公开(公告)号：US20170194359A1

公开(公告)日：2017-07-06

申请号：US15422546

申请日：2017-02-02

Applicant: Sharp Kabushiki Kaisha

Inventor： Yuichi SAITO ,  Yohsuke KANZAKI ,  Yudai TAKANISHI ,  Tetsuya OKAMOTO ,  Yoshiki NAKATANI ,  Yoshimasa CHIKAMA

IPC: H01L27/12 ,  H01L29/786 ,  H01L21/02 ,  H01L21/4763 ,  H01L21/465 ,  H01L29/24 ,  H01L29/66 ,  H01L29/45

CPC classification number: H01L27/1225 ,  G02F1/133345 ,  G02F1/134336 ,  G02F1/13439 ,  G02F1/136286 ,  G02F1/1368 ,  G02F2001/133302 ,  G02F2001/136231 ,  G02F2001/136236 ,  G02F2001/136295 ,  H01L21/02554 ,  H01L21/02565 ,  H01L21/02631 ,  H01L21/32134 ,  H01L21/44 ,  H01L21/465 ,  H01L21/47635 ,  H01L23/53233 ,  H01L23/53238 ,  H01L27/1222 ,  H01L27/124 ,  H01L27/127 ,  H01L27/1288 ,  H01L29/24 ,  H01L29/45 ,  H01L29/66969 ,  H01L29/7869 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present invention provides a circuit board having excellent productivity, particularly a circuit board having excellent productivity with respect to a semiconductor layer and source layer forming step, a display device, and a process for producing a circuit board. The circuit board of the present invention is a circuit board including an oxide semiconductor layer and an electrode connected to the oxide semiconductor layer, wherein the electrode is formed by essentially laminating a layer made of a metal other than copper and a layer containing copper.