公开(公告)号：US09640745B2

公开(公告)日：2017-05-02

申请号：US14648805

申请日：2013-12-02

申请人： Seoul Semiconductor Co., Ltd.

发明人： Yu Dae Han ,  Ki Bum Nam ,  Jung Doo Kim ,  Sung Soo Kim

IPC分类号： H01L33/64 ,  H01L33/58 ,  H01L33/62 ,  H01L25/075 ,  H01L33/48

CPC分类号： H01L33/648 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H01L33/641 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light emitting diode includes: at least one light emitting chip; a substrate including lead frames electrically connected to electrodes of the at least one light emitting chip; a lens disposed on the substrate and enclosing the at least one light emitting chip; and an oil disposed in the lens and the substrate.