公开(公告)号：US20240178323A1

公开(公告)日：2024-05-30

申请号：US18433864

申请日：2024-02-06

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Kenichi OKAZAKI ,  Toshinari SASAKI ,  Shuhei YOKOYAMA ,  Takashi HAMOCHI

IPC: H01L29/786 ,  H01L21/02 ,  H01L21/385 ,  H01L23/31 ,  H01L29/04 ,  H01L29/24 ,  H01L29/45 ,  H01L29/49 ,  H01L29/66

CPC classification number: H01L29/7869 ,  H01L21/02112 ,  H01L21/02274 ,  H01L21/385 ,  H01L23/3171 ,  H01L29/045 ,  H01L29/24 ,  H01L29/45 ,  H01L29/4908 ,  H01L29/4966 ,  H01L29/66742 ,  H01L29/66969 ,  H01L29/78606 ,  H01L29/78648 ,  H01L29/78696

Abstract: In a semiconductor device including a transistor including an oxide semiconductor film and a protective film over the transistor, an oxide insulating film containing oxygen in excess of the stoichiometric composition is formed as the protective film under the following conditions: a substrate placed in a treatment chamber evacuated to a vacuum level is held at a temperature higher than or equal to 180° C. and lower than or equal to 260° C.; a source gas is introduced into the treatment chamber so that the pressure in the treatment chamber is set to be higher than or equal to 100 Pa and lower than or equal to 250 Pa; and a high-frequency power higher than or equal to 0.17 W/cm2 and lower than or equal to 0.5 W/cm2 is supplied to an electrode provided in the treatment chamber.

公开(公告)号：US20230006064A1

公开(公告)日：2023-01-05

申请号：US17900955

申请日：2022-09-01

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Kenichi OKAZAKI ,  Toshinari SASAKI ,  Shuhei YOKOYAMA ,  Takashi HAMOCHI

IPC: H01L29/786 ,  H01L29/66 ,  H01L21/02 ,  H01L29/24 ,  H01L29/49 ,  H01L21/385 ,  H01L23/31 ,  H01L29/04 ,  H01L29/45

Abstract: In a semiconductor device including a transistor including an oxide semiconductor film and a protective film over the transistor, an oxide insulating film containing oxygen in excess of the stoichiometric composition is formed as the protective film under the following conditions: a substrate placed in a treatment chamber evacuated to a vacuum level is held at a temperature higher than or equal to 180° C. and lower than or equal to 260° C.; a source gas is introduced into the treatment chamber so that the pressure in the treatment chamber is set to be higher than or equal to 100 Pa and lower than or equal to 250 Pa; and a high-frequency power higher than or equal to 0.17 W/cm2 and lower than or equal to 0.5 W/cm2 is supplied to an electrode provided in the treatment chamber.

公开(公告)号：US20160027924A1

公开(公告)日：2016-01-28

申请号：US14875101

申请日：2015-10-05

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Toshinari SASAKI ,  Hiroshi KANEMURA ,  Yasuharu HOSAKA ,  Shuhei YOKOYAMA ,  Toshimitsu OBONAI

IPC: H01L29/786

CPC classification number: H01L29/7869 ,  G01R31/2656 ,  G09G3/006 ,  G09G3/3225 ,  G09G3/3648 ,  H01L27/14678 ,  H01L27/14692 ,  H01L29/22

Abstract: A semiconductor layer with a low density of trap states is provided. A transistor with stable electrical characteristics is provided. A transistor having high field-effect mobility is provided. A semiconductor device including the transistor is provided. A method for evaluating a semiconductor layer is provided. A method for evaluating a transistor is provided. A method for evaluating a semiconductor device is provided. Provided is, for example, a semiconductor layer with a low defect density which can be used for a channel formation region of a transistor, a transistor including a semiconductor layer with a low defect density in a channel formation region, or a semiconductor device including the transistor.

Abstract translation: 提供了具有低密度陷阱状态的半导体层。 提供具有稳定电特性的晶体管。 提供具有高场效应迁移率的晶体管。 提供包括晶体管的半导体器件。 提供了一种用于评估半导体层的方法。 提供了一种用于评估晶体管的方法。 提供了一种用于评估半导体器件的方法。 例如，提供了可以用于晶体管的沟道形成区域的具有低缺陷密度的半导体层，在沟道形成区域中包括具有低缺陷密度的半导体层的晶体管，或包括晶体管的半导体器件 晶体管。

公开(公告)号：US20130264563A1

公开(公告)日：2013-10-10

申请号：US13795770

申请日：2013-03-12

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Kenichi OKAZAKI ,  Toshinari SASAKI ,  Shuhei YOKOYAMA ,  Takashi HAMOCHI

