Semiconductor wafer with improved step coverage along scribe lines
    5.
    发明授权
    Semiconductor wafer with improved step coverage along scribe lines 失效
    半导体晶片具有沿划线改善的台阶覆盖

    公开(公告)号:US5300816A

    公开(公告)日:1994-04-05

    申请号:US904613

    申请日:1992-06-26

    摘要: A semiconductor wafer partitioned into a multiplicity of chip areas defined by a grid-like array of scribe lines inscribed into the surface of the wafer, wherein each scribe line is longitudinally bounded by respective field oxide layers formed in the surface of the wafer, to thereby define a scribe line region between adjacent chip areas. The wafer includes a multiplicity of integrated circuits formed in a corresponding multiplicity of the chip areas, respectively, each of the integrated circuits including a patterned, multilayer structure having a peripheral edge portion which extends into a respective one of the scribe line regions, wherein the peripheral edge portion of each multilayer structure has a multi-tiered cross-sectional profile, thereby ensuring adequate step coverage of the photoresist film which is applied to the individual layers of the multilayer structures when they are patterned during the wafer fabrication process.

    摘要翻译: 半导体晶片被划分为由刻划在晶片表面上的划线的格子状阵列限定的多个芯片区域,其中每个划线由在晶片表面形成的相应的场氧化物层纵向界定,从而 定义相邻芯片区域之间的划线区域。 晶片包括分别形成在相应多个芯片区域中的多个集成电路,每个集成电路包括图案化的多层结构,其具有延伸到相应的划线区域中的周边边缘部分,其中, 每个多层结构的周缘部分具有多层横截面轮廓,从而确保在晶片制造过程中图案化时施加到多层结构的各个层的光致抗蚀剂膜的足够的台阶覆盖。