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公开(公告)号:US20230317436A1
公开(公告)日:2023-10-05
申请号:US18192304
申请日:2023-03-29
Applicant: Semes Co., Ltd.
Inventor: Dukhyun Son , Jihun Kim , Yeonghun Wi
IPC: H01J37/32 , H01L21/687 , H01L21/683
CPC classification number: H01J37/32807 , H01L21/68742 , H01J37/32715 , H01L21/68721 , H01J37/32642 , H01L21/6831 , H01J2237/3343 , H01J2237/024 , H01J2237/2007
Abstract: The disclosure provides a substrate processing apparatus including an electrostatic chuck disposed on a base to support a substrate, a focus ring disposed on the base to surround an outer circumference of the electrostatic chuck, and a lift pin configured to lift the focus ring, wherein the focus ring includes a lower ring and an upper ring disposed on the lower ring, the upper ring and/or the lower ring are configured to be simultaneously lifted according to a height of the lift pin, the lower ring includes an insertion groove, the upper ring includes a main body unit, a first protrusion extending downward from the main body unit and inserted into the insertion groove of the lower ring, and a second protrusion extending downward from the main body unit, contacting an outer circumference of the lower ring, and directly contacting the lift pin.
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公开(公告)号:US12094692B2
公开(公告)日:2024-09-17
申请号:US17455501
申请日:2021-11-18
Applicant: Semes Co., Ltd.
Inventor: Jinhyeok Kim , Dongmok Lee , Yeonghun Wi , Yonghyun Ham , Yeonggyo Jeong
IPC: H01J37/32
CPC classification number: H01J37/32642 , H01J2237/334
Abstract: An apparatus for processing a substrate may include a processing module including at least one process chamber for performing a desired process on a substrate and an index module transferring the substrate into the processing module from an outside. The at least one process chamber may include a housing providing a process space therein, a supporting unit disposed in the housing to support a substrate, the supporting unit including a focus ring having a plurality of rings, a gas supply unit providing a process gas into the process space, and a plasma generating unit generating a plasma from the process gas in the process space. The focus ring may include a stepped structure having a plurality of stepped portions downwardly provided toward the substrate.
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