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    Chip-to-Chip Optical Data Communication System
    1.
    发明公开
    Chip-to-Chip Optical Data Communication System 审中-公开

    公开(公告)号：US20240310589A1

    公开(公告)日：2024-09-19

    申请号：US18675112

    申请日：2024-05-27

    申请人： Ayar Labs, Inc.

    发明人： Alexandra Wright ,  Mark Wade ,  Chen Sun ,  Vladimir Stojanovic ,  Rajeev Ram ,  Milos Popovic ,  Roy Edward Meade ,  Derek Van Orden

    IPC分类号： G02B6/42 ,  G02B6/293

    CPC分类号： G02B6/4202 ,  G02B6/2934 ,  G02B6/4216 ,  G02B6/4219 ,  G02B6/4287

    摘要： An optical input/output chiplet is disposed on a first package substrate. The optical input/output chiplet includes one or more supply optical ports for receiving continuous wave light. The optical input/output chiplet includes one or more transmit optical ports through which modulated light is transmitted. The optical input/output chiplet includes one or more receive optical ports through which modulated light is received by the optical input/output chiplet. An optical power supply module is disposed on a second package substrate. The second package substrate is separate from the first package substrate. The optical power supply module includes one or more output optical ports through which continuous wave laser light is transmitted. A set of optical fibers optically connect the one or more output optical ports of the optical power supply module to the one or more supply optical ports of the optical input/output chiplet.

    Integrated Freeform Optical Couplers And Fabrication Methods Thereof
    2.
    发明公开
    Integrated Freeform Optical Couplers And Fabrication Methods Thereof 审中-公开

    公开(公告)号：US20230393357A1

    公开(公告)日：2023-12-07

    申请号：US18329059

    申请日：2023-06-05

    申请人： Massachusetts Institute of Technology

    发明人： Luigi Ranno ,  Tian GU ,  Juejun Hu

    IPC分类号： G02B6/43 ,  G02B6/42

    CPC分类号： G02B6/43 ,  G02B6/4219

    摘要： The present technology is related to optics and optical systems, particularly to photonic packaging, optical coupling, optical interconnects, micro-optics, and their fabrication. The present technology includes free-form micro-optical coupler architectures and systems with superb optical performance and a high-throughput method of fabricating large-area coupler arrays for scalable manufacturing. Embodiments include chip-to-fiber-array, chip-to-chip, chip-to-interposer, and chip-to-free-space couplers for applications including photonic packaging, optical communications, LiDAR, optical trapping and manipulation, augmented reality, virtual reality, and sensing.

    Optical fiber positioner and method for manufacturing same
    8.
    发明授权
    Optical fiber positioner and method for manufacturing same 有权

    公开(公告)号：US09632254B2

    公开(公告)日：2017-04-25

    申请号：US14819621

    申请日：2015-08-06

    申请人： U.S. Army Research Laboratory

    发明人： Leonid A. Beresnev

    IPC分类号： G02B6/26 ,  G02B6/36 ,  G02B6/35

    CPC分类号： G02B6/3616 ,  G02B6/3508 ,  G02B6/3578 ,  G02B6/4219 ,  G02B6/422 ,  G02B26/103

    摘要： An optical fiber positioner having an elongated base with sidewalls and a longitudinally extending throughbore. A flexible optical fiber extends through the throughbore and has one end protruding outwardly from an end surface of the base. A plurality of actuators are secured to the sidewalls of the base so that an end of each actuator is positioned adjacent the end of the base. A crossbeam is then connected to the ends of each actuator so that the crossbeam moves laterally relative to the base in unison with the deflection of the actuators. The crossbeam has an opening through which the optical fiber extends so that the optical fiber deflects in unison with the lateral movement of the crossbeam. Various fixtures for assembly of the optical fiber positioner are also shown.

    OPTICAL AND THERMAL INTERFACE FOR PHOTONIC INTEGRATED CIRCUITS
    9.
    发明申请
    OPTICAL AND THERMAL INTERFACE FOR PHOTONIC INTEGRATED CIRCUITS 有权
    光电集成电路的光学和热接口

    公开(公告)号：US20170031112A1

    公开(公告)日：2017-02-02

    申请号：US15230631

    申请日：2016-08-08

    申请人： Aurrion, Inc.

    发明人： Gregory Alan Fish ,  Brian R. Koch

    IPC分类号： G02B6/42 ,  G02B6/136 ,  G02B6/12 ,  G02B6/122

    CPC分类号： G02B6/4224 ,  G02B6/12004 ,  G02B6/1221 ,  G02B6/132 ,  G02B6/136 ,  G02B6/4204 ,  G02B6/4219 ,  G02B6/4232 ,  G02B6/4269 ,  G02B6/428 ,  Y10T29/49117

    摘要： Described herein are photonic systems and devices including a optical interface unit disposed on a bottom side of a photonic integrated circuit (PIC) to receive light from an emitter of the PIC. A top side of the PIC includes a flip-chip interface for electrically coupling the PIC to an organic substrate via the top side. An alignment feature corresponding to the emitter is formed with the emitter to be offset by a predetermined distance value; because the emitter and the alignment feature are formed using a shared processing operation, the offset (i.e., predetermined distance value) may be precise and consistent across similarly produced PICs. The PIC comprises a processing feature to image the alignment feature from the bottom side (e.g., a hole). A heat spreader layer surrounds the optical interface unit and is disposed on the bottom side of the PIC to spread heat from the PIC.

    摘要翻译： 这里描述的是光子系统和设备，其包括设置在光子集成电路（PIC）的底侧上的光接口单元，用于接收来自PIC的发射极的光。 PIC的顶侧包括用于通过顶侧将PIC电耦合到有机衬底的倒装芯片接口。 形成与发射极相对应的对准特征，发射极偏移预定的距离值; 因为发射器和对准特征是使用共享处理操作形成的，因此偏移量（即，预定距离值）可以在类似产生的PIC之间精确和一致。 PIC包括从底侧（例如，孔）成像对准特征的处理特征。 散热器层围绕光学接口单元并且设置在PIC的底部以散布来自PIC的热量。