公开(公告)号：US20100211291A1

公开(公告)日：2010-08-19

申请号：US12510365

申请日：2009-07-28

申请人： Shinya Sumitani ,  Kazuhiko Ooshima

发明人： Shinya Sumitani ,  Kazuhiko Ooshima

IPC分类号： F02D45/00

CPC分类号： F02D41/0085 ,  F02D41/1498 ,  F02D41/16 ,  F02D41/221 ,  F02D41/34 ,  Y02T10/44

摘要： An abnormality detection device determines whether an injection correction amount of each cylinder at the time when maximum rotation numbers are equalized is outside a normal range if the equalization of the maximum rotation numbers among cylinders is completed in an idle stable state. The abnormality detection device determines that an abnormality exists on an injector side if the injection correction amount of a specific cylinder is outside the normal range and a rotation number fluctuation difference of the specific cylinder is in a normal range. The abnormality detection device determines that the abnormality exists on an engine side if the injection correction amount of a specific cylinder is outside the normal range and the rotation number fluctuation difference of the specific cylinder is outside the normal range.

摘要翻译： 如果在空转稳定状态下完成气缸中的最大转数的均衡，则异常检测装置判定在最大转数是否相等的情况下，每个气缸的喷射校正量是否在正常范围之外。 如果特定气缸的喷射校正量在正常范围之外且特定气缸的旋转数差异在正常范围内，则异常检测装置确定在喷射器侧存在异常。 如果特定气缸的喷射校正量超出正常范围并且特定气缸的旋转数差异超出正常范围，则异常检测装置确定在发动机侧存在异常。

公开(公告)号：US07384595B2

公开(公告)日：2008-06-10

申请号：US10968033

申请日：2004-10-20

申请人： Kazuhiko Ooshima ,  Yuichi Terashita ,  Momoko Shizukuishi ,  Hideo Shite ,  Kousuke Yoshihara

发明人： Kazuhiko Ooshima ,  Yuichi Terashita ,  Momoko Shizukuishi ,  Hideo Shite ,  Kousuke Yoshihara

IPC分类号： F27D11/00

CPC分类号： H01L21/67109 ,  F27B17/0025 ,  H01L21/67748 ,  H01L21/67751

摘要： A heat-treating apparatus comprises a table having a heating element buried therein, a plate-like target object to be processed being disposed on the table so as to be heated to a prescribed temperature, a support member for supporting the target object and movable in the vertical direction relative to the table such that the support member is moved to permit the target object supported by the support member to be disposed on the table or is moved away from the table, a cover surrounding the upper portion of the table, and a casing surrounding the lower portion of the table and combined with the cover so as to form a process chamber. When the process chamber is opened, the support member permits the target object to be housed inside the cover.

摘要翻译： 一种热处理装置，具有埋设有加热元件的工作台，将要加工的板状待处理对象物放置在工作台上以被加热到规定温度的状态下， 相对于桌子的垂直方向，使得支撑构件被移动以允许由支撑构件支撑的目标对象被布置在桌子上或者被移动离开桌子，围绕桌子的上部的盖子以及 壳体围绕桌子的下部并与盖组合以形成处理室。 当处理室打开时，支撑构件允许目标物体容纳在盖内。

公开(公告)号：US08858710B2

公开(公告)日：2014-10-14

申请号：US12216992

申请日：2008-07-14

申请人： Kouichi Mizunaga ,  Hiroyuki Kudoh ,  Kazuhiko Ooshima

发明人： Kouichi Mizunaga ,  Hiroyuki Kudoh ,  Kazuhiko Ooshima

IPC分类号： C23C16/00 ,  C23C16/455 ,  C23C16/448 ,  H01L21/67

CPC分类号： H01L21/67017

摘要： An object is to suppress differences in concentration between processing gases supplied to a plurality of works in a chemical solution vaporizing tank. The chemical solution vaporizing tank includes a tank body having a plurality of vaporizing chambers formed by laterally and airtightly partitioning an internal space of the tank body, a chemical solution passage located under a liquid level in each vaporizing chamber and formed at each partition member for passing the chemical solution between the vaporizing chambers, and a gas passage located above the liquid level in each vaporizing chamber and formed at the partition member to communicate the vaporizing chambers with each other for uniformizing pressures in the respective vaporizing chambers. A quantity of the channel layer in each vaporizing chamber is controlled by managing, e.g., the liquid level.

