摘要:
A chip network resistor includes a plurality of discrete electrodes and common electrodes which are connected to a plurality of resistance elements according to a predetermined pattern. The configuration of the common electrodes is larger more than that of the discrete electrodes. Thereby, the contact resistance between the terminal of a measuring instrument and a common electrode is reducible when a value of resistance is measured.
摘要:
A TiAl intermetallic compound-base alloy material having excellent strength properties at high temperatures and ductility, characterized by comprising: a fine alumina (Al.sub.2 O.sub.3) dispersed so as to give an O.sub.2 concentration of 1000 to 5000 ppm by weight and in a particle diameter of 200 to 500 nm; a boride (TiB.sub.2) dispersed to give a B concentration of 0.1 to 10 at % and in a particle diameter of not more than 500 nm; 1 to 3 at % of at least one of Cr, Mn, and V; and TiAl having a Ti content of 50 to 53 at % and an Al content of 47 to 50 at %, said TiAl intermetallic compound-base alloy material having been directly cast at a cooling rate of 10.sup.3 to 10.sup.5 .degree. C./sec and a process for producing the same. According to the present invention, exhaust valves for automobiles and materials for engine turbines for jet airplanes and the like having excellent tensile strength at high temperatures and ductility at high temperatures and room temperature are provided.
摘要:
Disclosed are a structure and a method of manufacture of a chip composite electronic component with improved moisture resistance. A pair of end electrodes are formed on a surface of the substrate at opposite end portions thereof. An intermediate electrode is formed at a location between the end electrodes on the surface of the substrate. The intermediate electrode includes a lower electrode, a resistor electrode and a pad electrode formed continuous therebetween. Another element is formed on the lower electrode so as to be electrically connected between the lower electrode and one of the end electrodes. A resistance element is formed between the other of the end electrodes and the resistor electrode. A glass layer is formed to cover another element, the resistance element and the pad electrode. A protective layer of a synthetic resin is formed to cover the entire surface of the glass layer and part of each the end electrode.
摘要:
This invention relates to TiAl based intermetallic compound alloy and process for producing; the object of this invention is to improve high temperature deformability. The alloy comprises basic components: Ti.sub.y AlCr.sub.x, wherein 1%.ltoreq.X.ltoreq.5%, 47.5%.ltoreq.Y.ltoreq.52%, and X+ 2Y.gtoreq.100%, and comprises a fine-grain structure with a .beta. phase precipitated on a grain boundary of equiaxed .gamma. grain having grain size of less than 30 .mu.m, and possessing a superplasticity such that the strain rate sensitivity factors (m value) is 0.40 or more and tensile elongation is 400% or more tested at 1200.degree. C. and a strain rate of 5.times.10.sup.-4 S.sup.-1.
摘要:
A chip resistor device includes an insulating chip substrate having a top surface formed with a resistor film which is covered by a protective coating. The top surface of the substrate is also formed with a pair of terminal electrodes provided at both ends of the chip substrate. Each of the terminal electrodes includes a main top electrode layer formed on the top surface of the chip substrate in electrical conduction with the resistor film, an auxiliary top electrode layer formed on the main top electrode layer, a side electrode layer formed on a corresponding end face of the chip substrate, and a plated metal electrode layer formed on the auxiliary top electrode layer and the side electrode layer. The auxiliary top electrode layer is formed with a cutout at which the plated metal electrode layer is held in direct contact with the main top electrode layer.
摘要:
When resistor elements, common electrodes and individual electrodes are formed on a substrate, a disconnected portion, i.e., open portion is formed in one of the common electrodes. After the respective resistor elements are trimmed, the disconnected portion of the one common electrode is bridged by a conductor.
摘要:
A Ti--Al intermetallic compound has a compressibility of at least 25% at room temperature and a superior high temperature oxidation resistance and consists essentially of about 40 to 52 atomic percent of Ti, about 48 to 60 atomic percent of Al, and 10 to 1000 atomic ppm of at least one of P, As, Se, or Te.
摘要:
On the front surface of an insulating substrate, there are formed first and second terminal electrodes at one end portion of the substrate, a third terminal electrode at the other end portion, a resistor portion connected to the first and second terminal electrodes, and a capacitor portion connected to the second and third terminal electrodes. The capacitor portion has a multilayer structure consisting of a bottom electrode, dielectric layer and a top electrode.
摘要:
Disclosed are a thick-film capacitor and a chip-type composite electronic component. A pair of end electrodes are formed on the insulator substrate. A lower electrode is formed on the insulator substrate. A dielectric layer is formed on the lower electrode. An upper electrode formed on the dielectric layer. One of the lower electrode and the upper electrode has a broad-width portion having a width wider than the remaining portion thereof. The one of the lower and upper electrode at the broad-width portion is directly connected to one of the end electrodes. The thick-film capacitor is provided with a capacitor electrode arranged to provide positive connection, even where the width of the capacitor electrode is determined narrow to meet a small capacitance value.
摘要:
The present invention provides a Ti--Al intermetallic compound sheet of a thickness in the range of 0.25 to 2.5 mm formed of a Ti--Al intermetallic compound of 40 to 53 atomic percent of Ti, 0.1 to 3 atomic percent of at least one of material selected from the group consisting of Cr, Mn, V and Fe, and the balance of Al, and a Ti--Al intermetallic compound sheet producing method comprising the steps of pouring a molten Ti--Al intermetallic compound of the foregoing composition into the mold of a twin drum continuous casting machine, casting and rapidly solidifying the molten Ti--Al intermetallic compound to produce a thin cast plate of a thickness in the range of 0.25 to 2.5 mm and, when necessary, subjecting the thin cast plate to annealing and HIP treating. The Ti--Al intermetallic compound sheet has excellent mechanical and surface properties.