公开(公告)号：US08461013B2

公开(公告)日：2013-06-11

申请号：US12776870

申请日：2010-05-10

申请人： Shinji Maekawa ,  Gen Fujii ,  Junya Maruyama ,  Toru Takayama ,  Yumiko Fukumoto ,  Yasuyuki Arai

发明人： Shinji Maekawa ,  Gen Fujii ,  Junya Maruyama ,  Toru Takayama ,  Yumiko Fukumoto ,  Yasuyuki Arai

IPC分类号： H01L21/76

CPC分类号： G06K19/07749 ,  H01L27/12 ,  H01L27/1285 ,  H01L27/1292 ,  H01L27/13 ,  H01L29/66757 ,  H01L29/66765 ,  H01L29/78603 ,  H01L29/78684

摘要： An IC card is more expensive than a magnetic card, and an electronic tag is also more expensive as a substitute for bar codes. Therefore, the present invention provides an extremely thin integrated circuit that can be mass-produced at low cost unlike a chip of a conventional silicon wafer, and a manufacturing method thereof. One feature of the present invention is that a thin integrated circuit is formed by a formation method that can form a pattern selectively, on a glass substrate, a quartz substrate, a stainless substrate, a substrate made of synthetic resin having flexibility, such as acryl, or the like except for a bulk substrate. Further, another feature of the present invention is that an ID chip in which a thin film integrated circuit and an antenna according to the present invention are mounted is formed.

摘要翻译： IC卡比磁卡贵，电子标签也更昂贵代替条形码。 因此，本发明提供了与常规硅晶片的芯片相比可以以低成本批量生产的极薄的集成电路及其制造方法。 本发明的一个特征在于，通过可以在玻璃基板，石英基板，不锈钢基板，具有柔软性的合成树脂制成的基板（例如丙烯酸酯）上形成图案的形成方法形成薄的集成电路 ，或类似物，除了大量衬底。 此外，本发明的另一个特征是形成其中安装有根据本发明的薄膜集成电路和天线的ID芯片。

公开(公告)号：US07727854B2

公开(公告)日：2010-06-01

申请号：US10573155

申请日：2004-12-14

申请人： Shinji Maekawa ,  Gen Fujii ,  Junya Maruyama ,  Toru Takayama ,  Yumiko Fukumoto ,  Yasuyuki Arai

发明人： Shinji Maekawa ,  Gen Fujii ,  Junya Maruyama ,  Toru Takayama ,  Yumiko Fukumoto ,  Yasuyuki Arai

IPC分类号： H01L21/76

CPC分类号： G06K19/07749 ,  H01L27/12 ,  H01L27/1285 ,  H01L27/1292 ,  H01L27/13 ,  H01L29/66757 ,  H01L29/66765 ,  H01L29/78603 ,  H01L29/78684

摘要： An IC card is more expensive than a magnetic card, and an electronic tag is also more expensive as a substitute for bar codes. Therefore, the present invention provides an extremely thin integrated circuit that can be mass-produced at low cost unlike a chip of a conventional silicon wafer, and a manufacturing method thereof. One feature of the present invention is that a thin integrated circuit is formed by a formation method that can form a pattern selectively, on a glass substrate, a quartz substrate, a stainless substrate, a substrate made of synthetic resin having flexibility, such as acryl, or the like except for a bulk substrate. Further, another feature of the present invention is that an ID chip in which a thin film integrated circuit and an antenna according to the present invention are mounted is formed.

摘要翻译： IC卡比磁卡贵，电子标签也更昂贵代替条形码。 因此，本发明提供了与常规硅晶片的芯片相比可以以低成本批量生产的极薄的集成电路及其制造方法。 本发明的一个特征在于，通过可以在玻璃基板，石英基板，不锈钢基板，具有柔软性的合成树脂制成的基板（例如丙烯酸酯）上形成图案的形成方法形成薄的集成电路 ，或类似物，除了大量衬底。 此外，本发明的另一个特征是形成其中安装有根据本发明的薄膜集成电路和天线的ID芯片。

公开(公告)号：US20070004100A1

公开(公告)日：2007-01-04

申请号：US10573155

申请日：2004-12-14

申请人： Shinji Maekawa ,  Gen Fujii ,  Junya Maruyama ,  Toru Takayama ,  Yumiko Fukumoto ,  Yasuyuki Arai

发明人： Shinji Maekawa ,  Gen Fujii ,  Junya Maruyama ,  Toru Takayama ,  Yumiko Fukumoto ,  Yasuyuki Arai

IPC分类号： H01L21/84 ,  H01L31/113

CPC分类号： G06K19/07749 ,  H01L27/12 ,  H01L27/1285 ,  H01L27/1292 ,  H01L27/13 ,  H01L29/66757 ,  H01L29/66765 ,  H01L29/78603 ,  H01L29/78684

