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1.发明授权Managing computational workloads of computing apparatuses powered by renewable resources 有权管理由可再生资源供电的计算设备的计算工作量公开(公告)号：US09348394B2
公开(公告)日：2016-05-24
申请号：US12881187
申请日：2010-09-14
CPC分类号： G06N7/005 , G01W1/10 , G06F1/3206 , G06F1/329 , Y02D10/24
摘要： A method described herein includes an act of receiving data that is indicative of predicted weather conditions for a particular geographic region, wherein the particular geographic region has an energy generation system therein, and wherein the energy generation system utilizes at least one renewable energy resource to generate electrical power. The method also includes the act of scheduling a computational workload for at least one computer in a data center based at least in part upon the data that is indicative of the predicted weather conditions for the particular geographic region.
摘要翻译： 本文描述的方法包括接收指示特定地理区域的预测天气条件的数据的动作，其中特定地理区域具有其中的能量生成系统，并且其中能量产生系统利用至少一个可再生能源来产生 电力。 该方法还包括至少部分地基于指示特定地理区域的预测天气条件的数据来调度数据中心中的至少一个计算机的计算工作负荷的动作。
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公开(公告)号：US07280364B2
公开(公告)日：2007-10-09
申请号：US10996722
申请日：2004-11-24
申请人： Shaun L. Harris , Steven A. Belson , Eric C. Peterson , Gary W. Williams , Christian L. Belady , Jeffrey P. Christenson
发明人： Shaun L. Harris , Steven A. Belson , Eric C. Peterson , Gary W. Williams , Christian L. Belady , Jeffrey P. Christenson
IPC分类号： H05K7/20
CPC分类号： H05K1/141 , G06F1/184 , G06F1/185 , G06F1/20 , H01L23/467 , H01L2924/0002 , H05K1/0203 , H05K1/0263 , H05K2201/10189 , H05K2201/1056 , H01L2924/00
摘要： One embodiment includes an electronic assembly having a first printed circuit board (PCB) coupled to a second PCB. The second PCB has at least two processors and is disposed above the first PCB. A thermal dissipation device is disposed above the second PCB, dissipates heat away from the two processors, and provides an airflow path. A power system is adjacent the thermal dissipation device and in a pathway of the airflow path.
摘要翻译： 一个实施例包括具有耦合到第二PCB的第一印刷电路板（PCB）的电子组件。 第二PCB具有至少两个处理器并且设置在第一PCB上方。 散热装置设置在第二PCB的上方，从两个处理器散热，并提供一个气流路径。 电力系统与散热装置相邻并且在气流路径的路径中。
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公开(公告)号：US09092209B2
公开(公告)日：2015-07-28
申请号：US13162603
申请日：2011-06-17
申请人： Suyash Sinha , Sreenivas Addagatla , Christian L. Belady , Charles Joseph Williams , Shaun L. Harris , Eric C. Peterson
发明人： Suyash Sinha , Sreenivas Addagatla , Christian L. Belady , Charles Joseph Williams , Shaun L. Harris , Eric C. Peterson
CPC分类号： G06F1/30 , G06F1/26 , G06F1/3206 , G06F21/81 , H04L63/102 , H04W4/60 , H05K7/1497 , Y02D70/00 , Y02D70/142 , Y02D70/144 , Y02D70/146 , Y02D70/164
摘要： A framework that enables a local computing cloud infrastructure for rural (and third world) populations with the ability to connect into the global cloud. The framework include is a low cost architecture of long distance, wireless based, renewable energy powered, and small datacenter (DC) (referred to as a pico-DC) nodes that can fully operate off-grid, both power-wise and Internet connection-wise at a very low cost. Additionally, the framework includes power management and storage techniques that effectively enable low power and efficient power use. Thus, systems are self-sufficient, low maintenance and weather proof with no need for power or data connections.
