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    BAND-PASS FILTER MODULE AND MODULE SUBSTRATE
    1.
    发明申请
    BAND-PASS FILTER MODULE AND MODULE SUBSTRATE 有权
    带通滤波器模块和模块基板

    公开(公告)号：US20130120950A1

    公开(公告)日：2013-05-16

    申请号：US13811528

    申请日：2011-07-21

    申请人： Shigemitsu Tomaki ,  Yoshikazu Tsuya ,  Masamichi Tanaka ,  Isao Abe

    发明人： Shigemitsu Tomaki ,  Yoshikazu Tsuya ,  Masamichi Tanaka ,  Isao Abe

    IPC分类号： H05K1/18 ,  H05K1/11 ,  H03H7/01

    CPC分类号： H05K1/18 ,  H01P1/20345 ,  H03H7/0115 ,  H03H7/0123 ,  H03H7/1708 ,  H03H7/1775 ,  H03H2001/0085 ,  H05K1/0224 ,  H05K1/0243 ,  H05K1/11 ,  H05K1/115 ,  H05K1/181

    摘要： A bandpass filter module includes a mounting board and a BPF chip mounted on a surface thereof. The BPF chip includes three or more resonators; a first-stage resonator located closest to an input terminal, a final-stage resonator located closest to an output terminal, and a middle-stage resonator connected between the first-stage and the final-stage resonators and located in a chip middle zone. The mounting board includes an area overlapping with the chip middle zone, viewed in plan, defining a ground-free space in which no ground electrode is disposed. The ground-free space is formed at least from the surface of the mounting board to a depth position at which a topmost internal wiring layer is located. The middle-stage resonator is prevented from being coupled to ground electrodes on the mounting board and from a lower Q-value and increased insertion loss.

    摘要翻译： 带通滤波器模块包括安装板和安装在其表面上的BPF芯片。 BPF芯片包括三个或更多个谐振器; 位于最靠近输入端子的第一级谐振器，最靠近输出端子的最后级谐振器，以及连接在第一级谐振器和最后级谐振器之间并位于芯片中间区域的中间级谐振器。 安装板包括与平面图中的芯片中间区域重叠的区域，限定没有设置接地电极的无地空间。 至少从安装板的表面至最内部布线层所在的深度位置形成无地空间。 防止中间级谐振器耦合到安装板上的接地电极和较低的Q值以及增加的插入损耗。

    Band-pass filter module and module substrate
    2.
    发明授权
    Band-pass filter module and module substrate 有权
    带通滤波器模块和模块基板

    公开(公告)号：US09107323B2

    公开(公告)日：2015-08-11

    申请号：US13811528

    申请日：2011-07-21

    申请人： Shigemitsu Tomaki ,  Yoshikazu Tsuya ,  Masamichi Tanaka ,  Isao Abe

    发明人： Shigemitsu Tomaki ,  Yoshikazu Tsuya ,  Masamichi Tanaka ,  Isao Abe

    IPC分类号： H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H01P1/203 ,  H05K1/02 ,  H03H7/01 ,  H03H1/00

    CPC分类号： H05K1/18 ,  H01P1/20345 ,  H03H7/0115 ,  H03H7/0123 ,  H03H7/1708 ,  H03H7/1775 ,  H03H2001/0085 ,  H05K1/0224 ,  H05K1/0243 ,  H05K1/11 ,  H05K1/115 ,  H05K1/181

    摘要： A bandpass filter module includes a mounting board and a BPF chip mounted on a surface thereof. The BPF chip includes three or more resonators; a first-stage resonator located closest to an input terminal, a final-stage resonator located closest to an output terminal, and a middle-stage resonator connected between the first-stage and the final-stage resonators and located in a chip middle zone. The mounting board includes an area overlapping with the chip middle zone, viewed in plan, defining a ground-free space in which no ground electrode is disposed. The ground-free space is formed at least from the surface of the mounting board to a depth position at which a topmost internal wiring layer is located. The middle-stage resonator is prevented from being coupled to ground electrodes on the mounting board and from a lower Q-value and increased insertion loss.