摘要： An IC card is more expensive than a magnetic card, and an electronic tag is also more expensive as a substitute for bar codes. Therefore, the present invention provides an extremely thin integrated circuit that can be mass-produced at low cost unlike a chip of a conventional silicon wafer, and a manufacturing method thereof. One feature of the present invention is that a thin integrated circuit is formed by a formation method that can form a pattern selectively, on a glass substrate, a quartz substrate, a stainless substrate, a substrate made of synthetic resin having flexibility, such as acryl, or the like except for a bulk substrate. Further, another feature of the present invention is that an ID chip in which a thin film integrated circuit and an antenna according to the present invention are mounted is formed.

摘要翻译： IC卡比磁卡贵，电子标签也更昂贵代替条形码。 因此，本发明提供了与常规硅晶片的芯片相比可以以低成本批量生产的极薄的集成电路及其制造方法。 本发明的一个特征在于，通过可以在玻璃基板，石英基板，不锈钢基板，具有柔软性的合成树脂制成的基板（例如丙烯酸酯）上形成图案的形成方法形成薄的集成电路 ，或类似物，除了大量衬底。 此外，本发明的另一个特征是形成其中安装有根据本发明的薄膜集成电路和天线的ID芯片。

公开(公告)号：US08673739B2

公开(公告)日：2014-03-18

申请号：US13303519

申请日：2011-11-23

申请人： Toru Takayama ,  Yuugo Goto ,  Yumiko Fukumoto ,  Junya Maruyama ,  Takuya Tsurume

发明人： Toru Takayama ,  Yuugo Goto ,  Yumiko Fukumoto ,  Junya Maruyama ,  Takuya Tsurume

IPC分类号： H01L21/30

CPC分类号： H01L27/1266 ,  H01L27/1214 ,  H01L33/0079

摘要： It is an object of the invention to provide a lightweight semiconductor device having a highly reliable sealing structure which can prevent ingress of impurities such as moisture that deteriorate element characteristics, and a method of manufacturing thereof. A protective film having superior gas barrier properties (which is a protective film that is likely to damage an element if the protective film is formed on the element directly) is previously formed on a heat-resistant substrate other than a substrate with the element formed thereon. The protective film is peeled off from the heat-resistant substrate, and transferred over the substrate with the element formed thereon so as to seal the element.

摘要翻译： 本发明的目的是提供一种具有高度可靠的密封结构的轻质半导体器件及其制造方法，该密封结构能够防止元素特性恶化的诸如水分等杂质的侵入。 具有优异阻气性的保护膜（其是如果在元件上直接形成保护膜时可能损坏元件的保护膜）预先在其上形成有元件的基板之外的耐热基板上形成 。 保护膜从耐热基材上剥离，并在其上形成的元件在基板上转印以密封元件。

公开(公告)号：US07622361B2

公开(公告)日：2009-11-24

申请号：US11822609

申请日：2007-07-09

申请人： Yuugo Goto ,  Yumiko Fukumoto ,  Toru Takayama ,  Junya Maruyama ,  Takuya Tsurume

发明人： Yuugo Goto ,  Yumiko Fukumoto ,  Toru Takayama ,  Junya Maruyama ,  Takuya Tsurume

IPC分类号： H01L21/46 ,  H01L21/30 ,  H01L21/78 ,  H01L21/301

CPC分类号： H01L27/1266 ,  G02F2001/13613 ,  H01L27/3246 ,  H01L51/524 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/56 ,  H01L2221/68368 ,  H01L2227/323 ,  H01L2227/326 ,  Y10S438/976 ,  Y10S438/977

摘要： It is an object of the invention to provide a peeling method which does not damage a peeling layer, and to perform peeling not only a peeling layer having a small-size area but also an entire peeling layer having a large-size area with a preferable yield. In the invention, after pasting a fixing substrate, a part of a glass substrate is removed by scribing or performing laser irradiation on the glass substrate which leads to providing a trigger. Then, peeling is performed with a preferable yield by performing peeling from the removed part. In addition, a crack is prevented by covering the entire face except for a connection portion of a terminal electrode (including a periphery region of the terminal electrode) with a resin.

