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    Layered bandpass filter
    1.
    发明授权
    Layered bandpass filter 有权
    分层带通滤波器

    公开(公告)号：US08952767B2

    公开(公告)日：2015-02-10

    申请号：US13429982

    申请日：2012-03-26

    申请人： Eiko Wakata ,  Shigemitsu Tomaki ,  Isao Abe

    发明人： Eiko Wakata ,  Shigemitsu Tomaki ,  Isao Abe

    IPC分类号： H03H7/12 ,  H01P1/203 ,  H03H1/00

    CPC分类号： H01P1/20345 ,  H03H7/12 ,  H03H2001/0085

    摘要： A bandpass filter includes a layered structure including a plurality of stacked dielectric layers, and first to third resonators provided within the layered structure. In terms of circuit configuration, the second resonator is located between the first and third resonators. The first resonator includes a first inductor and a first capacitor. The second resonator includes a second inductor and a second capacitor. The third resonator includes a third inductor and a third capacitor. The second inductor is disposed at a position different from that of each of the first and third inductors in the stacking direction of the dielectric layers. The second inductor is lower in inductance than the first and third inductors. The second capacitor is higher in capacitance than the first and third capacitors.

    摘要翻译： 带通滤波器包括层叠结构，其包括多层堆叠介质层，以及设置在分层结构内的第一至第三谐振器。 在电路结构方面，第二谐振器位于第一和第三谐振器之间。 第一谐振器包括第一电感器和第一电容器。 第二谐振器包括第二电感器和第二电容器。 第三谐振器包括第三电感器和第三电容器。 第二电感器设置在与电介质层的层叠方向上的第一和第三电感器的位置不同的位置处。 第二电感器的电感比第一和第三电感器低。 第二电容器的电容高于第一和第三电容器。

    BAND-PASS FILTER MODULE AND MODULE SUBSTRATE
    4.
    发明申请
    BAND-PASS FILTER MODULE AND MODULE SUBSTRATE 有权
    带通滤波器模块和模块基板

    公开(公告)号：US20130120950A1

    公开(公告)日：2013-05-16

    申请号：US13811528

    申请日：2011-07-21

    申请人： Shigemitsu Tomaki ,  Yoshikazu Tsuya ,  Masamichi Tanaka ,  Isao Abe

    发明人： Shigemitsu Tomaki ,  Yoshikazu Tsuya ,  Masamichi Tanaka ,  Isao Abe

    IPC分类号： H05K1/18 ,  H05K1/11 ,  H03H7/01

    CPC分类号： H05K1/18 ,  H01P1/20345 ,  H03H7/0115 ,  H03H7/0123 ,  H03H7/1708 ,  H03H7/1775 ,  H03H2001/0085 ,  H05K1/0224 ,  H05K1/0243 ,  H05K1/11 ,  H05K1/115 ,  H05K1/181

    摘要： A bandpass filter module includes a mounting board and a BPF chip mounted on a surface thereof. The BPF chip includes three or more resonators; a first-stage resonator located closest to an input terminal, a final-stage resonator located closest to an output terminal, and a middle-stage resonator connected between the first-stage and the final-stage resonators and located in a chip middle zone. The mounting board includes an area overlapping with the chip middle zone, viewed in plan, defining a ground-free space in which no ground electrode is disposed. The ground-free space is formed at least from the surface of the mounting board to a depth position at which a topmost internal wiring layer is located. The middle-stage resonator is prevented from being coupled to ground electrodes on the mounting board and from a lower Q-value and increased insertion loss.

    摘要翻译： 带通滤波器模块包括安装板和安装在其表面上的BPF芯片。 BPF芯片包括三个或更多个谐振器; 位于最靠近输入端子的第一级谐振器，最靠近输出端子的最后级谐振器，以及连接在第一级谐振器和最后级谐振器之间并位于芯片中间区域的中间级谐振器。 安装板包括与平面图中的芯片中间区域重叠的区域，限定没有设置接地电极的无地空间。 至少从安装板的表面至最内部布线层所在的深度位置形成无地空间。 防止中间级谐振器耦合到安装板上的接地电极和较低的Q值以及增加的插入损耗。

    Band-pass filter module and module substrate
    5.
    发明授权
    Band-pass filter module and module substrate 有权
    带通滤波器模块和模块基板