摘要翻译： 一个框架，使农村（和第三世界）人口的本地计算云基础设施能够连接到全球云。 该框架包括长距离，无线，可再生能源供电的低成本架构，以及能够完全运行离网的电力和互联网连接的小型数据中心（DC）（简称Pico-DC）节点 以非常低的成本。 此外，该框架还包括电源管理和存储技术，可有效实现低功耗和高效率的电力使用。 因此，系统是自给自足的，低维护性和防风雨性，不需要电源或数据连接。
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公开(公告)号：US20130120941A1
公开(公告)日：2013-05-16
申请号：US13296266
申请日：2011-11-15
申请人： Eric C. Peterson , Shaun L. Harris , Mark Edward Shaw , Matthew Allen Faist , Christian L. Belady , Darren Shakib
发明人： Eric C. Peterson , Shaun L. Harris , Mark Edward Shaw , Matthew Allen Faist , Christian L. Belady , Darren Shakib
CPC分类号： H05K7/14 , H05K7/1492 , Y10T29/49716
摘要： Various technologies described herein pertain to racking equipment in a data center. A modular equipment rack system can include an upper track, a lower track, a vertical support, a power and network distribution unit, and a tray. The upper track and the lower track can respectively include incrementally spaced mounting locations at which the vertical support and the power and network distribution unit can be attachable. The tray can be attachable to the vertical support and the power and network distribution unit when the vertical support is attached to the upper track at a first upper mounting location and attached to the lower track at a corresponding first lower mounting location, and the power and network distribution unit is attached to the upper track at a second upper mounting location and attached to the lower track at a corresponding second lower mounting location.
摘要翻译： 本文描述的各种技术涉及数据中心中的设备。 模块化设备机架系统可以包括上轨道，下轨道，垂直支撑件，电力和网络分配单元以及托盘。 上轨道和下轨道可以分别包括递增间隔的安装位置，垂直支撑和电力和网络分配单元可以在该位置附接。 当垂直支撑件在第一上部安装位置处附接到上部轨道并且在相应的第一下部安装位置处附接到下部轨道时，托盘可以附接到垂直支撑件和电力和网络分配单元，并且电源和 网络分配单元在第二上部安装位置处附接到上部轨道并且在相应的第二下部安装位置处附接到下部轨道。
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公开(公告)号：US20120098343A1
公开(公告)日：2012-04-26
申请号：US12912696
申请日：2010-10-26
CPC分类号： H02J9/061 , G06F1/183 , G06F1/187 , G06F1/30 , H02J7/34 , H05K7/1492 , Y10T307/505 , Y10T307/527 , Y10T307/625
摘要： A chassis includes a component interconnect board having multiple multi-function slots coupled thereto. Each of the multi-function slots is configured to accept different types of modules, including a battery module and one or more other types of modules, such as server modules or storage modules. The component interconnect board also includes a power bus coupled to receive external power and route the external power to the multiple multi-function slots.
摘要翻译： 机箱包括具有与其相连的多个多功能插槽的部件互连板。 每个多功能插槽都配置为接受不同类型的模块，包括电池模块和一个或多个其他类型的模块，如服务器模块或存储模块。 组件互连板还包括耦合以接收外部电力并将外部电力路由到多个多功能插槽的电源总线。
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公开(公告)号：US20110316338A1
公开(公告)日：2011-12-29
申请号：US12822949
申请日：2010-06-24
IPC分类号： H02J4/00
CPC分类号： G06F1/263 , G06F1/3206 , G06F1/3234 , H02J9/06 , Y10T307/305 , Y10T307/391 , Y10T307/615 , Y10T307/696
摘要： Power is provided to one or more devices in a system that includes a hierarchical power smoothing environment having multiple tiers. In response to a peak in power usage by the one or more devices, power is provided from a first power smoothing component in a first tier of the multiple tiers. Additionally, power is provided to the one or more devices from power smoothing components in each of other tiers of the multiple tiers if the power smoothing component in a next lower tier of the multiple tiers is unable to provide sufficient power for the peak in power usage. If the power smoothing components in the multiple tiers are unable to provide sufficient power for the peak in power usage, then performance of at least one of the one or more devices is reduced in response to the peak in power usage.