摘要翻译： 目的是抑制供给到化学溶液蒸发槽中的多个工件的处理气体之间的浓度差。 化学溶液蒸发槽包括：罐主体，其具有多个蒸发室，其通过横向和气密地分隔罐体的内部空间形成;蒸发室，位于每个蒸发室内的液面下方的化学溶液通道，并形成在每个分隔件上， 蒸发室之间的化学溶液和位于每个蒸发室中的液面以上的气体通道，并形成在分隔构件上，以使蒸发室彼此连通，使各蒸发室中的压力均匀化。 每个蒸发室中的通道层的量通过管理例如液面来控制。

公开(公告)号：US20120088203A1

公开(公告)日：2012-04-12

申请号：US13241848

申请日：2011-09-23

申请人： Kouichi Mizunaga ,  Kazuhiko Ooshima ,  Yasuhiro Takaki

发明人： Kouichi Mizunaga ,  Kazuhiko Ooshima ,  Yasuhiro Takaki

IPC分类号： F27D5/00

CPC分类号： H01L21/67178 ,  H01L21/67109 ,  H01L21/6719 ,  H01L21/68707 ,  H01L21/6875

摘要： Disclosed is a heat treatment apparatus which includes a plurality of first disposing support members having an extendable elastic member to provide a first gap distance between a substrate disposing surface of a heat treatment plate and the rear surface of the substrate; a plurality of second disposing support members providing a second gap distance, which is smaller than the first gap distance, between the substrate disposing surface and the rear surface of the substrate; and a plurality of suction holes disposed at the substrate disposing surface of the heat treatment plate and sucking a space of the gap between the substrate disposing surface and the rear surface of the substrate, in which the substrate supported on the first disposing support member is sucked by the suction holes, such that the first disposing support member is contracted and the substrate is supported on the second disposing support member.

摘要翻译： 公开了一种热处理设备，其包括多个第一布置支撑构件，其具有可延伸的弹性构件，以在热处理板的基板设置表面和基板的后表面之间提供第一间隙距离; 多个第二布置支撑构件，其在所述基板设置表面和所述基板的后表面之间提供小于所述第一间隙距离的第二间隙距离; 以及多个吸入孔，其设置在所述热处理板的所述基板配置面上，并且吸取所述基板配置面与所述基板的背面之间的间隙的空间，所述基板的支撑在所述第一布置支撑部件上的所述基板被吸入 通过吸孔，使得第一布置支撑构件收缩，并且将基板支撑在第二布置支撑构件上。

公开(公告)号：US20140014644A1

公开(公告)日：2014-01-16

申请号：US14008373

申请日：2012-03-28

申请人： Hironori Akiba ,  Kazuhiko Kubota ,  Tsutomu Hatanaka ,  Yuichi Sakai ,  Akira Yonemizu ,  Kazuhiko Ooshima

发明人： Hironori Akiba ,  Kazuhiko Kubota ,  Tsutomu Hatanaka ,  Yuichi Sakai ,  Akira Yonemizu ,  Kazuhiko Ooshima

IPC分类号： H01L21/02

CPC分类号： H01L21/02002 ,  H01L21/67103 ,  H01L21/68728 ,  H01L21/68785 ,  H05B3/143

摘要： A heating device includes a substrate in a form of a face plate that is positioned above a base plate, on which a wafer is placed, and to which a film heater for heating wafer is provided, columns that are vertically provided between the base plate and the face plate and support the face plate, and tension members that pull the face plate toward the base plate. The columns and the tension members are positioned to support or pull at least a part of the face plate corresponding to a placement region of the wafer. Each of the tension members includes a shaft having an upper end locked by the face plate and a lower end penetrating the base plate and a coil spring that is positioned on the base plate and biases the lower end of the shaft downward.

