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公开(公告)号：US20050173396A1
公开(公告)日：2005-08-11
申请号：US10968033
申请日：2004-10-20
IPC分类号： F27B17/00 , F27D11/00 , H01L21/00 , H01L21/677
CPC分类号： H01L21/67109 , F27B17/0025 , H01L21/67748 , H01L21/67751
摘要： A heat-treating apparatus comprises a table having a heating element buried therein, a plate-like target object to be processed being disposed on the table so as to be heated to a prescribed temperature, a support member for supporting the target object and movable in the vertical direction relative to the table such that the support member is moved to permit the target object supported by the support member to be disposed on the table or is moved away from the table, a cover surrounding the upper portion of the table, and a casing surrounding the lower portion of the table and combined with the cover so as to form a process chamber. When the process chamber is opened, the support member permits the target object to be housed inside the cover.
摘要翻译： 一种热处理装置，具有埋设有加热元件的工作台，将要加工的板状待处理对象物放置在工作台上以被加热到规定温度的状态下， 相对于桌子的垂直方向，使得支撑构件被移动以允许由支撑构件支撑的目标对象被布置在桌子上或者被移动离开桌子，围绕桌子的上部的盖子以及 壳体围绕桌子的下部并与盖组合以形成处理室。 当处理室打开时，支撑构件允许目标物体容纳在盖内。
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公开(公告)号：US07384595B2
公开(公告)日：2008-06-10
申请号：US10968033
申请日：2004-10-20
IPC分类号： F27D11/00
CPC分类号： H01L21/67109 , F27B17/0025 , H01L21/67748 , H01L21/67751
摘要： A heat-treating apparatus comprises a table having a heating element buried therein, a plate-like target object to be processed being disposed on the table so as to be heated to a prescribed temperature, a support member for supporting the target object and movable in the vertical direction relative to the table such that the support member is moved to permit the target object supported by the support member to be disposed on the table or is moved away from the table, a cover surrounding the upper portion of the table, and a casing surrounding the lower portion of the table and combined with the cover so as to form a process chamber. When the process chamber is opened, the support member permits the target object to be housed inside the cover.
摘要翻译： 一种热处理装置，具有埋设有加热元件的工作台，将要加工的板状待处理对象物放置在工作台上以被加热到规定温度的状态下， 相对于桌子的垂直方向，使得支撑构件被移动以允许由支撑构件支撑的目标对象被布置在桌子上或者被移动离开桌子，围绕桌子的上部的盖子以及 壳体围绕桌子的下部并与盖组合以形成处理室。 当处理室打开时，支撑构件允许目标物体容纳在盖内。
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公开(公告)号：US20060193986A1
公开(公告)日：2006-08-31
申请号：US10550284
申请日：2004-03-26
IPC分类号： B05D3/02
CPC分类号： H01L21/67248 , F27D19/00 , G03F7/168 , H01L21/67109
摘要： A heat processing device that bakes a substrate having a resist coating film containing a volatile substance, includes a hot plate 2, a hot plate temperature control unit 3, a box member 1a, 5, 32 that defines a heat space 30 and a fluid space 31, air supply unit 18, 18A and suction unit 10, 10A that create an air current flowing in a horizontal direction in the fluid space 31, and a controller 22, 22A that controls the hot plate temperature control unit 3, the air supply unit 18, 18A, suction unit 10, 10A and the gas temperature control unit 19 so that a relationship of TF
摘要翻译： 烘焙具有含有挥发性物质的抗蚀剂涂膜的基板的热处理装置包括热板2，热板温度控制单元3，限定加热空间30的液体组件1a，5,32和流体 空间31，空气供应单元18,18A和吸入单元10,10A，其在流体空间31中产生沿水平方向流动的气流;以及控制器22,22A，其控制热板温度控制单元3， 空气供给单元18,18A，抽吸单元10,10A和气体温度控制单元19，使得TP
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公开(公告)号：US07601933B2
公开(公告)日：2009-10-13
申请号：US10550284
申请日：2004-03-26
CPC分类号： H01L21/67248 , F27D19/00 , G03F7/168 , H01L21/67109
摘要： A heat processing device that bakes a substrate having a resist coating film containing a volatile substance, includes a hot plate 2, a hot plate temperature control unit 3, a box member 1a, 5, 32 that defines a heat space 30 and a fluid space 31, air supply unit 18, 18A and suction unit 10, 10A that create an air current flowing in a horizontal direction in the fluid space 31, and a controller 22, 22A that controls the hot plate temperature control unit 3, the air supply unit 18, 18A, suction unit 10, 10A and the gas temperature control unit 19 so that a relationship of TF
摘要翻译： 烘焙具有含有挥发性物质的抗蚀剂涂膜的基板的热处理装置包括热板2，热板温度控制单元3，限定加热空间30的箱体1a，5,32和流体空间 31，空气供给单元18,18A以及在流体空间31中产生沿水平方向流动的气流的吸引单元10,10A以及控制热板温度控制单元3的控制器22,2A，供气单元 18，18A，抽吸单元10,10A和气体温度控制单元19，使得在TP表示热板的温度时，满足TF
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公开(公告)号：US06869640B2
公开(公告)日：2005-03-22
申请号：US10162606
申请日：2002-06-06
CPC分类号： H01L21/6715 , B05D1/005 , B05D3/104 , G03F7/162
摘要： A coating film is formed by the steps of supplying a mixture of a solvent for dissolving a coating liquid and a volatilization suppressing substance for suppressing the volatilization of the solvent onto the surface of the target substrate W, expanding the mixture onto the entire surface of the target substrate W, and supplying a coating liquid onto substantially the central portion of the target substrate W that has received the mixture while rotating the target substrate W thereby expanding the coating liquid outward in the radial direction of the target substrate W thereby forming a coating film.
