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公开(公告)号:US20150189744A1
公开(公告)日:2015-07-02
申请号:US14580321
申请日:2014-12-23
Applicant: Shengyi Technology Co., Ltd.
Inventor: Xianping ZENG , Nana REN
CPC classification number: H01B1/026 , C08L63/00 , C08L85/02 , H05K1/0326 , H05K1/0373 , H05K2201/0209 , Y10T428/31529 , C08L71/126
Abstract: The present invention relates to a thermosetting resin composition, wherein the resin composition comprises of: (A) epoxy resin; (B) active ester curing agent; (C) poly-phosphonate ester and/or phosphonate-carbonate copolymer. The prepreg and copper clad laminate prepared with the thermosetting resin composition mentioned above has excellent dielectric performance, wet-heat resistance performance, and a flame resistance performance of UL 94 V-0 level.
Abstract translation: 本发明涉及热固性树脂组合物,其中树脂组合物包含:(A)环氧树脂; (B)活性酯固化剂; (C)聚膦酸酯和/或膦酸酯 - 碳酸酯共聚物。 使用上述热固性树脂组合物制备的预浸料和覆铜层压板具有优异的介电性能,耐湿热性能和UL 94 V-0级别的阻燃性能。
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公开(公告)号:US20150189747A1
公开(公告)日:2015-07-02
申请号:US14580284
申请日:2014-12-23
Applicant: Shengyi Technology Co., Ltd.
Inventor: Xianping ZENG , Nana REN
IPC: H05K1/05
CPC classification number: B32B5/024 , B32B5/022 , B32B5/26 , B32B15/14 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2264/10 , B32B2307/306 , B32B2307/3065 , B32B2307/7265 , B32B2457/08 , C08G73/0655 , C08J5/24 , C08J2379/00 , C08J2485/02 , C08K5/0033 , C08L63/00 , C08L79/04 , C08L85/02 , H05K1/0353 , H05K1/0366 , H05K2201/012 , Y10T428/31507 , Y10T428/31529 , Y10T428/31605
Abstract: The present invention relates to a thermosetting resin composition, which comprises: (A) cyanate ester compound and/or cyanate ester prepolymer; and (B) polyphosphonate ester and/or phosphonate-carbonate copolymer. The thermosetting resin composition provided by the present invention has low dielectric constant and dielectric loss tangent. The prepreg and copper clad laminate made from the above-mentioned thermosetting resin composition have excellent dielectric properties and wet-heat resistance, UL94 V-0 flame resistance, and good processability.
Abstract translation: 本发明涉及一种热固性树脂组合物,其包含:(A)氰酸酯化合物和/或氰酸酯预聚物; 和(B)聚膦酸酯和/或膦酸酯 - 碳酸酯共聚物。 本发明提供的热固性树脂组合物具有低介电常数和介电损耗角正切。 由上述热固性树脂组合物制成的预浸料和覆铜层压板具有优异的介电性能和耐湿热性,UL94V-0阻燃性和良好的加工性能。
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