摘要:
Disclosed is an inspection method for inspecting the electrical characteristics of a device by bringing an inspecting probe into electrical contact with an inspection electrode. An insulating film formed on the surface of the inspection electrode is broken by utilizing a fritting phenomenon so as to bring the inspection electrode into electrical contact with the inspection electrode.
摘要:
Disclosed is an inspection method for inspecting the electrical characteristics of a device by bringing an inspecting probe into electrical contact with an inspection electrode. An insulating film formed on the surface of the inspection electrode is broken by utilizing a fritting phenomenon so as to bring the inspection electrode into electrical contact with the inspection electrode.
摘要:
Disclosed is an inspection method for inspecting the electrical characteristics of a device by bringing an inspecting probe into electrical contact with an inspection electrode. An insulating film formed on the surface of the inspection electrode is broken by utilizing a fritting phenomenon so as to bring the inspection electrode into electrical contact with the inspection electrode.
摘要:
Disclosed is an inspection method for inspecting the electrical characteristics of a device by bringing an inspecting probe into electrical contact with an inspection electrode. An insulating film formed on the surface of the inspection electrode is broken by utilizing a fritting phenomenon so as to bring the inspection electrode into electrical contact with the inspection electrode.
摘要:
Disclosed is an inspection method for inspecting the electrical characteristics of a device by bringing an inspecting probe into electrical contact with an inspection electrode. An insulating film formed on the surface of the inspection electrode is broken by utilizing a fritting phenomenon so as to bring the inspection electrode into electrical contact with the inspection electrode.
摘要:
Disclosed is an inspection method for inspecting the electrical characteristics of a device by bringing an inspecting probe into electrical contact with an inspection electrode. An insulating film formed on the surface of the inspection electrode is broken by utilizing a fritting phenomenon so as to bring the inspection electrode into electrical contact with the inspection electrode.
摘要:
A probe apparatus incorporated into a lighting inspection system for LCD panels, includes a store section, a process section, and a transfer section interposed between them. An examination mechanism having a probe card is arranged in an examination area of the process section. Right and left alignment areas are formed so as to interpose the examination area, and right and left work tables on which the LCD panels are to be loaded, are arranged on the right and left alignment areas, respectively. The movement of the right and left work tables is controlled by a controller, and the LCD panels on the right and left work tables are alternately examined in the examination area by the examination mechanism.
摘要:
Disclosed are a holding mechanism of a contactor and an automatic renewing mechanism of a contactor provided with the holding mechanism of the contactor. The contactor holding mechanism includes a frame (11) fixed to a performance board (P), a plurality of latch mechanisms (13) for holding the contactor inside the frame, and a suction fixing mechanism (14) for fixing the contactor held by the latch mechanisms inside the frame by a vacuum suction force. The automatic renewing mechanism of the contactor includes a holding mechanism (10) for detachably holding the contactor, and a delivery mechanism (16) for delivering the contactor (12) to and from the holding mechanism. Further, the delivery mechanism includes a suction holding section (17) for holding the contactor (12) by suction, an arm (18) having the suction holding section formed at the distal end portion and arranged swingable and movable in a vertical direction, and an arm driving section (19) for swinging and moving in a vertical direction the arm (18).
摘要:
A reliability evaluation test apparatus of this invention includes a wafer storage section which stores a wafer in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor are totally in electrical contact with each other. The wafer storage section transmits/receives a test signal to/from a measurement section and has a hermetic and heat insulating structure. The wafer storage section has a pressure mechanism which presses the contactor and a heating mechanism which directly heats the wafer totally in contact with the contactor to a predetermined high temperature. The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.
摘要:
An inspection stage including a chuck top, a rectangular Z base, an X stage, a Y stage, and a Z axis elevating mechanism. The chuck top is used for mounting a wafer W. The Z base is provided with the chuck top and is vertically movable. The X stage elevatingly supports the Z base and is movable in an X direction. The Y stage movably supports the X stage in the X direction and is movable in a Y direction. The Z axis elevating mechanism is provided at each of the four corners of the Z base in such a manner as to surround the chuck top.