摘要翻译： 电力被提供给系统中的一个或多个设备，该系统包括具有多个层的分层功率平滑环境。 响应于一个或多个设备的电力使用的峰值，从多层的第一层中的第一功率平滑组件提供功率。 此外，如果多层下一层较低层中的功率平滑分量不能为功率使用中的峰值提供足够的功率，则向多个设备中的功率平滑组件提供功率平滑组件给多个层的每个其他层中的功率平滑组件 。 如果多层中的功率平滑分量不能为功率使用中的峰值提供足够的功率，则响应于功率使用的峰值来降低一个或多个设备中的至少一个的性能。
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公开(公告)号：US07345885B2
公开(公告)日：2008-03-18
申请号：US11023213
申请日：2004-12-22
申请人： Brent A. Boudreaux , Shaun L Harris , Eric C. Peterson , Christian L Belady , Gary W. Williams , Stuart C. Haden
发明人： Brent A. Boudreaux , Shaun L Harris , Eric C. Peterson , Christian L Belady , Gary W. Williams , Stuart C. Haden
CPC分类号： H05K1/144 , H01L2924/0002 , H05K1/0204 , H05K3/0061 , H05K2201/09054 , H05K2201/1056 , H01L2924/00
摘要： A heat spreader with multiple stacked printed circuit boards (PCBS) includes top and side sections within which a first PCB is contained and bottom edges that extend to a second PCB. The heat spreader and second PCB substantially enclose the first PCB therein.
摘要翻译： 具有多个堆叠印刷电路板（PCBS）的散热器包括顶部和侧部，其中容纳第一PCB，并且底部边缘延伸到第二PCB。 散热器和第二PCB基本上围绕其中的第一PCB。
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8.发明申请MANAGING COMPUTATIONAL WORKLOADS OF COMPUTING APPARATUSES POWERED BY RENEWABLE RESOURCES 有权管理由可再生资源供电的计算设备的计算工作量公开(公告)号：US20120065788A1
公开(公告)日：2012-03-15
申请号：US12881187
申请日：2010-09-14
CPC分类号： G06N7/005 , G01W1/10 , G06F1/3206 , G06F1/329 , Y02D10/24
摘要： A method described herein includes an act of receiving data that is indicative of predicted weather conditions for a particular geographic region, wherein the particular geographic region has an energy generation system therein, and wherein the energy generation system utilizes at least one renewable energy resource to generate electrical power. The method also includes the act of scheduling a computational workload for at least one computer in a data center based at least in part upon the data that is indicative of the predicted weather conditions for the particular geographic region.
摘要翻译： 本文描述的方法包括接收指示特定地理区域的预测天气条件的数据的动作，其中特定地理区域具有其中的能量生成系统，并且其中能量产生系统利用至少一个可再生能源来产生 电力。 该方法还包括至少部分地基于指示特定地理区域的预测天气条件的数据来调度数据中心中的至少一个计算机的计算工作负荷的动作。
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公开(公告)号：US07499281B2
公开(公告)日：2009-03-03
申请号：US11968520
申请日：2008-01-02
CPC分类号： H05K1/141 , H01L23/433 , H01L23/467 , H01L2924/0002 , H05K1/0203 , H05K1/0263 , H05K1/144 , H05K2201/10189 , H05K2201/1056 , H01L2924/00
摘要： Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural processors. A power system couples to and is disposed vertically above the PCB. A thermal dissipation device is disposed between the power system and the PCB for dissipating heat, via a direct heat exchange, from both the power system and the plural processors.
摘要翻译： 实施例包括具有电力系统的多芯片模块的装置，方法和系统。 示例性电子模块包括具有存储器和多个处理器的印刷电路板（PCB）。 电力系统耦合到并垂直放置在PCB上方。 散热装置设置在电力系统和PCB之间，用于通过来自电力系统和多个处理器的直接热交换来散热。
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公开(公告)号：US07336490B2
公开(公告)日：2008-02-26
申请号：US10996721
申请日：2004-11-24
CPC分类号： H05K1/141 , H01L23/433 , H01L23/467 , H01L2924/0002 , H05K1/0203 , H05K1/0263 , H05K1/144 , H05K2201/10189 , H05K2201/1056 , H01L2924/00
摘要： Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural processors. A power system couples to and is disposed vertically above the PCB. A thermal dissipation device is disposed between the power system and the PCB for dissipating heat, via a direct heat exchange, from both the power system and the plural processors.
摘要翻译： 实施例包括具有电力系统的多芯片模块的装置，方法和系统。 示例性电子模块包括具有存储器和多个处理器的印刷电路板（PCB）。 电力系统耦合到并垂直放置在PCB上方。 散热装置设置在电力系统和PCB之间，用于通过来自电力系统和多个处理器的直接热交换来散热。
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