R31/28 ,  G01R31/04 ,  G11C7/10 ,  H01L21/822 ,  H01L27/04 ,  G01R31/02

    CPC分类号： G01R31/04 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A multi-bus semiconductor device and a method of its probing test perform the DC test for individual pads of a device while dealing with an adequate number of devices for simultaneous measurement based on the scheme of input/output pad number compressive test. The semiconductor device includes switch elements SW0-SW4 connected between input/output pads P0-P4 and a testing line L0 so that pads in an arbitrary combination, among the off-probe pads P1-P4 that are not made in contact with the tester probe Pr0, are selected for testing in correspondence to the combination of switch elements that are turned on. The input/output buffers of the pads under test are deactivated to block their internal current paths. The corresponding switch elements are turned on to connect the off-probe pads under test to the probe pad P0 that is made in contact with the tester probe Pr0, and the leak current of the probes is measured with the tester TS.

    摘要翻译： 多总线半导体器件及其探测测试方法基于输入/输出焊盘数压缩测试的方案，处理设备的各个焊盘的DC测试，同时处理足够数量的用于同时测量的设备。 半导体器件包括连接在输入/输出焊盘P 0 -P 4和测试线L 0之间的开关元件SW 0 -SW 4，使得不是非探针焊盘P 1 -P 4中的任意组合的焊盘 与测试仪探头Pr 0接触的选择被选择用于与打开的开关元件的组合相对应的测试。 被测试焊盘的输入/输出缓冲器被禁用以阻止其内部电流路径。 将相应的开关元件接通，将被测试的探针焊盘连接到与测试仪探头Pr 0接触的探针焊盘P 0，并用测试仪TS测量探头的漏电流。

    Method and apparatus for preparing multi-cellular foamed board of thermoplastic resin
    4.
    发明授权
    Method and apparatus for preparing multi-cellular foamed board of thermoplastic resin 失效
    制备热塑性树脂多孔泡沫板的方法和装置

    公开(公告)号：US4536357A

    公开(公告)日：1985-08-20

    申请号：US575127

    申请日：1984-01-30

    申请人： Motoshige Hayashi ,  Toshirou Kobayashi ,  Motokazu Yoshii ,  Masahiro Tsubone ,  Mikio Ishikawa

    发明人： Motoshige Hayashi ,  Toshirou Kobayashi ,  Motokazu Yoshii ,  Masahiro Tsubone ,  Mikio Ishikawa

    IPC分类号： B29C47/90 ,  B29B7/00 ,  B29C44/50 ,  B29C47/00 ,  B29C47/14 ,  B29C67/20 ,  B29D20060101 ,  B29K105/04 ,  B29L7/00 ,  B29D27/00

    CPC分类号： B29C44/26 ,  B29C44/50 ,  B29L2007/002 ,  Y10S264/05

    摘要： A method for preparing a multi-cellular foamed board of thermoplastic resin which comprises forming under pressure in a die a thermoplastic resin melt containing a foaming agent to give the resin melt a shape of a flat board having a broad width compared with a thickness thereof, extruding the resin melt from the die having the convex forward end with a middle portion in the width direction thereof protruding the greatest toward the extruding direction, introducing thus extruded resin melt immediately into a moulding passage having a concave end engaging with the said convex forward end of the die, allowing the resin melt to expand in the thickness direction at the portion adjacent to and extending along the concave end of the passage, and thereafter allowing the resin melt to expand in both the thickness and width directions of the board in the passage.

    摘要翻译： 一种制备热塑性树脂多孔泡沫板的方法，包括在模具中在压力下形成含有发泡剂的热塑性树脂熔体，使树脂熔融成与其厚度相比宽的宽度的平板， 将具有凸形前端的模具的树脂熔体从其宽度方向的中间部分沿着挤出方向突出最大的方式挤出，将这样挤出的树脂熔体立即引入具有与所述凸起前端接合的凹入端的成型通道 使树脂熔体在与通道的凹端相邻并且沿着通道的凹端延伸的部分沿着厚度方向膨胀，然后使树脂熔体在通路的板的厚度方向和宽度方向上膨胀 。

    Process for producing thermoplastic resin foams
    5.
    发明授权
    Process for producing thermoplastic resin foams 失效
    制造热塑性树脂泡沫的方法

    公开(公告)号：US5902529A

    公开(公告)日：1999-05-11

    申请号：US951586

    申请日：1997-10-16

    申请人： Mikio Ishikawa ,  Teruyoshi Akuzawa

    发明人： Mikio Ishikawa ,  Teruyoshi Akuzawa

    IPC分类号： B29C44/34 ,  B29C47/50 ,  B29C47/64 ,  B29K101/12 ,  B29C44/20

    CPC分类号： B29C44/3442 ,  B29C47/50 ,  B29C47/64 ,  B29C47/0009

    摘要： An improved process and apparatus for producing a thermoplastic resin foam by mixing a thermoplastic resin, a blowing agent and other necessary components in a molten state and extruding the mixture to expand. The apparatus comprises a metering zone provided at the front end of the rotating shaft in an extruder, a kneading zone provided closer to the rear end than the metering zone, and a plurality of perforated plates mounted on the surface of the shaft in the kneading zone. The outside diameter of said shaft is made smaller than that of the screw in the metering zone as measured at the bottom of channels. This feature combines with the perforated plates to insure uniform mixing and consistent extruding operations.

    摘要翻译： 一种用于通过在熔融状态下混合热塑性树脂，发泡剂和其它必需组分并挤出混合物以膨胀来生产热塑性树脂泡沫的改进方法和设备。 该设备包括设置在挤出机中的旋转轴的前端处的计量区域，比计量区域更靠近后端设置的捏合区域，以及安装在捏合区域的轴的表面上的多个多孔板 。 所述轴的外径小于在通道底部测量的计量区域中的螺杆的外径。 该特征与多孔板结合，确保均匀混合和一致的挤压操作。