    摘要翻译： 带通滤波器模块包括安装板和安装在其表面上的BPF芯片。 BPF芯片包括三个或更多个谐振器; 位于最靠近输入端子的第一级谐振器，最靠近输出端子的最后级谐振器，以及连接在第一级谐振器和最后级谐振器之间并位于芯片中间区域的中间级谐振器。 安装板包括与平面图中的芯片中间区域重叠的区域，限定没有设置接地电极的无地空间。 至少从安装板的表面至最内部布线层所在的深度位置形成无地空间。 防止中间级谐振器耦合到安装板上的接地电极和较低的Q值以及增加的插入损耗。

    Electronic component
    3.
    发明申请
    Electronic component 有权
    电子元器件

    公开(公告)号：US20090121807A1

    公开(公告)日：2009-05-14

    申请号：US12289080

    申请日：2008-10-20

    申请人： Shigemitsu Tomaki ,  Noriaki Ootsuka ,  Yoshikazu Tsuya ,  Kazushige Shinoda

    发明人： Shigemitsu Tomaki ,  Noriaki Ootsuka ,  Yoshikazu Tsuya ,  Kazushige Shinoda

    IPC分类号： H03H7/00

    CPC分类号： H01P1/20345

    摘要： An electronic component includes a layered substrate including a plurality of dielectric layers stacked, and three resonators provided within the layered substrate. One of the three resonators includes resonator-forming conductor layers of a first type and a second type that each have a short-circuited end and an open-circuited end, relative positions of the short-circuited end and the open-circuited end being reversed between the first and second types. The resonator-forming conductor layers of the first type and the second type are arranged to be adjacent to each other in a direction in which the plurality of dielectric layers are stacked.

    摘要翻译： 电子部件包括层叠基板，该层叠基板层叠有多个电介质层，在该层叠基板内设置有三个谐振器。 三个谐振器中的一个包括第一类型和第二类型的谐振器形成导体层，每个具有短路端和开路端，短路端和开路端的相对位置相反 在第一和第二类之间。 第一类型和第二类型的谐振器形成导体层被布置成在堆叠多个电介质层的方向上彼此相邻。

    Electronic component
    4.
    发明申请
    Electronic component 有权
    电子元器件

    公开(公告)号：US20090121813A1

    公开(公告)日：2009-05-14

    申请号：US12289083

    申请日：2008-10-20

    申请人： Shigemitsu Tomaki ,  Noriaki Ootsuka ,  Yoshikazu Tsuya ,  Kazushige Shinoda

    发明人： Shigemitsu Tomaki ,  Noriaki Ootsuka ,  Yoshikazu Tsuya ,  Kazushige Shinoda

    IPC分类号： H01P7/10

    CPC分类号： H01P1/20327

    摘要： An electronic component includes first and second resonators provided within a layered substrate including stacked dielectric layers. The first resonator includes resonator-forming conductor layers of a first type and a second type. The resonator-forming conductor layers of the first type and the second type are reversed in relative positions of the short-circuited end and the open-circuited end, and are alternately arranged in the stacking direction of the dielectric layers. An input terminal is connected to all of the resonator-forming conductor layers of the first type. The second resonator includes resonator-forming conductor layers of a third type and a fourth type. The resonator-forming conductor layers of the third type and the fourth type are reversed in relative positions of the short-circuited end and the open-circuited end, and are alternately arranged in the stacking direction of the dielectric layers. An output terminal is connected to all of the resonator-forming conductor layers of the third type.

    摘要翻译： 电子部件包括设置在包括堆叠电介质层的分层基板内的第一和第二谐振器。 第一谐振器包括第一类型和第二类型的谐振器形成导体层。 第一类型和第二类型的谐振器形成导体层在短路端和开路端的相对位置反向，并且在电介质层的堆叠方向上交替布置。 输入端子连接到第一类型的所有谐振器形成导体层。 第二谐振器包括第三类型和第四类型的谐振器形成导体层。 第三类型和第四类型的谐振器形成导体层在短路端和开路端的相对位置反向，并且在电介质层的堆叠方向上交替布置。 输出端子连接到第三类型的所有谐振器形成导体层。

    Electronic component
    5.
    发明授权
    Electronic component 有权
    电子元器件

    公开(公告)号：US08120446B2

    公开(公告)日：2012-02-21

    申请号：US12289080

    申请日：2008-10-20

    申请人： Shigemitsu Tomaki ,  Noriaki Ootsuka ,  Yoshikazu Tsuya ,  Kazushige Shinoda

    发明人： Shigemitsu Tomaki ,  Noriaki Ootsuka ,  Yoshikazu Tsuya ,  Kazushige Shinoda

    IPC分类号： H03H7/09 ,  H01P1/203 ,  H01P7/08

    CPC分类号： H01P1/20345

    摘要： An electronic component includes a layered substrate including a plurality of dielectric layers stacked, and three resonators provided within the layered substrate. One of the three resonators includes resonator-forming conductor layers of a first type and a second type that each have a short-circuited end and an open-circuited end, relative positions of the short-circuited end and the open-circuited end being reversed between the first and second types. The resonator-forming conductor layers of the first type and the second type are arranged to be adjacent to each other in a direction in which the plurality of dielectric layers are stacked.