IPC: H01L29/66 ,  H01L29/786

CPC classification number: H01L29/7869 ,  H01L21/02112 ,  H01L21/02274 ,  H01L21/385 ,  H01L23/3171 ,  H01L29/045 ,  H01L29/24 ,  H01L29/45 ,  H01L29/4908 ,  H01L29/4966 ,  H01L29/66742 ,  H01L29/66969 ,  H01L29/78606 ,  H01L29/78648 ,  H01L29/78696

Abstract: In a semiconductor device including a transistor including an oxide semiconductor film and a protective film over the transistor, an oxide insulating film containing oxygen in excess of the stoichiometric composition is formed as the protective film under the following conditions: a substrate placed in a treatment chamber evacuated to a vacuum level is held at a temperature higher than or equal to 180° C. and lower than or equal to 260° C.; a source gas is introduced into the treatment chamber so that the pressure in the treatment chamber is set to be higher than or equal to 100 Pa and lower than or equal to 250 Pa; and a high-frequency power higher than or equal to 0.17 W/cm2 and lower than or equal to 0.5 W/cm2 is supplied to an electrode provided in the treatment chamber.

公开(公告)号：US20150072535A1

公开(公告)日：2015-03-12

申请号：US14543287

申请日：2014-11-17

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Kenichi OKAZAKI ,  Toshinari SASAKI ,  Shuhei YOKOYAMA ,  Takashi HAMOCHI

IPC: H01L21/02 ,  H01L29/66

CPC classification number: H01L29/7869 ,  H01L21/02112 ,  H01L21/02274 ,  H01L21/385 ,  H01L23/3171 ,  H01L29/045 ,  H01L29/24 ,  H01L29/45 ,  H01L29/4908 ,  H01L29/4966 ,  H01L29/66742 ,  H01L29/66969 ,  H01L29/78606 ,  H01L29/78648 ,  H01L29/78696

Abstract: In a semiconductor device including a transistor including an oxide semiconductor film and a protective film over the transistor, an oxide insulating film containing oxygen in excess of the stoichiometric composition is formed as the protective film under the following conditions: a substrate placed in a treatment chamber evacuated to a vacuum level is held at a temperature higher than or equal to 180° C. and lower than or equal to 260° C.; a source gas is introduced into the treatment chamber so that the pressure in the treatment chamber is set to be higher than or equal to 100 Pa and lower than or equal to 250 Pa; and a high-frequency power higher than or equal to 0.17 W/cm2 and lower than or equal to 0.5 W/cm2 is supplied to an electrode provided in the treatment chamber.

Abstract translation: 在包括晶体管上的包括氧化物半导体膜和保护膜的晶体管的半导体器件中，在以下条件下形成含有超过化学计量组成的氧的氧化物绝缘膜作为保护膜：放置在处理室中的衬底 抽真空至真空度保持在高于或等于180℃且低于或等于260℃的温度; 将源气体引入处理室，使得处理室中的压力设定为高于或等于100Pa且小于或等于250Pa; 并且将高于或等于0.17W / cm 2且低于或等于0.5W / cm 2的高频功率供应到设置在处理室中的电极。

公开(公告)号：US20130153892A1

公开(公告)日：2013-06-20

申请号：US13713186

申请日：2012-12-13

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Toshinari SASAKI ,  Shuhei YOKOYAMA ,  Takashi HAMOCHI ,  Shunpei YAMAZAKI

IPC: H01L29/786 ,  H01L29/66

CPC classification number: H01L29/7869 ,  H01L29/66969

Abstract: A highly reliable semiconductor device that includes a transistor including an oxide semiconductor is provided. In a semiconductor device which includes a bottom-gate transistor including an oxide semiconductor film, the spin density of the oxide semiconductor film is lower than or equal to 1×1018 spins/cm3, preferably lower than or equal to 1×1017 spins/cm3, further preferably lower than or equal to 1×1016 spins/cm3. The conductivity of the oxide semiconductor film is lower than or equal to 1×103 S/cm, preferably lower than or equal to 1×102 S/cm, further preferably lower than or equal to 1×101 S/cm.

