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    LIGHT EMITTING MODULE
    2.
    发明公开
    LIGHT EMITTING MODULE 审中-公开

    公开(公告)号：US20230299243A1

    公开(公告)日：2023-09-21

    申请号：US18201743

    申请日：2023-05-24

    Applicant: Seoul Semiconductor Co., Ltd.

    Inventor： Jong Min LEE ,  Bang Hyun KIM ,  Jae Ho LEE

    IPC: H01L33/50 ,  H01L25/075 ,  H01L33/48 ,  H01L33/60

    CPC classification number: H01L33/504 ,  H01L25/0753 ,  H01L33/483 ,  H01L33/60

    Abstract: A light emitting module including a substrate, a first light emitter and a second light emitter disposed on the substrate and spaced apart from each other, an isolation layer disposed between the first and second light emitters, and a light diffusion layer and a wavelength converter disposed on the first and second light emitters, in which the first and second light emitters include first and second light emitting regions spaced apart from each other, respectively, the wavelength converter includes a first wavelength conversion layer covering the second light emitting region, and a second wavelength conversion layer covering the first light emitting region, the light diffusion layer covers an upper surface of the first and second wavelength conversion layers, and a region between the first and second wavelength conversion layers has an area vertically overlapped with the isolation layer.

    LIGHT EMITTING MODULE
    4.
    发明申请
    LIGHT EMITTING MODULE 审中-公开

    公开(公告)号：US20200066944A1

    公开(公告)日：2020-02-27

    申请号：US16498818

    申请日：2018-03-19

    Applicant: Seoul Semiconductor Co. Ltd.

    Inventor： Jong Min LEE ,  Bang Hyun KIM ,  Jae Ho LEE

    IPC: H01L33/50 ,  H01L25/075 ,  H01L33/60 ,  H01L33/48

    Abstract: A light emitting module including a base substrate, a first light emitting diode disposed on the base substrate, and a second light emitting diode disposed on the base substrate and spaced apart from the first light emitting diode, in which each of the first light emitting diode and the second light emitting diode includes a first light emitting region and a second light emitting region, the second light emitting region being spaced apart from the first light emitting region and surrounding the first light emitting region.

    LIGHT EMITTING DEVICE
    5.
    发明申请
    LIGHT EMITTING DEVICE 审中-公开
    发光装置

    公开(公告)号：US20160072032A1

    公开(公告)日：2016-03-10

    申请号：US14944881

    申请日：2015-11-18

    Applicant: Seoul Semiconductor Co., Ltd.

    Inventor： Eun Jung SEO ,  Jae Ho CHO ,  Bang Hyun KIM

    IPC: H01L33/62 ,  H01L33/52

    CPC classification number: H01L33/62 ,  H01L33/483 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    Abstract: A light-emitting device includes first and second lead frames spaced apart from each other, the first and second lead frames each comprising a top surface, an opposing bottom surface, and sidewalls arranged between the top surface and the bottom surface thereof, at least one of the first and second lead frames comprise three inset sidewalls that at least partially define a fixing space, the fixing space undercutting at least one of the first lead frame and second lead frame, a light-emitting diode chip arranged on the first surface of the first or second lead frame, a resin part disposed in the fixing space to support the first and second lead frames, and the first and second lead frames exposed to the outside through bottom surface.

    Abstract translation: 发光装置包括彼此间隔开的第一和第二引线框架，第一和第二引线框架各自包括顶表面，相对的底表面和布置在其顶表面和底表面之间的侧壁，至少一个 所述第一和第二引线框架包括至少部分地限定固定空间的三个插入侧壁，所述固定空间底切第一引线框架和第二引线框架中的至少一个，布置在第一引线框架和第二引线框架的第一表面上的发光二极管芯片 第一或第二引线框架，设置在固定空间中以支撑第一引线框架和第二引线框架的树脂部件，以及通过底表面暴露于外部的第一和第二引线框架。

    LIGHT EMITTING DIODE PACKAGE
    6.
    发明申请
    LIGHT EMITTING DIODE PACKAGE 审中-公开
    发光二极管封装

    公开(公告)号：US20140319573A1

    公开(公告)日：2014-10-30

    申请号：US14330518

    申请日：2014-07-14

    Applicant: Seoul Semiconductor Co., Ltd.

    Inventor： Bang Hyun KIM

    IPC: H01L33/62

    CPC classification number: H01L33/642 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/0248 ,  H01L27/15 ,  H01L29/866 ,  H01L33/483 ,  H01L33/486 ,  H01L33/502 ,  H01L33/56 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2933/0033 ,  H01L2924/00014

    Abstract: A light emitting diode (LED) package includes an LED chip, a first lead frame and a second lead frame electrically connected to the LED chip and separated by a space, and a housing disposed on the first lead frame and the second lead frame. The housing includes an external housing surrounding a cavity, the cavity exposing a first portion of the first lead frame and a first portion of the second lead frame, and an internal housing disposed in the space, the internal housing covering a top portion of the first lead frame and a top portion of the second lead frame.