    摘要翻译： 电子部件包括层叠基板，该层叠基板层叠有多个电介质层，在该层叠基板内设置有三个谐振器。 三个谐振器中的一个包括第一类型和第二类型的谐振器形成导体层，每个具有短路端和开路端，短路端和开路端的相对位置相反 在第一和第二类之间。 第一类型和第二类型的谐振器形成导体层被布置成在堆叠多个电介质层的方向上彼此相邻。

    Electronic component
    6.
    发明授权
    Electronic component 有权
    电子元器件

    公开(公告)号：US08018305B2

    公开(公告)日：2011-09-13

    申请号：US12289083

    申请日：2008-10-20

    申请人： Shigemitsu Tomaki ,  Noriaki Ootsuka ,  Yoshikazu Tsuya ,  Kazushige Shinoda

    发明人： Shigemitsu Tomaki ,  Noriaki Ootsuka ,  Yoshikazu Tsuya ,  Kazushige Shinoda

    IPC分类号： H01P1/205 ,  H01P7/08

    CPC分类号： H01P1/20327

    摘要： An electronic component includes first and second resonators provided within a layered substrate including stacked dielectric layers. The first resonator includes resonator-forming conductor layers of a first type and a second type. The resonator-forming conductor layers of the first type and the second type are reversed in relative positions of the short-circuited end and the open-circuited end, and are alternately arranged in the stacking direction of the dielectric layers. An input terminal is connected to all of the resonator-forming conductor layers of the first type. The second resonator includes resonator-forming conductor layers of a third type and a fourth type. The resonator-forming conductor layers of the third type and the fourth type are reversed in relative positions of the short-circuited end and the open-circuited end, and are alternately arranged in the stacking direction of the dielectric layers. An output terminal is connected to all of the resonator-forming conductor layers of the third type.

    摘要翻译： 电子部件包括设置在包括堆叠电介质层的分层基板内的第一和第二谐振器。 第一谐振器包括第一类型和第二类型的谐振器形成导体层。 第一类型和第二类型的谐振器形成导体层在短路端和开路端的相对位置反向，并且在电介质层的堆叠方向上交替布置。 输入端子连接到第一类型的所有谐振器形成导体层。 第二谐振器包括第三类型和第四类型的谐振器形成导体层。 第三类型和第四类型的谐振器形成导体层在短路端和开路端的相对位置反向，并且在电介质层的堆叠方向上交替布置。 输出端子连接到第三类型的所有谐振器形成导体层。

    Layered bandpass filter
    9.
    发明授权
    Layered bandpass filter 有权
    分层带通滤波器

    公开(公告)号：US08952767B2

    公开(公告)日：2015-02-10

    申请号：US13429982

    申请日：2012-03-26

    申请人： Eiko Wakata ,  Shigemitsu Tomaki ,  Isao Abe

    发明人： Eiko Wakata ,  Shigemitsu Tomaki ,  Isao Abe

    IPC分类号： H03H7/12 ,  H01P1/203 ,  H03H1/00

    CPC分类号： H01P1/20345 ,  H03H7/12 ,  H03H2001/0085

    摘要： A bandpass filter includes a layered structure including a plurality of stacked dielectric layers, and first to third resonators provided within the layered structure. In terms of circuit configuration, the second resonator is located between the first and third resonators. The first resonator includes a first inductor and a first capacitor. The second resonator includes a second inductor and a second capacitor. The third resonator includes a third inductor and a third capacitor. The second inductor is disposed at a position different from that of each of the first and third inductors in the stacking direction of the dielectric layers. The second inductor is lower in inductance than the first and third inductors. The second capacitor is higher in capacitance than the first and third capacitors.

    摘要翻译： 带通滤波器包括层叠结构，其包括多层堆叠介质层，以及设置在分层结构内的第一至第三谐振器。 在电路结构方面，第二谐振器位于第一和第三谐振器之间。 第一谐振器包括第一电感器和第一电容器。 第二谐振器包括第二电感器和第二电容器。 第三谐振器包括第三电感器和第三电容器。 第二电感器设置在与电介质层的层叠方向上的第一和第三电感器的位置不同的位置处。 第二电感器的电感比第一和第三电感器低。 第二电容器的电容高于第一和第三电容器。