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    POLISHING FLUID COMPOSITION
    1.
    发明申请
    POLISHING FLUID COMPOSITION 有权
    抛光液组合物

    公开(公告)号：US20090197415A1

    公开(公告)日：2009-08-06

    申请号：US12415548

    申请日：2009-03-31

    申请人： Shigeo FUJII ,  Yoshiaki Oshima ,  Koichi Naito

    发明人： Shigeo FUJII ,  Yoshiaki Oshima ,  Koichi Naito

    IPC分类号： H01L21/304

    CPC分类号： C09G1/02 ,  B24B37/044

    摘要： To provide a polishing composition capable of increasing polishing rate and reducing surface roughness, without causing surface defects on a surface of an object to be polished; and a polishing process for a substrate to be polished. [1] a polishing composition comprising water, an abrasive, an intermediate alumina, and a polycarboxylic acid having 4 or more carbon atoms with no OH groups or a salt thereof, wherein a content of the intermediate alumina is from 1 to 90 parts by weight, based on 100 parts by weight of the abrasive; and [2] a polishing process for a substrate to be polished, comprising polishing a substrate to be polished under conditions that a composition of a polishing liquid during polishing is the composition as defined in item [1] above.

    摘要翻译： 提供能够提高抛光速度并降低表面粗糙度的抛光组合物，而不会在被抛光物体的表面上引起表面缺陷; 以及用于待抛光的基底的抛光工艺。 [1]一种抛光组合物，其包含水，研磨剂，中间体氧化铝和具有4个以上没有OH基团的碳原子的多元羧酸或其盐，其中所述中间体氧化铝的含量为1〜90重量份 ，基于100重量份的研磨剂; 以及[2]一种抛光用基材的研磨方法，其特征在于，在抛光中的研磨液的成分为上述[1]所述的组成的条件下，研磨抛光用基板。