摘要翻译： 加热装置包括位于基板上方的面板形状的基板，晶片被放置在基板上，并且设置有用于加热晶片的薄膜加热器，垂直设置在基板和 面板和支撑面板，以及将面板拉向底板的张紧构件。 柱和张紧构件定位成支撑或拉动对应于晶片的放置区域的面板的至少一部分。 每个张力构件包括具有被面板锁定的上端和穿过基板的下端的轴，以及定位在基板上的螺旋弹簧，并且将轴的下端偏压到下方。

公开(公告)号：US20090020072A1

公开(公告)日：2009-01-22

申请号：US12216992

申请日：2008-07-14

申请人： Kouichi Mizunaga ,  Hiroyuki Kudoh ,  Kazuhiko Ooshima

发明人： Kouichi Mizunaga ,  Hiroyuki Kudoh ,  Kazuhiko Ooshima

IPC分类号： C23C16/00 ,  B05C11/10

CPC分类号： H01L21/67017

摘要： An object is to suppress differences in concentration between processing gases supplied to a plurality of works in a chemical solution vaporizing tank. The chemical solution vaporizing tank includes a tank body having a plurality of vaporizing chambers formed by laterally and airtightly partitioning an internal space of the tank body, a chemical solution passage located under a liquid level in each vaporizing chamber and formed at each partition member for passing the chemical solution between the vaporizing chambers, and a gas passage located above the liquid level in each vaporizing chamber and formed at the partition member to communicate the vaporizing chambers with each other for uniformizing pressures in the respective vaporizing chambers. A quantity of the channel layer in each vaporizing chamber is controlled by managing, e.g., the liquid level.

摘要翻译： 目的是抑制供给化学溶液蒸发槽中的多个工件的处理气体之间的浓度差异。 化学溶液蒸发槽包括：罐本体，具有多个蒸发室，其形成为横向和气密地分隔罐体的内部空间，位于每个蒸发室内的液面下方的化学溶液通道，并形成在每个分隔构件上用于通过 蒸发室之间的化学溶液和位于每个蒸发室中的液面上方的气体通道，并形成在分隔构件上，以使蒸发室彼此连通，使各蒸发室中的压力均匀化。 每个蒸发室中的通道层的量通过管理例如液面来控制。

公开(公告)号：US20070166655A1

公开(公告)日：2007-07-19

申请号：US11617183

申请日：2006-12-28

申请人： Kazuhiko Ooshima ,  Shigeki Aoki

发明人： Kazuhiko Ooshima ,  Shigeki Aoki

IPC分类号： B01J3/04

CPC分类号： H01L21/67109 ,  H01L21/67017 ,  H01L21/6719

摘要： A thermal processing apparatus for thermally processing a substrate in a processing chamber includes a heating plate for mounting and thermally processing the substrate thereon, and a lid body covering the heating plate from above to constitute a portion of the processing chamber. The lid body has a ceiling plate and a peripheral side portion vertically provided at a peripheral end portion of the ceiling plate. The ceiling plate is provided with a supply port for supplying a gas into the processing chamber, and a side portion of the ceiling plate is provided with a plurality of exhaust ports for exhausting the gas in the processing chamber. An exhaust pipe communicating with the exhaust ports and having an outlet at a point at equal distances from the exhaust ports is provided to be attachable and detachable to/from the lid body. According to the present invention, the maintenance work against clogging due to the impurities such as a sublimate and the like generated by the thermal processing can be easily performed.

摘要翻译： 用于在处理室中热处理基板的热处理装置包括：用于在其上安装和热处理基板的加热板;以及从上方覆盖加热板的盖体，以构成处理室的一部分。 盖体具有顶板和垂直设置在顶板的周端部的周边部分。 天花板设置有用于向处理室供应气体的供给口，并且顶板的侧部设置有用于排出处理室中的气体的多个排气口。 设置与排气口连通并且在与排气口等距离的点处具有出口的排气管，以便能够与盖体相连接和拆卸。 根据本发明，可以容易地进行由热处理产生的诸如升华等杂质的堵塞的维护工作。

公开(公告)号：US20140014643A1

公开(公告)日：2014-01-16

申请号：US14008287

申请日：2012-03-28

申请人： Hironori Akiba ,  Kazuhiko Kubota ,  Tsutomu Hatanaka ,  Yuichi Sakai ,  Akira Yonemizu ,  Kazuhiko Ooshima

发明人： Hironori Akiba ,  Kazuhiko Kubota ,  Tsutomu Hatanaka ,  Yuichi Sakai ,  Akira Yonemizu ,  Kazuhiko Ooshima

IPC分类号： H01L21/67

CPC分类号： H01L21/67103 ,  H01L21/67098 ,  H01L21/68728 ,  H01L21/68785

摘要： A heating device includes a base plate and a face plate that is provided above the base plate and on which a wafer is placed. The face plate includes an aluminum substrate, a film heater that is provided to the aluminum substrate and heats the wafer, and a gap ball that is disposed on the aluminum substrate and interposed between the aluminum substrate and the wafer. The aluminum substrate is provided with a second attachment hole into which the gap ball is press-fitted. The gap ball is held only by an inner wall of the second attachment hole by being press-fitted.