    公开(公告)号：US09107323B2

    公开(公告)日：2015-08-11

    申请号：US13811528

    申请日：2011-07-21

    申请人： Shigemitsu Tomaki ,  Yoshikazu Tsuya ,  Masamichi Tanaka ,  Isao Abe

    发明人： Shigemitsu Tomaki ,  Yoshikazu Tsuya ,  Masamichi Tanaka ,  Isao Abe

    IPC分类号： H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H01P1/203 ,  H05K1/02 ,  H03H7/01 ,  H03H1/00

    CPC分类号： H05K1/18 ,  H01P1/20345 ,  H03H7/0115 ,  H03H7/0123 ,  H03H7/1708 ,  H03H7/1775 ,  H03H2001/0085 ,  H05K1/0224 ,  H05K1/0243 ,  H05K1/11 ,  H05K1/115 ,  H05K1/181

    摘要： A bandpass filter module includes a mounting board and a BPF chip mounted on a surface thereof. The BPF chip includes three or more resonators; a first-stage resonator located closest to an input terminal, a final-stage resonator located closest to an output terminal, and a middle-stage resonator connected between the first-stage and the final-stage resonators and located in a chip middle zone. The mounting board includes an area overlapping with the chip middle zone, viewed in plan, defining a ground-free space in which no ground electrode is disposed. The ground-free space is formed at least from the surface of the mounting board to a depth position at which a topmost internal wiring layer is located. The middle-stage resonator is prevented from being coupled to ground electrodes on the mounting board and from a lower Q-value and increased insertion loss.

    摘要翻译： 带通滤波器模块包括安装板和安装在其表面上的BPF芯片。 BPF芯片包括三个或更多个谐振器; 位于最靠近输入端子的第一级谐振器，最靠近输出端子的最后级谐振器，以及连接在第一级谐振器和最后级谐振器之间并位于芯片中间区域的中间级谐振器。 安装板包括与平面图中的芯片中间区域重叠的区域，限定没有设置接地电极的无地空间。 至少从安装板的表面至最内部布线层所在的深度位置形成无地空间。 防止中间级谐振器耦合到安装板上的接地电极和较低的Q值以及增加的插入损耗。

    LAMINATED ELECTRONIC COMPONENT EQUIPPED WITH INDUCTOR
    7.
    发明申请
    LAMINATED ELECTRONIC COMPONENT EQUIPPED WITH INDUCTOR 审中-公开
    带电感器的层压电子元件

    公开(公告)号：US20120313743A1

    公开(公告)日：2012-12-13

    申请号：US13580021

    申请日：2011-09-07

    申请人： Kazunari Kimura ,  Shigemitsu Tomaki ,  Misaki Tabata ,  Isao Abe

    发明人： Kazunari Kimura ,  Shigemitsu Tomaki ,  Misaki Tabata ,  Isao Abe

    IPC分类号： H01F5/00

    CPC分类号： H01F17/0013 ,  H01F2017/004

    摘要： A laminated electronic part comprises a first laminate, and a second laminate including a front wiring layer and bonded to the first laminate. Wiring layers of the first laminate and second laminate are orthogonal to each other. The first laminate has a first inductor conductor disposed on a first wiring layer, and a second inductor conductor disposed on a second wiring layer. The second laminate has a connection conductor for electrically connecting an end of the first inductor conductor with an end of the second inductor conductor on a surface thereof to which the first laminate is bonded, such that the first inductor conductor and the second inductor conductor form a coil-shaped inductor.

    摘要翻译： 层叠电子部件包括第一层压体和包含前布线层并与第一层压体接合的第二层压体。 第一层压体和第二层压体的接线层彼此正交。 第一层压体具有布置在第一布线层上的第一电感器导体和布置在第二布线层上的第二电感器导体。 第二层压体具有用于将第一电感器导体的端部与第二电感器导体的端部电连接到第一层压体的表面上的连接导体，使得第一电感器导体和第二电感器导体形成 线圈形电感器。

    Positive electrode active material, method for producing same, and non-aqueous electrolyte secondary battery using same
    8.
    发明授权
    Positive electrode active material, method for producing same, and non-aqueous electrolyte secondary battery using same 有权
    正极活性物质及其制造方法以及使用该正极活性物质的非水电解质二次电池