摘要翻译： 本发明的目的是提供一种不会损伤剥离层的剥离方法，并且不仅剥离具有小尺寸区域的剥离层，而且还可以剥离具有大尺寸区域的整个剥离层 产量。 在本发明中，在粘贴固定基板之后，通过在导致提供触发的玻璃基板上划线或进行激光照射来去除玻璃基板的一部分。 然后，通过从去除部分剥离而以优选的收率进行剥离。 此外，通过用树脂覆盖端子电极（包括端子电极的周边区域）的连接部分以外的整个面来防止裂纹。

公开(公告)号：US20050112805A1

公开(公告)日：2005-05-26

申请号：US10967279

申请日：2004-10-19

申请人： Yuugo Goto ,  Yumiko Fukumoto ,  Toru Takayama ,  Junya Maruyama ,  Takuya Tsurume

发明人： Yuugo Goto ,  Yumiko Fukumoto ,  Toru Takayama ,  Junya Maruyama ,  Takuya Tsurume

IPC分类号： H01L29/786 ,  H01L21/762 ,  H01L21/77 ,  H01L21/84 ,  H01L27/12 ,  H01L27/32 ,  H01L51/52 ,  H01L51/56 ,  H01L21/00

CPC分类号： H01L27/1266 ,  G02F2001/13613 ,  H01L27/3246 ,  H01L51/524 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/56 ,  H01L2221/68368 ,  H01L2227/323 ,  H01L2227/326 ,  Y10S438/976 ,  Y10S438/977

摘要： It is an object of the invention to provide a peeling method which does not damage a peeling layer, and to perform peeling not only a peeling layer having a small-size area but also an entire peeling layer having a large-size area with a preferable yield. In the invention, after pasting a fixing substrate, a part of a glass substrate is removed by scribing or performing laser irradiation on the glass substrate which leads to providing a trigger. Then, peeling is performed with a preferable yield by performing peeling from the removed part. In addition, a crack is prevented by covering the entire face except for a connection portion of a terminal electrode (including a periphery region of the terminal electrode) with a resin.

摘要翻译： 本发明的目的是提供一种不会损伤剥离层的剥离方法，并且不仅剥离具有小尺寸区域的剥离层，而且还可以剥离具有大尺寸区域的整个剥离层 产量。 在本发明中，在粘贴固定基板之后，通过在导致提供触发的玻璃基板上划线或进行激光照射来去除玻璃基板的一部分。 然后，通过从去除部分剥离而以优选的收率进行剥离。 此外，通过用树脂覆盖端子电极（包括端子电极的周边区域）的连接部分以外的整个面来防止裂纹。

公开(公告)号：US07883989B2

公开(公告)日：2011-02-08

申请号：US12578722

申请日：2009-10-14

申请人： Yuugo Goto ,  Yumiko Fukumoto ,  Toru Takayama ,  Junya Maruyama ,  Takuya Tsurume

发明人： Yuugo Goto ,  Yumiko Fukumoto ,  Toru Takayama ,  Junya Maruyama ,  Takuya Tsurume

IPC分类号： H01L21/46 ,  H01L21/30 ,  H01L21/78 ,  H01L21/301

CPC分类号： H01L27/1266 ,  G02F2001/13613 ,  H01L27/3246 ,  H01L51/524 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/56 ,  H01L2221/68368 ,  H01L2227/323 ,  H01L2227/326 ,  Y10S438/976 ,  Y10S438/977

摘要： It is an object of the invention to provide a peeling method which does not damage a peeling layer, and to perform peeling not only a peeling layer having a small-size area but also an entire peeling layer having a large-size area with a preferable yield. In the invention, after pasting a fixing substrate, a part of a glass substrate is removed by scribing or performing laser irradiation on the glass substrate which leads to providing a trigger. Then, peeling is performed with a preferable yield by performing peeling from the removed part. In addition, a crack is prevented by covering the entire face except for a connection portion of a terminal electrode (including a periphery region of the terminal electrode) with a resin.

摘要翻译： 本发明的目的是提供一种不会损伤剥离层的剥离方法，并且不仅剥离具有小尺寸区域的剥离层，而且还可以剥离具有大尺寸区域的整个剥离层 产量。 在本发明中，在粘贴固定基板之后，通过在导致提供触发的玻璃基板上划线或进行激光照射来去除玻璃基板的一部分。 然后，通过从去除部分剥离而以优选的收率进行剥离。 此外，通过用树脂覆盖端子电极（包括端子电极的周边区域）的连接部分以外的整个面来防止裂纹。

公开(公告)号：US07595256B2

公开(公告)日：2009-09-29

申请号：US11798094

申请日：2007-05-10

申请人： Toru Takayama ,  Yuugo Goto ,  Yumiko Fukumoto ,  Junya Maruyama ,  Takuya Tsurume

发明人： Toru Takayama ,  Yuugo Goto ,  Yumiko Fukumoto ,  Junya Maruyama ,  Takuya Tsurume

IPC分类号： H01L21/30 ,  H01L21/46

CPC分类号： H01L27/1266 ,  H01L27/1214 ,  H01L33/0079

摘要： It is an object of the invention to provide a lightweight semiconductor device having a highly reliable sealing structure which can prevent ingress of impurities such as moisture that deteriorate element characteristics, and a method of manufacturing thereof. A protective film having superior gas barrier properties (which is a protective film that is likely to damage an element if the protective film is formed on the element directly) is previously formed on a heat-resistant substrate other than a substrate with the element formed thereon. The protective film is peeled off from the heat-resistant substrate, and transferred over the substrate with the element formed thereon so as to seal the element.

