公开(公告)号：US20140116137A1

公开(公告)日：2014-05-01

申请号：US14119283

申请日：2012-05-25

申请人： Shigeki Shinoda ,  Yasuhiro Sasaki ,  Shigeru Kasai ,  Soichiro Takata ,  Masatake Takahashi

发明人： Shigeki Shinoda ,  Yasuhiro Sasaki ,  Shigeru Kasai ,  Soichiro Takata ,  Masatake Takahashi

IPC分类号： G01P15/09 ,  G01P15/097

CPC分类号： G01P15/0922 ,  G01P1/023 ,  G01P15/097

摘要： Acceleration sensor comprises vibrating element including piezoelectric body, circuit board amplifying output charge of the piezoelectric body that is generated due to bending vibration of the vibrating element, and sensor housing composed of highly conductive material, the sensor housing loading the vibrating element and the circuit board. The circuit board includes one or two extending region(s) formed so as to protrude from one side of the circuit board, the extending region(s) connecting mechanically and electrically the circuit board to the vibrating element. The sensor housing includes supporting base supporting the vibrating element, and recess portion is formed on the supporting base. The supporting base is configured such that the extending region(s) of the circuit board cover(s) the recess portion, and the vibrating element is fixed and supported by insulating adhesive agent with which space that is formed from the recess portion and the extending region(s) is filled.

摘要翻译： 加速度传感器包括振动元件，包括压电体，电路板，放大由于振动元件的弯曲振动而产生的压电体的输出电荷;以及由高导电材料构成的传感器壳体，负载振动元件的传感器外壳和电路板 。 电路板包括形成为从电路板的一侧突出的一个或两个延伸区域，所述延伸区域将电路板机械地和电连接到振动元件。 传感器壳体包括支撑振动元件的支撑基座，并且凹部形成在支撑基座上。 支撑基座被构造成使得电路板的延伸区域覆盖凹部，并且振动元件由绝缘粘合剂固定和支撑，绝缘粘合剂由凹部形成的空间和延伸部分 区域被填充。

公开(公告)号：US08861110B2

公开(公告)日：2014-10-14

申请号：US14240016

申请日：2012-08-15

申请人： Soichiro Takata ,  Shigeki Shinoda ,  Shigeru Kasai ,  Nobuhiro Mikami ,  Yasuhiro Sasaki

发明人： Soichiro Takata ,  Shigeki Shinoda ,  Shigeru Kasai ,  Nobuhiro Mikami ,  Yasuhiro Sasaki

IPC分类号： G11B27/36 ,  G11B7/00 ,  G11B20/18

CPC分类号： G11B20/18 ,  G11B19/048 ,  G11B27/36

摘要： A failure prediction system for performing failure prediction to a monitoring target device by detecting a state, comprising: a state detection unit for detecting state signals of no smaller than two different kinds, and outputting a detection signal corresponding to each of the state signals; a phase processing part for synchronizing a plurality of the detection signals; a signal analysis part for calculating a feature value indicating a feature of the state for each of the detection signals from the phase processing part; and a failure prediction part for performing failure prediction of the monitoring target device for each of the feature values by comparing the feature value in question and a reference value set in advance.

摘要翻译： 一种故障预测系统，用于通过检测状态对监视目标设备执行故障预测，包括：状态检测单元，用于检测不少于两种不同类型的状态信号，并输出与每个状态信号对应的检测信号; 相位处理部，其使多个所述检测信号同步; 信号分析部分，用于从相位处理部分计算指示每个检测信号的状态特征的特征值; 以及故障预测部，用于通过比较所述特征值和预先设定的参考值来对每个特征值执行所述监视对象装置的故障预测。

公开(公告)号：US20140219071A1

公开(公告)日：2014-08-07

申请号：US14240016

申请日：2012-08-15

申请人： Soichiro Takata ,  Shigeki Shinoda ,  Shigeru Kasai ,  Nobuhiro Mikami ,  Yasuhiro Sasaki

