THERMOSETTING RESIN COMPOSITION AND USAGE THEREOF
    1.
    发明申请
    THERMOSETTING RESIN COMPOSITION AND USAGE THEREOF 审中-公开
    热固性树脂组合物及其用途

    公开(公告)号:US20150189744A1

    公开(公告)日:2015-07-02

    申请号:US14580321

    申请日:2014-12-23

    Abstract: The present invention relates to a thermosetting resin composition, wherein the resin composition comprises of: (A) epoxy resin; (B) active ester curing agent; (C) poly-phosphonate ester and/or phosphonate-carbonate copolymer. The prepreg and copper clad laminate prepared with the thermosetting resin composition mentioned above has excellent dielectric performance, wet-heat resistance performance, and a flame resistance performance of UL 94 V-0 level.

    Abstract translation: 本发明涉及热固性树脂组合物,其中树脂组合物包含:(A)环氧树脂; (B)活性酯固化剂; (C)聚膦酸酯和/或膦酸酯 - 碳酸酯共聚物。 使用上述热固性树脂组合物制备的预浸料和覆铜层压板具有优异的介电性能,耐湿热性能和UL 94 V-0级别的阻燃性能。

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