摘要翻译： 本发明的目的是提供一种具有高度可靠的密封结构的轻质半导体器件及其制造方法，该密封结构能够防止元素特性恶化的诸如水分等杂质的侵入。 具有优异阻气性的保护膜（其是如果在元件上直接形成保护膜时可能损坏元件的保护膜）预先在其上形成有元件的基板之外的耐热基板上形成 。 保护膜从耐热基材上剥离，并在其上形成的元件在基板上转印以密封元件。

公开(公告)号：US20080009106A1

公开(公告)日：2008-01-10

申请号：US11822609

申请日：2007-07-09

申请人： Yuugo Goto ,  Yumiko Fukumoto ,  Toru Takayama ,  Junya Maruyama ,  Takuya Tsurume

发明人： Yuugo Goto ,  Yumiko Fukumoto ,  Toru Takayama ,  Junya Maruyama ,  Takuya Tsurume

IPC分类号： H01L21/46 ,  H01L21/84

CPC分类号： H01L27/1266 ,  G02F2001/13613 ,  H01L27/3246 ,  H01L51/524 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/56 ,  H01L2221/68368 ,  H01L2227/323 ,  H01L2227/326 ,  Y10S438/976 ,  Y10S438/977

摘要： It is an object of the invention to provide a peeling method which does not damage a peeling layer, and to perform peeling not only a peeling layer having a small-size area but also an entire peeling layer having a large-size area with a preferable yield. In the invention, after pasting a fixing substrate, a part of a glass substrate is removed by scribing or performing laser irradiation on the glass substrate which leads to providing a trigger. Then, peeling is performed with a preferable yield by performing peeling from the removed part. In addition, a crack is prevented by covering the entire face except for a connection portion of a terminal electrode (including a periphery region of the terminal electrode) with a resin.

摘要翻译： 本发明的目的是提供一种不会损伤剥离层的剥离方法，并且不仅剥离具有小尺寸区域的剥离层，而且还可以剥离具有大尺寸区域的整个剥离层 产量。 在本发明中，在粘贴固定基板之后，通过在导致提供触发的玻璃基板上划线或进行激光照射来去除玻璃基板的一部分。 然后，通过从去除部分剥离而以优选的收率进行剥离。 此外，通过用树脂覆盖端子电极（包括端子电极的周边区域）的连接部分以外的整个面来防止裂纹。

公开(公告)号：US07241666B2

公开(公告)日：2007-07-10

申请号：US10967279

申请日：2004-10-19

申请人： Yuugo Goto ,  Yumiko Fukumoto ,  Toru Takayama ,  Junya Maruyama ,  Takuya Tsurume

发明人： Yuugo Goto ,  Yumiko Fukumoto ,  Toru Takayama ,  Junya Maruyama ,  Takuya Tsurume

IPC分类号： H01L21/46 ,  H01L21/30 ,  H01L21/84 ,  H01L21/20

CPC分类号： H01L27/1266 ,  G02F2001/13613 ,  H01L27/3246 ,  H01L51/524 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/56 ,  H01L2221/68368 ,  H01L2227/323 ,  H01L2227/326 ,  Y10S438/976 ,  Y10S438/977

摘要： It is an object of the invention to provide a peeling method which does not damage a peeling layer, and to perform peeling not only a peeling layer having a small-size area but also an entire peeling layer having a large-size area with a preferable yield. In the invention, after pasting a fixing substrate, a part of a glass substrate is removed by scribing or performing laser irradiation on the glass substrate which leads to providing a trigger. Then, peeling is performed with a preferable yield by performing peeling from the removed part. In addition, a crack is prevented by covering the entire face except for a connection portion of a terminal electrode (including a periphery region of the terminal electrode) with a resin.

摘要翻译： 本发明的目的是提供一种不会损伤剥离层的剥离方法，并且不仅剥离具有小尺寸区域的剥离层，而且还可以剥离具有大尺寸区域的整个剥离层 产量。 在本发明中，在粘贴固定基板之后，通过在导致提供触发的玻璃基板上划线或进行激光照射来去除玻璃基板的一部分。 然后，通过从去除部分剥离而以优选的收率进行剥离。 此外，通过用树脂覆盖端子电极（包括端子电极的周边区域）的连接部分以外的整个面来防止裂纹。