发明人： Soichiro Takata ,  Shigeki Shinoda ,  Shigeru Kasai ,  Nobuhiro Mikami ,  Yasuhiro Sasaki

IPC分类号： G11B20/18

CPC分类号： G11B20/18 ,  G11B19/048 ,  G11B27/36

摘要： A failure prediction system for performing failure prediction to a monitoring target device by detecting a state, comprising: a state detection unit for detecting state signals of no smaller than two different kinds, and outputting a detection signal corresponding to each of the state signals; a phase processing part for synchronizing a plurality of the detection signals; a signal analysis part for calculating a feature value indicating a feature of the state for each of the detection signals from the phase processing part; and a failure prediction part for performing failure prediction of the monitoring target device for each of the feature values by comparing the feature value in question and a reference value set in advance.

摘要翻译： 一种故障预测系统，用于通过检测状态对监视目标设备执行故障预测，包括：状态检测单元，用于检测不少于两种不同类型的状态信号，并输出与每个状态信号对应的检测信号; 相位处理部，其使多个所述检测信号同步; 信号分析部分，用于从相位处理部分计算指示每个检测信号的状态特征的特征值; 以及故障预测部，用于通过比较所述特征值和预先设定的参考值来对每个特征值执行所述监视对象装置的故障预测。

公开(公告)号：US20130199095A1

公开(公告)日：2013-08-08

申请号：US13821575

申请日：2011-09-20

申请人： Shigeki Shinoda ,  Shigeru Kasai ,  Yasuhiro Sasaki

发明人： Shigeki Shinoda ,  Shigeru Kasai ,  Yasuhiro Sasaki

IPC分类号： G01N29/04

CPC分类号： G01N29/045 ,  E06B7/28 ,  G08B13/04 ,  G08B13/08 ,  G08B21/24

摘要： [Problem]It is difficult to determine a state of an opening/closing body for opening/closing an opening section of a building.[Solution]A crime prevention device according to an exemplary aspect of the invention an excitation means for applying vibration to an opening/closing body for opening/closing an opening section of a building; a detection means for detecting the vibration of the opening/closing body to which the vibration has been applied by the excitation means; and a determination means for determining the state of the opening/closing body on the basis of the feature of the detected vibration of the opening/closing body.

摘要翻译： [问题]难以确定用于打开/关闭建筑物的开口部的打开/关闭体的状态。 解决方案根据本发明的示例性方面的防犯罪装置，用于向打开/关闭建筑物的开口部分的打开/关闭主体施加振动的激励装置; 用于检测由激励装置施加了振动的开闭体的振动的检测装置; 以及确定装置，用于基于开/闭体的检测到的振动的特征来确定打开/关闭体的状态。

公开(公告)号：US20130113337A1

公开(公告)日：2013-05-09

申请号：US13810391

申请日：2011-07-21

申请人： Shigeru Kasai ,  Shigeki Shinoda ,  Yasuhiro Sasaki

发明人： Shigeru Kasai ,  Shigeki Shinoda ,  Yasuhiro Sasaki

IPC分类号： H01L41/113

CPC分类号： H01L41/1132 ,  G01H11/08

摘要： A vibration sensor according to the present invention includes a piezoelectric vibrator including a diaphragm and a piezoelectric element firmly fixed to at least one plane surface of the diaphragm and a signal process substrate performing a predetermined process to a signal outputted from the piezoelectric vibrator, and wherein the piezoelectric vibrator and the signal process substrate are arranged alongside in a planar direction nearly perpendicular to a vibration direction of the piezoelectric vibrator.