    公开(公告)号：US09325005B2

    公开(公告)日：2016-04-26

    申请号：US13387241

    申请日：2010-07-28

    申请人： Satoshi Matsumoto ,  Isao Abe ,  Yutaka Kawatate ,  Norihiro Yamamoto ,  Shinji Arimoto

    发明人： Satoshi Matsumoto ,  Isao Abe ,  Yutaka Kawatate ,  Norihiro Yamamoto ,  Shinji Arimoto

    IPC分类号： H01B1/02 ,  H01M4/505 ,  C01G53/00 ,  H01M4/13 ,  H01M4/58 ,  H01M4/00

    CPC分类号： H01M4/505 ,  C01G53/42 ,  C01G53/50 ,  C01P2002/50 ,  C01P2002/88 ,  C01P2006/12 ,  C01P2006/40 ,  C01P2006/80 ,  Y02E60/122 ,  Y02P70/54

    摘要： A lithium nickel composite oxide, having small inner resistance, large battery capacity and high thermal stability, can be used as a positive electrode active material for a non-aqueous electrolyte secondary battery. The positive electrode active material is composed of the lithium nickel composite oxide of LibNi1-aMaO2 (wherein M represents at least one element selected from a transition metal element other than Ni, the second group element and the thirteenth group element; a satisfies 0.01≦a≦0.5; and b satisfies 0.9≦b≦1.1). This is obtained by filtering and drying the fired powder after water washing, wherein it is dried at 90° C. or lower, till moisture is reduced to 1% or less by mass in drying, and then at 120° C., and under gas atmosphere where content of compound components containing carbon is 0.01% or less by volume, or under vacuum atmosphere.

    摘要翻译： 作为非水电解质二次电池用正极活性物质，可以使用内电阻小，电池容量大，热稳定性高的锂镍复合氧化物。 正极活性物质由LibNi1-aMaO2的锂镍复合氧化物（其中M表示选自Ni以外的过渡金属元素中的至少一种元素，第二族元素和第十三族元素）; a满足0.01＆lt; nlE; a＆nlE; 0.5; b满足0.9＆nlE; b＆nlE; 1.1）。 这是通过在水洗后过滤和干燥烧制粉末而获得的，其中在90℃或更低温度下干燥，直到水分在干燥中降低至1质量％以下，然后在120℃， 含有碳的化合物成分的含量为0.01体积％以下或真空气氛下的气体气氛。

    Process for producing monosilane from dichlorosilane
    9.
    发明授权
    Process for producing monosilane from dichlorosilane 有权
    二氯硅烷生产甲硅烷的方法

    公开(公告)号：US08871168B2

    公开(公告)日：2014-10-28

    申请号：US13820450

    申请日：2011-08-29

    申请人： Isao Abe ,  Jérôme Beauvisage ,  Shinji Tomita

    发明人： Isao Abe ,  Jérôme Beauvisage ,  Shinji Tomita

    IPC分类号： C01B33/04 ,  B01J31/02

    CPC分类号： C01B33/043 ,  B01J31/0237 ,  B01J31/0239 ,  Y02P20/127

    摘要： A process for continuously producing monosilane by means of an apparatus comprising a reaction column, at least two upper condensers each with a reflux feed pipe, a bottom reboiler and an evaporation tank connected to a bottom portion of the reaction column; the process comprising: a) supplying dichlorosilane or a mixture of chlorosilanes to an upper stage of the reaction column via an upper feed injection point b) supplying a catalyst to said upper stage of the reaction column via a lower injection point c) introducing the resultant mixture from the top portion of the reaction column to the plurality of upper condensers d) separating monosilane from condensates in the upper condensers e) recycling the condensates through the reflux feed pipes to the upper stage of the reaction column f) bringing the condensates into contact with the catalyst in the reaction column.

    摘要翻译： 一种连续生产甲硅烷的方法，该装置包括反应塔，至少两个上部冷凝器，每个上部冷凝器均具有连接到反应塔底部的回流进料管，底部再沸器和蒸发罐; 该方法包括：a）通过上部进料注入点将二氯硅烷或氯硅烷的混合物供应到反应塔的上段; b）经由下部注入点向反应塔的上段供应催化剂; c）将所得物 混合物从反应塔的顶部到多个上部冷凝器d）从上部冷凝器中的冷凝物中分离出甲硅烷e）将冷凝物通过回流进料管再循环到反应塔的上段f）使冷凝物接触 与反应塔中的催化剂。