SUBSTRATE PROCESSING APPARATUS
    1.
    发明公开

    公开(公告)号:US20230317436A1

    公开(公告)日:2023-10-05

    申请号:US18192304

    申请日:2023-03-29

    Abstract: The disclosure provides a substrate processing apparatus including an electrostatic chuck disposed on a base to support a substrate, a focus ring disposed on the base to surround an outer circumference of the electrostatic chuck, and a lift pin configured to lift the focus ring, wherein the focus ring includes a lower ring and an upper ring disposed on the lower ring, the upper ring and/or the lower ring are configured to be simultaneously lifted according to a height of the lift pin, the lower ring includes an insertion groove, the upper ring includes a main body unit, a first protrusion extending downward from the main body unit and inserted into the insertion groove of the lower ring, and a second protrusion extending downward from the main body unit, contacting an outer circumference of the lower ring, and directly contacting the lift pin.

    Focus ring and apparatus for processing a substrate including a focus ring

    公开(公告)号:US12094692B2

    公开(公告)日:2024-09-17

    申请号:US17455501

    申请日:2021-11-18

    CPC classification number: H01J37/32642 H01J2237/334

    Abstract: An apparatus for processing a substrate may include a processing module including at least one process chamber for performing a desired process on a substrate and an index module transferring the substrate into the processing module from an outside. The at least one process chamber may include a housing providing a process space therein, a supporting unit disposed in the housing to support a substrate, the supporting unit including a focus ring having a plurality of rings, a gas supply unit providing a process gas into the process space, and a plasma generating unit generating a plasma from the process gas in the process space. The focus ring may include a stepped structure having a plurality of stepped portions downwardly provided toward the substrate.

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