公开(公告)号：US20230317436A1

公开(公告)日：2023-10-05

申请号：US18192304

申请日：2023-03-29

Applicant: Semes Co., Ltd.

Inventor： Dukhyun Son ,  Jihun Kim ,  Yeonghun Wi

IPC: H01J37/32 ,  H01L21/687 ,  H01L21/683

CPC classification number: H01J37/32807 ,  H01L21/68742 ,  H01J37/32715 ,  H01L21/68721 ,  H01J37/32642 ,  H01L21/6831 ,  H01J2237/3343 ,  H01J2237/024 ,  H01J2237/2007

Abstract: The disclosure provides a substrate processing apparatus including an electrostatic chuck disposed on a base to support a substrate, a focus ring disposed on the base to surround an outer circumference of the electrostatic chuck, and a lift pin configured to lift the focus ring, wherein the focus ring includes a lower ring and an upper ring disposed on the lower ring, the upper ring and/or the lower ring are configured to be simultaneously lifted according to a height of the lift pin, the lower ring includes an insertion groove, the upper ring includes a main body unit, a first protrusion extending downward from the main body unit and inserted into the insertion groove of the lower ring, and a second protrusion extending downward from the main body unit, contacting an outer circumference of the lower ring, and directly contacting the lift pin.