摘要翻译： 根据本发明的振动传感器包括压电振动器，其包括膜片和牢固地固定在振动膜的至少一个平面上的压电元件和对从压电振动器输出的信号执行预定处理的信号处理基板，其中 压电振动器和信号处理基板沿着与压电振动器的振动方向大致垂直的平面方向排列。

公开(公告)号：US08794073B2

公开(公告)日：2014-08-05

申请号：US13390606

申请日：2010-08-09

申请人： Shigeru Kasai ,  Yasuhiro Sasaki ,  Hiroshi Sakai

发明人： Shigeru Kasai ,  Yasuhiro Sasaki ,  Hiroshi Sakai

IPC分类号： G01H11/08

CPC分类号： G11B33/08

摘要： A structure for attaching a vibration sensor to a storage device having a recording or reproducing head that records on or reproduces from a recording medium, includes: a first vibration sensor which is provided on a first outer surface of a base of the storage device, and detects vibration in a direction perpendicular to a surface of the recording medium; a second vibration sensor which is provided on a second outer surface of the base, the second surface orthogonal to the first outer surface, and detects vibration in an in-plane direction of the recording medium; an urging section which has a first end portion in contact with an upper surface of the first vibration sensor and a second end portion in contact with an upper surface of the second vibration sensor, and has a substantially L-shape; and a damping member affixed to the urging section.

摘要翻译： 一种用于将振动传感器附接到具有记录或从记录介质再现的记录或再现头的存储装置的结构，包括：设置在存储装置的基座的第一外表面上的第一振动传感器，以及 检测在垂直于记录介质表面的方向上的振动; 第二振动传感器，其设置在所述基座的第二外表面上，所述第二表面与所述第一外表面正交，并且检测所述记录介质的面内方向的振动; 具有与所述第一振动传感器的上表面接触的第一端部和与所述第二振动传感器的上表面接触的第二端部，并具有大致L形的推压部; 以及固定到所述推动部的阻尼构件。

公开(公告)号：US20120137780A1

公开(公告)日：2012-06-07

申请号：US13390606

申请日：2010-08-09

申请人： Shigeru Kasai ,  Yasuhiro Sasaki ,  Hiroshi Sakai

发明人： Shigeru Kasai ,  Yasuhiro Sasaki ,  Hiroshi Sakai

IPC分类号： G01H11/00

CPC分类号： G11B33/08

摘要： A structure for attaching a vibration sensor to a storage device having a recording or reproducing head that records on or reproduces from a recording medium, includes: a first vibration sensor which is provided on a first outer surface of a base of the storage device, and detects vibration in a direction perpendicular to a surface of the recording medium; a second vibration sensor which is provided on a second outer surface of the base, the second surface orthogonal to the first outer surface, and detects vibration in an in-plane direction of the recording medium; an urging section which has a first end portion in contact with an upper surface of the first vibration sensor and a second end portion in contact with an upper surface of the second vibration sensor, and has a substantially L-shape; and a damping member affixed to the urging section.

摘要翻译： 一种用于将振动传感器附接到具有记录介质或从记录介质再现的记录或再现头的存储装置的结构，包括：第一振动传感器，设置在存储装置的基座的第一外表面上，以及 检测在垂直于记录介质表面的方向上的振动; 第二振动传感器，其设置在所述基座的第二外表面上，所述第二表面与所述第一外表面正交，并且检测所述记录介质的面内方向的振动; 具有与所述第一振动传感器的上表面接触的第一端部和与所述第二振动传感器的上表面接触的第二端部，并具有大致L形的推压部; 以及固定到所述推动部的阻尼构件。

公开(公告)号：US20120287526A1

公开(公告)日：2012-11-15

申请号：US13574141

申请日：2011-01-20

申请人： Shigeru Kasai ,  Yasuhiro Sasaki ,  Hiroshi Sakai

发明人： Shigeru Kasai ,  Yasuhiro Sasaki ,  Hiroshi Sakai

IPC分类号： G11B27/36

CPC分类号： G11B20/10009 ,  G11B19/048 ,  G11B20/10027 ,  G11B20/10314 ,  G11B20/1816 ,  G11B27/36 ,  G11B2220/2516

摘要： A breakdown prediction device of the present invention includes: a vibration measurement unit that measures vibrations generated from a device being monitored; and a signal processing unit that performs breakdown prediction when a specific vibration is measured at the vibration measurement unit, a maximum vibration amplitude value of the vibration exceeding an upper limit vibration amplitude threshold, and a vibration amplitude value thereof being below a lower limit vibration amplitude threshold at a point in time when a specified time is reached from a point in time when the vibration exceeds the upper limit vibration amplitude threshold.

