公开(公告)号：US20120032341A1

公开(公告)日：2012-02-09

申请号：US12947390

申请日：2010-11-16

申请人： Shin-Hua CHAO ,  Chao-Yuan LIU ,  Hui-Ying HSIEH ,  Chih-Ming CHUNG

发明人： Shin-Hua CHAO ,  Chao-Yuan LIU ,  Hui-Ying HSIEH ,  Chih-Ming CHUNG

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L24/96 ,  H01L21/56 ,  H01L23/145 ,  H01L23/295 ,  H01L23/3128 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2924/00

摘要： A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a substrate, a semiconductor element, a package body and a conductive part. The substrate has an electrical contact. The semiconductor element is disposed on the substrate. The package body covers the semiconductor element and defines a through hole from which the electrical contact is exposed. Wherein, the package body includes a resin body and a plurality of fiber layers. The fiber layers are disposed in the resin body and define a plurality of fiber apertures which is arranged as an array. The conductive part is electrically connected to the substrate through the through hole.

摘要翻译： 提供半导体封装及其制造方法。 半导体封装包括衬底，半导体元件，封装体和导电部件。 基板具有电接触。 半导体元件设置在基板上。 封装体覆盖半导体元件并且限定了电触头暴露的通孔。 其中，包装体包括树脂体和多个纤维层。 纤维层设置在树脂体中并限定多个布置成阵列的纤维孔。 导电部件通过通孔与基板电连接。