摘要:
Disclosed herein are an epoxy resin composition for fiber-reinforced composite materials which has low viscosity, high Tg, high elastic modulus, and excellent fracture toughness and a fiber-reinforced composite material using such an epoxy resin composition which has excellent thermal properties, compressive strength, impact resistance, fatigue resistance, and open-hole tensile strength and which is suitable for producing structural parts of aircraft and the like. The epoxy resin composition comprises at least a given bifunctional epoxy resin as a component (A), a liquid aromatic diamine curing agent as a component (B), and core-shell polymer particles as a component (C), wherein the core-shell polymer particles as the component (C) contain epoxy groups in their shell and have a volume-average particle size of 50 to 300 nm.
摘要:
Disclosed herein are an epoxy resin composition for fiber-reinforced composite materials which has low viscosity, high Tg, high elastic modulus, and excellent fracture toughness and a fiber-reinforced composite material using such an epoxy resin composition which has excellent thermal properties, compressive strength, impact resistance, fatigue resistance, and open-hole tensile strength and which is suitable for producing structural parts of aircraft and the like. The epoxy resin composition comprises at least a given bifunctional epoxy resin as a component (A), a liquid aromatic diamine curing agent as a component (B), and core-shell polymer particles as a component (C), wherein the core-shell polymer particles as the component (C) contain epoxy groups in their shell and have a volume-average particle size of 50 to 300 nm.
摘要:
A binder composition comprising [A] an amorphous polyamide with a glass transition temperature of 140° C. or higher having a dicyclohexylmethane skeleton in the molecule and [B] a sulfonamide compound is used to provide a binder composition, a reinforcing-fiber base material and a preform respectively most suitable for RTM, which respectively exhibit excellent impact resistance and physical properties remaining stable over the variations of molding conditions and can be used for producing a fiber-reinforced composite material most suitable for members such as primary structures of aircraft.
摘要:
A binder composition comprising [A] an amorphous polyamide with a glass transition temperature of 140° C. or higher having a dicyclohexylmethane skeleton in the molecule and [B] a sulfonamide compound is used to provide a binder composition, a reinforcing-fiber base material and a preform respectively most suitable for RTM, which respectively exhibit excellent impact resistance and physical properties remaining stable over the variations of molding conditions and can be used for producing a fiber-reinforced composite material most suitable for members such as primary structures of aircraft.
摘要:
In automatic development of the higher hierarchic logic into the lower hierarchic logic in a hierarchic logic designing, identification codes are beforehand assigned to logic components of the higher hierarchic logic, and the identification codes are also assigned to the lower hierarchic logic data when developing the higher hierarchic logic into the lower hierarchic logic in order to establish correspondences between the higher and lower hierarchic logic, thereby allowing a higher-speed logic compare operation with respect to a design change on the higher or lower hierarchic logic and enabling the automatic update of the lower hierarchic logic by use of the higher hierarchic logic as the master.
摘要:
A temperature compensating circuit includes a first circuit network 1 between an inverting input terminal of an operational amplifier 13 and an output terminal of the operational amplifier 13, and a second circuit network 2 between the inverting input terminal of the operational amplifier 13 and a reference potential. At least one of the first circuit network and the second circuit network is made of an arrangement containing a plurality of series-connected thermistor/resistor pairs in which the thermistors are connected parallel to the resistors, and the temperature compensating circuit compensates a temperature-dependent signal which is inputted into a positive phase input terminal of the operational amplifier 13, and outputs the temperature-compensated signal.
摘要:
A temperature compensating circuit includes a first circuit network 1 between an inverting input terminal of an operational amplifier 13 and an output terminal of the operational amplifier 13, and a second circuit network 2 between the inverting input terminal of the operational amplifier 13 and a reference potential. At least one of the first circuit network and the second circuit network is made of an arrangement containing a plurality of series-connected thermistor/resistor pairs in which the thermistors are connected parallel to the resistors, and the temperature compensating circuit compensates a temperature-dependent signal which is inputted into a positive phase input terminal of the operational amplifier 13, and outputs the temperature-compensated signal.
摘要:
A computer implemented logic simulation method, for inspecting logical operations of large scale logic circuits, computes a variation of an output of at least one latch in a clock synchronized logic circuit. The clock-synchronized logic circuit contains a combination logic circuit and a plurality of logic gates. Each of the logic gates have at least one input signal and several other inputs connected to clocking signal sources of different phases. The latch is activated by the rise or fall of the clock signals for holding the output from the combination logic circuit. The method thus implements sampling instants of the output for ascertaining the logical operations of the large scale circuits.
摘要:
A logic simulation is executed using a real circuit as a part of a simulation model of a logic circuit subjected to the logic simulation. The simulation model is formed of the real circuit and a simulation circuit, and the operation of the real circuit and the logic simulation of the simulation circuit are performed alternately. The operation of the real circuit is performed in response to an input signal thereto representing the condition of the output node of the simulation circuit, while the logic simulation of the simulation circuit is executed in response to a stimulus in the form of an output signal of the real circuit which is applied to the input node of the simulation circuit.