Abstract translation: 提供了包括具有氧化物半导体的晶体管的高度可靠的半导体器件。 在包括具有氧化物半导体膜的底栅晶体管的半导体器件中，氧化物半导体膜的自旋密度低于或等于1×1018自旋/ cm3，优选低于或等于1×1017自旋/ cm3 ，进一步优选小于或等于1×1016自旋/ cm3。 氧化物半导体膜的导电率小于或等于1×10 3 S / cm，优选为1×102S / cm以下，进一步优选为1×101S / cm以下。

公开(公告)号：US20130285045A1

公开(公告)日：2013-10-31

申请号：US13862716

申请日：2013-04-15

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Toshinari SASAKI ,  Shuhei YOKOYAMA ,  Takashi HAMOCHI ,  Yusuke NONAKA ,  Yasuharu HOSAKA

IPC: H01L29/786

CPC classification number: H01L29/7869 ,  H01L27/1225

Abstract: A method for evaluating an oxide semiconductor film, a method for evaluating a transistor including an oxide semiconductor film, a transistor which includes an oxide semiconductor film and has favorable switching characteristics, and an oxide semiconductor film which is applicable to a transistor and enables the transistor to have favorable switching characteristics are provided. A PL spectrum of an oxide semiconductor film obtained by low-temperature PL spectroscopy has a first curve whose local maximum value is found in a range of 1.6 eV or more and 1.8 eV or less and a second curve whose local maximum value is found in a range of 1.7 eV or more and 2.4 eV or less. A value obtained by dividing the area of the second curve by the sum of the area of the first curve and the area of the second curve is 0.1 or more and less than 1.

Abstract translation: 一种用于评估氧化物半导体膜的方法，包括氧化物半导体膜的晶体管的评估方法，包括氧化物半导体膜并且具有良好的开关特性的晶体管，以及可应用于晶体管并使晶体管能够实现的氧化物半导体膜 具有良好的开关特性。 通过低温PL光谱获得的氧化物半导体膜的PL光谱具有第一曲线，其局部最大值在1.6eV以上至1.8eV以下的范围内，第二曲线的局部最大值位于 范围为1.7eV以上且2.4eV以下。 通过将第二曲线的面积除以第一曲线的面积和第二曲线的面积之和而得到的值为0.1以上且小于1。

公开(公告)号：US20170125601A1

公开(公告)日：2017-05-04

申请号：US15401460

申请日：2017-01-09

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Kenichi OKAZAKI ,  Toshinari SASAKI ,  Shuhei YOKOYAMA ,  Takashi HAMOCHI

IPC: H01L29/786 ,  H01L29/24 ,  H01L23/31 ,  H01L29/66 ,  H01L21/385 ,  H01L29/04 ,  H01L29/45

CPC classification number: H01L29/7869 ,  H01L21/02112 ,  H01L21/02274 ,  H01L21/385 ,  H01L23/3171 ,  H01L29/045 ,  H01L29/24 ,  H01L29/45 ,  H01L29/4908 ,  H01L29/4966 ,  H01L29/66742 ,  H01L29/66969 ,  H01L29/78606 ,  H01L29/78648 ,  H01L29/78696

Abstract: In a semiconductor device including a transistor including an oxide semiconductor film and a protective film over the transistor, an oxide insulating film containing oxygen in excess of the stoichiometric composition is formed as the protective film under the following conditions: a substrate placed in a treatment chamber evacuated to a vacuum level is held at a temperature higher than or equal to 180° C. and lower than or equal to 260° C.; a source gas is introduced into the treatment chamber so that the pressure in the treatment chamber is set to be higher than or equal to 100 Pa and lower than or equal to 250 Pa; and a high-frequency power higher than or equal to 0.17 W/cm2 and lower than or equal to 0.5 W/cm2 is supplied to an electrode provided in the treatment chamber.

公开(公告)号：US20160197194A1

公开(公告)日：2016-07-07

申请号：US15071700

申请日：2016-03-16

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Kenichi OKAZAKI ,  Toshinari SASAKI ,  Shuhei YOKOYAMA ,  Takashi HAMOCHI

IPC: H01L29/786 ,  H01L29/49 ,  H01L29/24

CPC classification number: H01L29/7869 ,  H01L21/02112 ,  H01L21/02274 ,  H01L21/385 ,  H01L23/3171 ,  H01L29/045 ,  H01L29/24 ,  H01L29/45 ,  H01L29/4908 ,  H01L29/4966 ,  H01L29/66742 ,  H01L29/66969 ,  H01L29/78606 ,  H01L29/78648 ,  H01L29/78696

Abstract: In a semiconductor device including a transistor including an oxide semiconductor film and a protective film over the transistor, an oxide insulating film containing oxygen in excess of the stoichiometric composition is formed as the protective film under the following conditions: a substrate placed in a treatment chamber evacuated to a vacuum level is held at a temperature higher than or equal to 180° C. and lower than or equal to 260° C.; a source gas is introduced into the treatment chamber so that the pressure in the treatment chamber is set to be higher than or equal to 100 Pa and lower than or equal to 250 Pa; and a high-frequency power higher than or equal to 0.17 W/cm2 and lower than or equal to 0.5 W/cm2 is supplied to an electrode provided in the treatment chamber.