公开(公告)号：US20060043612A1

公开(公告)日：2006-03-02

申请号：US10934835

申请日：2004-09-02

申请人： Sheila Magno ,  Byung Tai Do ,  Dennis Guillermo ,  Antonio Dimaano

发明人： Sheila Magno ,  Byung Tai Do ,  Dennis Guillermo ,  Antonio Dimaano

IPC分类号： H01L23/52

CPC分类号： H01L23/3121 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48992 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3862 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A method for manufacturing a wire sweep resistant semiconductor package provides a die attached to an interposer. The die is electrically connected to the interposer with conductive wires. A sealant is applied to the conductive wires and optionally the die to prevent wire sweep, the sealant being applied free of contact with the interposer. The die, the interposer, the conductive wires, and the sealant are enclosed in an encapsulant.

摘要翻译： 一种用于制造抗线扫描半导体封装件的方法提供附接到插入件的管芯。 管芯通过导线与插入器电连接。 将密封剂施加到导电线和任选的模具以防止电线扫掠，密封剂被施加而不与插入物接触。 芯片，插入件，导线和密封剂封装在密封剂中。

公开(公告)号：US20070090537A1

公开(公告)日：2007-04-26

申请号：US11562957

申请日：2006-11-22

申请人： Il Kwon Shim ,  Sheila Alvarez ,  Sheila Magno

发明人： Il Kwon Shim ,  Sheila Alvarez ,  Sheila Magno

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/3107 ,  H01L23/4952 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/11 ,  H01L2224/1132 ,  H01L2224/1134 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/13 ,  H01L2224/13012 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/81011 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor package includes a substrate having a plurality of lead fingers. A plurality of stud bumps is attached to the plurality of lead fingers. A die having a plurality solder bumps is provided. The plurality of solder bumps is attached to the plurality of stud bumps to form a plurality of electrical connections and provide controlled collapse of the plurality of solder bumps. An encapsulant encapsulates the die, the electrical connections, and the plurality of lead fingers to expose a lower surface of the plurality of lead fingers. The plurality of stud bumps may include a plurality of clusters of stud bumps.

摘要翻译： 半导体封装包括具有多个引线指的基板。 多个螺柱凸起附接到多个引线指。 提供具有多个焊料凸块的模具。 多个焊料凸块被附接到多个柱形凸块以形成多个电连接并且提供多个焊料凸块的受控的倒塌。 密封剂封装模具，电连接和多个引线指，以暴露多个引线指的下表面。 多个凸起凸起可以包括多个螺柱凸块。

公开(公告)号：US20060246629A1

公开(公告)日：2006-11-02

申请号：US10908120

申请日：2005-04-28

申请人： IL Kwon Shim ,  Sheila Alvarez ,  Sheila Magno

发明人： IL Kwon Shim ,  Sheila Alvarez ,  Sheila Magno

IPC分类号： H01L21/00

CPC分类号： H01L23/3107 ,  H01L23/4952 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/11 ,  H01L2224/1132 ,  H01L2224/1134 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/13 ,  H01L2224/13012 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/81011 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor package and a method of manufacturing a semiconductor package include a substrate having a plurality of lead fingers. A plurality of stud bumps is attached to the plurality of lead fingers. A die having a plurality solder bumps is provided. The plurality of solder bumps is attached to the plurality of stud bumps to form a plurality of electrical connections and provide controlled collapse of the plurality of solder bumps. An encapsulant encapsulates the die, the electrical connections, and the plurality of lead fingers to expose a lower surface of the plurality of lead fingers. The plurality of stud bumps may include a plurality of clusters of stud bumps.

摘要翻译： 半导体封装和半导体封装的制造方法包括具有多个引线指的基板。 多个螺柱凸起附接到多个引线指。 提供具有多个焊料凸块的模具。 多个焊料凸块被附接到多个柱形凸块以形成多个电连接并且提供多个焊料凸块的受控的倒塌。 密封剂封装模具，电连接和多个引线指，以暴露多个引线指的下表面。 多个凸起凸起可以包括多个螺柱凸块。