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公开(公告)号：US09411089B2
公开(公告)日：2016-08-09
申请号：US14472542
申请日：2014-08-29
发明人： Ki Bum Nam , Yu Dae Han , Chung Hoon Lee
IPC分类号： F21V8/00 , H01L33/20 , H01L33/46 , F21Y101/02 , H01L33/50
CPC分类号： G02B6/0031 , F21Y2101/00 , F21Y2115/10 , G02B6/0073 , G02B6/0083 , H01L33/20 , H01L33/46 , H01L33/505 , H01L2224/14
摘要： A light source module includes a circuit board, board pads disposed on the circuit board, and a light emitting diode chip disposed on the board pads. The light emitting diode chip includes a substrate and a semiconductor stacking part disposed between the substrate and the circuit board, and the substrate includes an inclined part disposed at an upper portion thereof and a discharging part disposed at one side surface thereof.
摘要翻译： 光源模块包括电路板，设置在电路板上的板焊盘和设置在板焊盘上的发光二极管芯片。 发光二极管芯片包括基板和布置在基板和电路板之间的半导体堆叠部分，并且基板包括设置在其上部的倾斜部分和设置在其一个侧表面处的排出部分。
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2.发明申请LIGHT SOURCE MODULE, FABRICATION METHOD THEREFOR, AND BACKLIGHT UNIT INCLUDING THE SAME 审中-公开光源模块，其制造方法和包括其的背光单元公开(公告)号：US20150085527A1
公开(公告)日：2015-03-26
申请号：US14498086
申请日：2014-09-26
发明人： Ki Bum Nam , Seoung Ho Jung , Yu Dae Han , Chung Hoon Lee , Hyuck Jung Choi
CPC分类号： H01L33/60 , G02B6/0073 , G02F1/133615 , H01L33/46 , H01L33/486 , H01L33/50 , H01L33/504 , H01L33/505 , H01L33/56 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2933/0033 , H01L2933/0041 , H01L2933/0058 , H01L2924/00
摘要： A light source module, a fabrication method therefore, and a slim backlight unit including the same. The light source module includes a light emitting diode (LED) chip electrically connected to a substrate through a lower surface thereof, a wavelength conversion layer formed on the LED chip and enclosing at least the light exit face of the LED chip, and a reflector formed on a region of the LED chip excluding the light exit face.
摘要翻译： 因此，光源模块，制造方法以及包括该光源模块的薄型背光单元。 光源模块包括通过其下表面电连接到衬底的发光二极管（LED）芯片，形成在LED芯片上并且至少包围LED芯片的光出射面的波长转换层，以及形成的反射器 在除了光出射面之外的LED芯片的区域上。
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公开(公告)号：US09640745B2
公开(公告)日：2017-05-02
申请号：US14648805
申请日：2013-12-02
发明人： Yu Dae Han , Ki Bum Nam , Jung Doo Kim , Sung Soo Kim
IPC分类号： H01L33/64 , H01L33/58 , H01L33/62 , H01L25/075 , H01L33/48
CPC分类号： H01L33/648 , H01L25/0753 , H01L33/486 , H01L33/58 , H01L33/62 , H01L33/641 , H01L2924/0002 , H01L2924/00
摘要： A light emitting diode includes: at least one light emitting chip; a substrate including lead frames electrically connected to electrodes of the at least one light emitting chip; a lens disposed on the substrate and enclosing the at least one light emitting chip; and an oil disposed in the lens and the substrate.
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4.发明授权公开(公告)号：US09570424B2
公开(公告)日：2017-02-14
申请号：US14471215
申请日：2014-08-28
发明人： Ki Bum Nam , Yu Dae Han
IPC分类号： H01L33/50 , H01L33/60 , H01L25/075 , H01L33/62
CPC分类号： H01L25/0753 , H01L33/505 , H01L33/60 , H01L33/62 , H01L2224/16225
摘要： A light source module includes a circuit board, light emitting diode chips mounted on the circuit board by flip-chip bonding or a surface mounting technology (SMT), and a diffusor covering the circuit board and the light emitting diode chips.
摘要翻译： 光源模块包括电路板，通过倒装芯片接合安装在电路板上的发光二极管芯片或表面安装技术（SMT），以及覆盖电路板和发光二极管芯片的漫射器。
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公开(公告)号：US20140362603A1
公开(公告)日：2014-12-11
申请号：US14274293
申请日：2014-05-09
发明人： Young Jun SONG , Seoung Ho Jung , Da Hye Kim , Ki Bum Nam , Yu Dae Han , Chung Hoon Lee
CPC分类号： H01L33/505 , G02B6/0073 , G02F2001/133614 , H01L33/60
摘要： Disclosed is a light source module capable of realizing a slim structure and providing excellent luminous efficiency. The light source module includes a circuit board, a light emitting diode chip mounted on the circuit board by flip-chip bonding or surface mount technology (SMT), a wavelength conversion layer disposed on the light emitting diode chip, and a reflector covering an upper surface and at least one of side surfaces of the light emitting diode chip.
摘要翻译： 公开了一种能够实现纤薄结构并且提供优异的发光效率的光源模块。 光源模块包括电路板，通过倒装芯片接合或表面贴装技术（SMT）安装在电路板上的发光二极管芯片，设置在发光二极管芯片上的波长转换层，以及覆盖上部 表面和发光二极管芯片的至少一个侧表面。
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