公开(公告)号：US20230299243A1

公开(公告)日：2023-09-21

申请号：US18201743

申请日：2023-05-24

Applicant: Seoul Semiconductor Co., Ltd.

Inventor： Jong Min LEE ,  Bang Hyun KIM ,  Jae Ho LEE

IPC: H01L33/50 ,  H01L25/075 ,  H01L33/48 ,  H01L33/60

CPC classification number: H01L33/504 ,  H01L25/0753 ,  H01L33/483 ,  H01L33/60

Abstract: A light emitting module including a substrate, a first light emitter and a second light emitter disposed on the substrate and spaced apart from each other, an isolation layer disposed between the first and second light emitters, and a light diffusion layer and a wavelength converter disposed on the first and second light emitters, in which the first and second light emitters include first and second light emitting regions spaced apart from each other, respectively, the wavelength converter includes a first wavelength conversion layer covering the second light emitting region, and a second wavelength conversion layer covering the first light emitting region, the light diffusion layer covers an upper surface of the first and second wavelength conversion layers, and a region between the first and second wavelength conversion layers has an area vertically overlapped with the isolation layer.

公开(公告)号：US20200066944A1

公开(公告)日：2020-02-27

申请号：US16498818

申请日：2018-03-19

Applicant: Seoul Semiconductor Co. Ltd.

Inventor： Jong Min LEE ,  Bang Hyun KIM ,  Jae Ho LEE

IPC: H01L33/50 ,  H01L25/075 ,  H01L33/60 ,  H01L33/48

Abstract: A light emitting module including a base substrate, a first light emitting diode disposed on the base substrate, and a second light emitting diode disposed on the base substrate and spaced apart from the first light emitting diode, in which each of the first light emitting diode and the second light emitting diode includes a first light emitting region and a second light emitting region, the second light emitting region being spaced apart from the first light emitting region and surrounding the first light emitting region.

公开(公告)号：US20230369548A1

公开(公告)日：2023-11-16

申请号：US18358435

申请日：2023-07-25

Applicant: Seoul Semiconductor Co., Ltd.

Inventor： Jong Min LEE ,  Bang Hyun KIM ,  Jae Ho LEE

IPC: H01L33/50 ,  H01L25/075 ,  H01L33/48 ,  H01L33/60

CPC classification number: H01L33/504 ,  H01L25/0753 ,  H01L33/483 ,  H01L33/60

Abstract: A light emitting module including a substrate, a first light emitter and a second light emitter disposed on the substrate and spaced apart from each other, an isolation layer disposed between the first and second light emitters, and a light diffusion layer and a wavelength converter disposed on the first and second light emitters, in which the first and second light emitters include first and second light emitting regions spaced apart from each other, respectively, the wavelength converter includes a first wavelength conversion layer covering the second light emitting region, and a second wavelength conversion layer covering the first light emitting region, the light diffusion layer covers an upper surface of the first and second wavelength conversion layers, and a region between the first and second wavelength conversion layers has an area vertically overlapped with the isolation layer.