摘要翻译： 本发明的故障预测装置包括：振动测量单元，其测量从被监视的设备产生的振动; 以及信号处理单元，其在所述振动测量单元处测量特定振动时执行击穿预测，所​​述振动的最大振动振幅值超过上限振幅阈值，并且其振动振幅值低于下限振幅 在振动超过上限振幅阈值的时间点达到指定时间的时间点的阈值。

公开(公告)号：US08891188B2

公开(公告)日：2014-11-18

申请号：US13574141

申请日：2011-01-20

申请人： Shigeru Kasai ,  Yasuhiro Sasaki ,  Hiroshi Sakai

发明人： Shigeru Kasai ,  Yasuhiro Sasaki ,  Hiroshi Sakai

IPC分类号： G11B27/36 ,  G11B20/10 ,  G11B20/18 ,  G11B19/04

CPC分类号： G11B20/10009 ,  G11B19/048 ,  G11B20/10027 ,  G11B20/10314 ,  G11B20/1816 ,  G11B27/36 ,  G11B2220/2516

摘要： A breakdown prediction device of the present invention includes: a vibration measurement unit that measures vibrations generated from a device being monitored; and a signal processing unit that performs breakdown prediction when a specific vibration is measured at the vibration measurement unit, a maximum vibration amplitude value of the vibration exceeding an upper limit vibration amplitude threshold, and a vibration amplitude value thereof being below a lower limit vibration amplitude threshold at a point in time when a specified time is reached from a point in time when the vibration exceeds the upper limit vibration amplitude threshold.

摘要翻译： 本发明的故障预测装置包括：振动测量单元，其测量从被监视的设备产生的振动; 以及信号处理单元，其在所述振动测量单元处测量特定振动时执行击穿预测，所​​述振动的最大振动振幅值超过上限振幅阈值，并且其振动振幅值低于下限振幅 在振动超过上限振幅阈值的时间点达到指定时间的时间点的阈值。

公开(公告)号：US08897631B2

公开(公告)日：2014-11-25

申请号：US12864792

申请日：2009-01-19

申请人： Shigeru Kasai ,  Hiroyuki Miyashita ,  Tomohiro Suzuki ,  Masatake Yoneda ,  Kazuhiro Ooya

发明人： Shigeru Kasai ,  Hiroyuki Miyashita ,  Tomohiro Suzuki ,  Masatake Yoneda ,  Kazuhiro Ooya

IPC分类号： F27D11/12 ,  H01L21/67 ,  H01L21/324 ,  H01L21/268

CPC分类号： H01L21/67109 ,  H01L21/268 ,  H01L21/324 ,  H01L21/67115

摘要： An annealing apparatus includes heating sources provided to face a wafer W, the heating sources having LEDs emitting lights to the wafer; light-transmitting members for transmitting the lights emitted from the LEDs; and cooling members made of aluminum and provided to directly contact with the heating sources, respectively. The heating sources include a plurality of LED arrays having supporters made of AlN, each having one surface on which the LEDs are adhered by using a silver paste; and other surface on which thermal diffusion members made of copper are adhered by using a solder. The LED arrays are fixed to the cooling member by using screws via a silicone grease.

摘要翻译： 退火装置包括设置成面向晶片W的加热源，所述加热源具有向晶片发光的LED; 用于透射从LED发射的光的透光构件; 和由铝制成的冷却部件，分别与加热源直接接触。 加热源包括具有由AlN制成的支撑体的多个LED阵列，每个具有一个表面，其上通过使用银膏粘合LED; 和由铜制成的热扩散构件的其他表面通过焊料粘合。 LED阵列通过使用硅脂润滑脂的螺丝固定在冷却部件上。