摘要:
The present invention restrains, during a transfer of a substrate, a central portion of the substrate from being warped by its own weight, which might be caused by a super-enlargement of a diameter of the substrate. A substrate transfer apparatus 18 includes: a support part 17 which is moved above a substrate w of a large diameter; and an upside grip mechanism 28 disposed on the support part 17, the upside grip mechanism 28 capable of supporting a peripheral portion of the substrate w from above. The support part 17 is provided with a non-contact sucking and holding part 30 having a suction hole 31 and a blow hole 32. The non-contact sucking and holding part 30 sucks and holds the substrate w in a non-contact manner, by blowing a gas onto the central portion of the upper surface of the substrate w and sucking the central portion to form an air layer 50 such that the central portion of the wafer w is not warped.
摘要:
A reliability evaluation test apparatus of this invention includes a wafer storage section which stores a wafer in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor are totally in electrical contact with each other. The wafer storage section transmits/receives a test signal to/from a measurement section and has a hermetic and heat insulating structure. The wafer storage section has a pressure mechanism which presses the contactor and a heating mechanism which directly heats the wafer totally in contact with the contactor to a predetermined high temperature. The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.
摘要:
A conventional probe card is very complex in a support structure of probe terminals and it has been difficult to change an array of the probe terminals correspondingly to various arrays of electrode pads of an object to be checked. A contactor (1) of the present invention simultaneously sets its probe terminals in contact with a plurality of electrode pads of an object to be checked and electrical checking of the object is made once or a plurality of times. It has a plurality of first electrodes (3) arranged on a first substrate (silicon substrate) (2) and probe terminals (4) respectively provided on these electrodes (3). The probe terminal (4) has a conductive support (7) provided on the first electrode, elastic support plate (8) whose one end is fixed to the upper end of the conductive support column (7), and probe terminal (bump) 9 fixed to the free end portion of the elastic support plate (8).
摘要:
There is provided an inspection apparatus comprises, a transportation unit for transporting the object of inspection to a position opposite to the contact portion, a sucking holder movable toward and away from the contact portion and adapted to hold the object of inspection by suction; and a pressure contact mechanism provided separately from the transportation unit and adapted to press the sucking holder, thereby pressing the object of inspection against the contact portion. Thus the tranportation mechanism is separated from the pressure contact mechanism, the transportation mechanism can be reduced in weight, and the pressure contact mechanism can ensure setting of appropriate pressing. The operation time can be shortened, moreover, since the object of inspection is kept attached to the contact portion by the transportation mechanism as it is pressed against the contact portion. There is provided a transportation apparatus in which objects of transportation or inspection can be stably attracted or released without the possibility of their being broken by static electricity and without being influenced by their attitude. There is provided a temperature control apparatus used in an inspection apparatus and capable of efficiently heating or cooling an object of inspection, further, wherein a carrier plate section can be used in common for objects of inspection of different descriptions.
摘要:
A conventional probe card is very complex in a support structure of probe terminals and it has been difficult to change an array of the probe terminals correspondingly to various arrays of electrode pads of an object to be checked. A contactor (1) of the present invention simultaneously sets its probe terminals in contact with a plurality of electrode pads of an object to be checked and electrical checking of the object is made once or a plurality of times. It has a plurality of first electrodes (3) arranged on a first substrate (silicon substrate) (2) and probe terminals (4) respectively provided on these electrodes (3). The probe terminal (4) has a conductive support (7) provided on the first electrode, elastic support plate (8) whose one end is fixed to the upper end of the conductive support column (7), and probe terminal (bump) 9 fixed to the free end portion of the elastic support plate (8).
摘要:
An inspection apparatus includes a movable mounting table having a temperature control device, an elevation drive unit for vertically moving the mounting table, a controller for controlling the elevation drive unit and a probe card having probes arranged above the mounting table. The elevation drive unit includes first and second driving shafts connected to each other through coupling members to drive the mounting table, a motor for driving the first and second driving shafts, and a torque detection unit for detecting a torque between the first and second driving shafts based on a contact load between the probes and the at least one device. The controller includes a torque controller for controlling the torque based on detection results of the torque detection unit when the probe card expands or contracts due to temperature variation.
摘要:
An inspection apparatus includes a movable mounting table for mounting thereon a target object, a probe card disposed above the mounting table and a control unit for controlling the mounting table. The target object is inspected by bringing a plurality of electrode pads of the target object mounted on the mounting table into contact with a plurality of probes of the probe card with a predetermined contact load by overdriving the mounting table. Further, the mounting table includes a mounting body whose temperature is controllable, a support body for supporting the mounting body, an elevation driving mechanism provided in the support body and pressure sensors provided between the mounting body and the support body to thereby detect the contact load. The control unit controls the elevation driving mechanism in accordance with detection signals from the pressure sensors.
摘要:
A reliability evaluation test apparatus of this invention includes a wafer storage section which stores a wafer in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor are totally in electrical contact with each other. The wafer storage section transmits/receives a test signal to/from a measurement section and has a hermetic and heat insulating structure. The wafer storage section has a pressure mechanism which presses the contactor and a heating mechanism which directly heats the wafer totally in contact with the contactor to a predetermined high temperature. The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.
摘要:
A pasting method and a pasting apparatus hold a thin plate 1 and a planar member 2 in high flatness respectively on a first holding member 44 and a second holding member 44, a main controller 40a controls a moving mechanism 45 and a parallelism adjusting mechanism 52 on the basis of information provided by position recognizing mechanisms 33 and 34 to align the thin plate 1 and the carrying member 2 with each other in a predetermined positional relation. The main controller 40a controls a moving mechanism 45 so as to move the thin plate 1 and the carrying member 2 relative to each other in a state where a liquid-phase liquid crystal wax heated by a heater 49 is held between the thin plate 1 and the carrying member 2 to spread the liquid-phase liquid crystal wax over the entire surfaces of the thin plate 1 and the carrying member 2. Thus the thin plate 1, such as a semiconductor wafer or a metal foil, can be accurately, surely and efficiently pasted to the carrying member 2, and the thin plate 1 pasted to the carrying member 2 can be readily separated from the carrying member 2.
摘要:
The present invention relates to a bonding method of bonding a first object to be bonded and a second object to be bonded by a pressurizing operation. The bonding method of the present invention is a first step of causing a first holding member and a second holding member to respectively hold the first object to be bonded and the second object to be bonded in such a manner that a bonding surface of the first object to be bonded and a holding surface of the second object to be bonded face to each other, a second step of treating the bonding surface of the first object to be bonded and the holding surface of the second object to be bonded with a treatment liquid under a condition wherein the first object to be bonded and the second object to be bonded are held by the first holding member and the second holding member, and a third step of pressurizing the first object to be bonded and the second object to be bonded toward each other by the first holding member and the second holding member in order to bond both the bonding surfaces close to each other.