摘要:
A nonvolatile trap charge storage cell selects a logic interconnect transistor uses in programmable logic applications, such as FPGA. The nonvolatile trap charge element is an insulator located under a control gate and above an oxide on the surface of a semiconductor substrate. The preferred embodiment is an integrated device comprising a word gate portion sandwiched between two nonvolatile trap charge storage portions, wherein the integrated device is connected between a high bias, a low bias and an output. The output is formed by a diffusion connecting to the channel directly under the word gate portion. The program state of the two storage portions determines whether the high bias or the low bias is coupled to a logic interconnect transistor connected to the output diffusion.
摘要:
A nonvolatile trap charge storage cell selects a logic interconnect transistor uses in programmable logic applications, such as FPGA. The nonvolatile trap charge element is an insulator located under a control gate and above an oxide on the surface of a semiconductor substrate. The preferred embodiment is an integrated device comprising a word gate portion sandwiched between two nonvolatile trap charge storage portions, wherein the integrated device is connected between a high bias, a low bias and an output. The output is formed by a diffusion connecting to the channel directly under the word gate portion. The program state of the two storage portions determines whether the high bias or the low bias is coupled to a logic interconnect transistor connected to the output diffusion.
摘要:
A nonvolatile trap charge storage cell selects a logic interconnect transistor uses in programmable logic applications, such as FPGA. The nonvolatile trap charge element is an insulator located under a control gate and above an oxide on the surface of a semiconductor substrate. The preferred embodiment is an integrated device comprising a word gate portion sandwiched between two nonvolatile trap charge storage portions, wherein the integrated device is connected between a high bias, a low bias and an output. The output is formed by a diffusion connecting to the channel directly under the word gate portion. The program state of the two storage portions determines whether the high bias or the low bias is coupled to a logic interconnect transistor connected to the output diffusion.
摘要:
A fast low voltage ballistic program, ultra-short channel, ultra-high density, dual-bit multi-level flash memory is described. The structure and operation of this invention is enabled by a twin MONOS cell structure having an ultra-short control gate channel of less than 40 nm, with ballistic injection which provides high electron injection efficiency and very fast program at low program voltages of 3˜5V. The ballistic MONOS memory cell is arranged in the following array: each memory cell contains two nitride regions for one word gate, and ½ a source diffusion and ½ a bit diffusion. Control gates can be defined separately or shared together over the same diffusion. Diffusions are shared between cells and run in parallel to the side wall control gates, and perpendicular to the word line.
摘要:
In the present invention a new method for program and program verify is described. The threshold voltage of the memory cell is shifted up and then measured with minimal charging and discharging of the bit lines and control gate lines. Bit line to control gate line capacitance is also used to reduce the number of voltage references needed. Program current is reduced by use of a load device coupled to the source diffusion. The result is increased program bandwidth with lower high voltage charge pump current consumption.
摘要:
In the present invention a new method for program and program verify is described. The threshold voltage of the memory cell is shifted up and then measured with minimal charging and discharging of the bit lines and control gate lines. Bit line to control gate line capacitance is also used to reduce the number of voltage references needed. Program current is reduced by use of a load device coupled to the source diffusion. The result is increased program bandwidth with lower high voltage charge pump current consumption.
摘要:
A fast program, ultra-high density, dual-bit, multi-level flash memory process, which can be applied to a ballistic step split gate side wall transistor, or to a ballistic planar split gate side wall transistor, which enables low voltage requirement on the floating gate during erase is described. Two side wall floating gates are paired with a single word line select gate, and word lines are arranged to be perpendicular to both the bit lines and control gate lines. Adjacent memory cells on the same word line share bitline diffusion as well as a third poly control gate. Control gates allow erase access to the individual floating gate.
摘要:
Methods of complementary pairing of memory cells are described. These methods include two physical memory cells in a complementary pair, a complementary pair of reference cells for each erase block, and a physical complementary pair storing multiple data bits.
摘要:
A reference circuit is described for creating a reference signal using a twin MONOS memory cell. A first portion of the twin MONOS memory cell connects to a charged and floating bit line a current source formed in a second portion of the twin MONOS cell that discharges the charged bit line to form a reference signal for a sense amplifier. The sense amplifier compares the reference signal to a signal from a selected memory cell upon which memory operations are being performed comprising read, erase verify and program verify.
摘要:
A nonvolatile memory device is achieved. The device comprises a string of MONOS cells connected drain to source. Each MONOS cell comprises a wordline gate overlying a channel region in a substrate. First and second control gates each overlying a channel region in the substrate. The wordline gate channel region is laterally between first and second control gate channel regions. An ONO layer is vertically between the control gates and the substrate. The nitride layer of the ONO layer forms a charge storage site for each control gate. First and second doped regions, forming a source and a drain, are in the substrate. The wordline gate channel region and the control gate channel regions are between the first doped region and the second doped region. First and second transistors connect the topmost MONOS cell to a first bit line and the bottom most MONOS cell to a second bit line.