Elastic averaging coupling
    1.
    发明授权

    公开(公告)号:US11808999B2

    公开(公告)日:2023-11-07

    申请号:US17985815

    申请日:2022-11-11

    CPC classification number: G02B6/423 G02B6/30 G02B6/4214 G02B6/4243

    Abstract: A passive optical alignment coupling between an optical connector having a first two-dimensional planar array of alignment features and a foundation having a second two-dimensional planar array of alignment features. One of the arrays is a network of orthogonally intersecting longitudinal grooves defining an array of discrete protrusions that are each in a generally pyramidal shape with a truncated top separated from one another by the orthogonally intersecting longitudinal grooves, and the other array is a network of longitudinal cylindrical protrusions. The cylindrical protrusions are received in the grooves, with protrusion surfaces of the cylindrical protrusions in contact with groove surfaces and the top of the discrete protrusions contacting the surface bound by the cylindrical protrusions. The optical connector is removably attachable to the foundation to define a demountable coupling, with the first array of alignment features against the second array of alignment features to define an elastic averaging coupling.

    Optical bench subassembly having integrated photonic device

    公开(公告)号:US11803020B2

    公开(公告)日:2023-10-31

    申请号:US16999021

    申请日:2020-08-20

    Abstract: An optical bench subassembly including an integrated photonic device. Optical alignment of the photonic device with the optical bench can be performed outside of an optoelectronic package assembly before attaching thereto. The photonic device is attached to a base of the optical bench, with its optical input/output in optical alignment with the optical output/input of the optical bench. The optical bench supports an array of optical fibers in precise relationship to a structured reflective surface. The photonic device is mounted on a submount to be attached to the optical bench. The photonic device may be actively or passively aligned with the optical bench. After achieving optical alignment, the submount of the photonic device is fixedly attached to the base of the optical bench. The optical bench subassembly may be structured to be hermetically sealed as a hermetic feedthrough, to be hermetically attached to a hermetic optoelectronic package.

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