    Abstract translation: 发光二极管（LED）封装包括LED芯片，第一引线框架和电连接到LED芯片并由空间分隔的第二引线框架，以及设置在第一引线框架和第二引线框架上的壳体。 壳体包括围绕空腔的外部壳体，空腔暴露第一引线框架的第一部分和第二引线框架的第一部分，以及设置在该空间中的内部壳体，内部壳体覆盖第一引线框架的顶部 引线框架和第二引线框架的顶部。

    LIGHT EMITTING DIODE AND LIGHT EMITTING MODULE COMPRISING THE SAME
    7.
    发明申请
    LIGHT EMITTING DIODE AND LIGHT EMITTING MODULE COMPRISING THE SAME 有权

    公开(公告)号：US20210242366A1

    公开(公告)日：2021-08-05

    申请号：US17233540

    申请日：2021-04-19

    Applicant: Seoul Semiconductor Co., Ltd.

    Inventor： Bang Hyun KIM ,  Young Hye Seo ,  Jae Ho Lee ,  Jong Min Lee ,  Seoung Ho Jung ,  Eui Sung Jeong

    IPC: H01L33/08 ,  H01L33/60 ,  G02B3/08 ,  H01L33/20 ,  H01L33/50

    Abstract: A light emitting device including a substrate, a light emitting structure disposed on the substrate and having a first light emitting region, a second light emitting region, and a third light emitting region, and an insulation layer to block unintended electrical connection between the first light emitting region and the second light emitting region, or between the second light emitting region and the third light emitting region, in which each of the first light emitting region, the second light emitting region, and the third light emitting region comprises a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer, and a center of the first light emitting region overlaps a center of the second light emitting region and a center of the third light emitting region.

    LIGHT EMITTING MODULE AND LENS
    8.
    发明申请
    LIGHT EMITTING MODULE AND LENS 审中-公开

    公开(公告)号：US20180340672A1

    公开(公告)日：2018-11-29

    申请号：US16052173

    申请日：2018-08-01

    Applicant: Seoul Semiconductor Co., Ltd.

    Inventor： Eun Ju KIM ,  Bang Hyun KIM ,  Young Eun YANG

    IPC: F21V5/04 ,  F21K9/64 ,  H01L33/58 ,  H01L23/31 ,  G02F1/1335 ,  G02B3/04 ,  G02B3/02 ,  F21V5/00

    Abstract: A lens including an upper surface having a curved portion having a changing curvature in a direction extending away from a central axis of the lens, and a lower surface having a concave portion disposed on the central axis of the lens. The concave portion of the lower surface includes an entrance disposed on a lower region of the concave portion and configured to receive light emitted from a light-emitting diode chip, and an upper end surface disposed on an upper region of the concave portion. The concave portion includes a width that narrows in a direction extending away from the entrance. The upper end surface is nonplanar.

    LIGHT EMITTING DEVICE
    10.
    发明申请
    LIGHT EMITTING DEVICE 审中-公开
    发光装置

    公开(公告)号：US20160372647A1

    公开(公告)日：2016-12-22

    申请号：US15252174

    申请日：2016-08-30

    Applicant: Seoul Semiconductor Co., Ltd.

    Inventor： Eun Jung SEO ,  Jae Ho CHO ,  Bang Hyun KIM

    IPC: H01L33/62 ,  H01L33/56 ,  H01L33/48

    CPC classification number: H01L33/62 ,  H01L33/483 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    Abstract: A light-emitting device includes first and second lead frames spaced apart from each other, the first and second lead frames each including a top surface, an opposing bottom surface, and sidewalls arranged between the top surface and the bottom surface thereof, in which at least one of the first and second lead frames include three inset sidewalls that at least partially define a fixing space, the fixing space undercutting at least one of the first lead frame and second lead frame, a light-emitting diode chip disposed on the top surface of the first or second lead frame, and the top surfaces of the first and second lead frames are substantially flat.

    Abstract translation: 发光装置包括彼此间隔开的第一和第二引线框架，第一和第二引线框架各自包括顶表面，相对的底表面和布置在其顶表面和底表面之间的侧壁，其中在 第一引线框架和第二引线框架中的至少一个引线框架包括至少部分地限定固定空间的三个插入侧壁，固定空间底切第一引线框架和第二引线框架中的至少一个，设置在顶表面上的发光二极管芯片 第一引线框架或第二引线框架的顶表面基本上是平坦的。

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