摘要翻译： 加热装置包括基板和面板，其设置在基板上方并且放置有晶片。 面板包括铝基板，设置在铝基板上并加热晶片的薄膜加热器，以及设置在铝基板上且介于铝基板和晶片之间的间隙球。 铝基板设置有第二安装孔，间隙球被压配入其中。 间隙球仅由第二安装孔的内壁通过压配而保持。

公开(公告)号：US07802986B2

公开(公告)日：2010-09-28

申请号：US11617183

申请日：2006-12-28

申请人： Kazuhiko Ooshima ,  Shigeki Aoki

发明人： Kazuhiko Ooshima ,  Shigeki Aoki

IPC分类号： F27D1/18

CPC分类号： H01L21/67109 ,  H01L21/67017 ,  H01L21/6719

摘要： A thermal processing apparatus for thermally processing a substrate in a processing chamber includes a heating plate for mounting and thermally processing the substrate thereon, and a lid body covering the heating plate from above to constitute a portion of the processing chamber. The lid body has a ceiling plate and a peripheral side portion vertically provided at a peripheral end portion of the ceiling plate. The ceiling plate is provided with a supply port for supplying a gas into the processing chamber, and a side portion of the ceiling plate is provided with a plurality of exhaust ports for exhausting the gas in the processing chamber. An exhaust pipe communicating with the exhaust ports and having an outlet at a point at equal distances from the exhaust ports is provided to be attachable and detachable to/from the lid body. According to the present invention, the maintenance work against clogging due to the impurities such as a sublimate and the like generated by the thermal processing can be easily performed.

摘要翻译： 用于在处理室中热处理基板的热处理装置包括：用于在其上安装和热处理基板的加热板;以及从上方覆盖加热板的盖体，以构成处理室的一部分。 盖体具有顶板和垂直设置在顶板的周端部的周边部分。 天花板设置有用于向处理室供应气体的供给口，并且顶板的侧部设置有用于排出处理室中的气体的多个排气口。 设置与排气口连通并且在与排气口等距离的点处具有出口的排气管，以便能够与盖体相连接和拆卸。 根据本发明，可以容易地进行由热处理产生的诸如升华等杂质的堵塞的维护工作。

公开(公告)号：US20050173396A1

公开(公告)日：2005-08-11

申请号：US10968033

申请日：2004-10-20

申请人： Kazuhiko Ooshima ,  Yuichi Terashita ,  Momoko Shizukuishi ,  Hideo Shite ,  Kousuke Yoshihara

发明人： Kazuhiko Ooshima ,  Yuichi Terashita ,  Momoko Shizukuishi ,  Hideo Shite ,  Kousuke Yoshihara

IPC分类号： F27B17/00 ,  F27D11/00 ,  H01L21/00 ,  H01L21/677

CPC分类号： H01L21/67109 ,  F27B17/0025 ,  H01L21/67748 ,  H01L21/67751

摘要： A heat-treating apparatus comprises a table having a heating element buried therein, a plate-like target object to be processed being disposed on the table so as to be heated to a prescribed temperature, a support member for supporting the target object and movable in the vertical direction relative to the table such that the support member is moved to permit the target object supported by the support member to be disposed on the table or is moved away from the table, a cover surrounding the upper portion of the table, and a casing surrounding the lower portion of the table and combined with the cover so as to form a process chamber. When the process chamber is opened, the support member permits the target object to be housed inside the cover.

摘要翻译： 一种热处理装置，具有埋设有加热元件的工作台，将要加工的板状待处理对象物放置在工作台上以被加热到规定温度的状态下， 相对于桌子的垂直方向，使得支撑构件被移动以允许由支撑构件支撑的目标对象被布置在桌子上或者被移动离开桌子，围绕桌子的上部的盖子以及 壳体围绕桌子的下部并与盖组合以形成处理室。 当处理室打开时，支撑构件允许目标物体容纳在盖内。