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公开(公告)号：US20050126474A1
公开(公告)日：2005-06-16
申请号：US11043945
申请日：2005-01-28
CPC分类号： H01L21/6715 , B05D1/005 , B05D3/104 , G03F7/162
摘要： A coating film is formed by the steps of supplying a mixture of a solvent for dissolving a coating liquid and a volatilization suppressing substance for suppressing the volatilization of the solvent onto the surface of the target substrate W, expanding the mixture onto the entire surface of the target substrate W, and supplying a coating liquid onto substantially the central portion of the target substrate W that has received the mixture while rotating the target substrate W thereby expanding the coating liquid outward in the radial direction of the target substrate W thereby forming a coating film.
摘要翻译： 通过以下步骤形成涂膜，所述方法是将用于溶解涂布液的溶剂和用于抑制溶剂挥发的挥发抑制物质的混合物的混合物供给到目标基板W的表面上，将混合物扩展到 目标基板W，并且在旋转目标基板W的同时将涂布液供给到已经接收了混合物的目标基板W的大致中央部分，从而使涂布液沿目标基板W的径向向外扩张，从而形成涂膜 。
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7.发明授权公开(公告)号：US09162247B2
公开(公告)日：2015-10-20
申请号：US13448526
申请日：2012-04-17
IPC分类号： B05C11/00 , B05C13/02 , B05C5/00 , B05C11/02 , B05D1/00 , H01L21/67 , G03F7/16 , B05D3/12 , H01L21/00 , H01L51/00
CPC分类号： H01L21/0337 , B05C11/023 , B05D1/005 , G03F7/162 , G06F19/00 , H01L21/0271 , H01L21/6715 , H01L51/0003 , H01L2224/03418
摘要： A coating treatment apparatus supplying a coating solution to a front surface of a rotated substrate and diffusing the supplied coating solution to an outer periphery side of the substrate to thereby apply the coating solution on the front surface of the substrate includes: a substrate holding part holding a substrate; a rotation part rotating the substrate held on the substrate holding part; a supply part supplying a coating solution to a front surface of the substrate held on the substrate holding part; and an airflow control plate provided at a predetermined position above the substrate held on the substrate holding part for locally changing an airflow above the substrate rotated by the rotation part at an arbitrary position.
摘要翻译： 一种涂布处理装置，其将涂布溶液供给到旋转的基板的前表面，并将供给的涂布溶液扩散到基板的外周侧，从而将涂布液涂布在基板的前表面上，包括：保持基板 底物; 旋转部，旋转保持在所述基板保持部上的所述基板; 供给部，其向保持在所述基板保持部的所述基板的前表面供给涂布液; 以及气流控制板，其设置在保持在所述基板保持部上的所述基板上方的预定位置，用于在任意位置局部地改变由所述旋转部旋转的所述基板上方的气流。
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公开(公告)号：US08505479B2
公开(公告)日：2013-08-13
申请号：US12877187
申请日：2010-09-08
申请人： Kousuke Yoshihara , Tomohiro Iseki
发明人： Kousuke Yoshihara , Tomohiro Iseki
CPC分类号： H01L21/6715 , G03F7/162
摘要： A resist coating apparatus supplies a resist solution to substantially the center of a target substrate to be processed while rotating the target substrate at a first rotational speed, then decelerates the rotation of the substrate to a second rotational speed lower than the first rotational speed, or until rotational halt, makes the deceleration smaller in the deceleration step as the rotational speed becomes closer to the second rotational speed or the rotational halt, and accelerates the rotation of the substrate to a third rotational speed higher than the second rotational speed to spin off a residue of the resist solution.
摘要翻译： 抗蚀涂层装置在以第一转速旋转目标基板的同时将抗蚀剂溶液基本上提供到待加工的目标基板的中心，然后使基板的旋转减速到低于第一转速的第二转速，或 直到旋转停止，随着转速变得更接近于第二转速或转动停止，减速步骤中的减速度变小，并且将基板的旋转加速到高于第二转速的第三转速，以使其脱离 抗蚀剂溶液的残留物。
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9.发明授权Coating treatment method, coating treatment apparatus, and computer-readable storage medium 有权涂布处理方法，涂布处理装置和计算机可读存储介质公开(公告)号：US08414972B2
公开(公告)日：2013-04-09
申请号：US12530345
申请日：2008-02-28
IPC分类号： B05D3/12
CPC分类号： H01L21/02104 , B05D1/005 , G03F7/162 , H01L21/02282 , H01L21/6715
摘要： In a coating step, a substrate is rotated at a high speed, and in that state a resist solution is discharged from a first nozzle to a central portion of the substrate to apply the resist solution over the substrate. Subsequently, in a flattening step, the rotation of the substrate is decelerated and the substrate is rotated at a low speed to flatten the resist solution on the substrate. In this event, the discharge of the resist solution by the first nozzle in the coating step is performed until a middle of the flattening step, and when the discharge of the resist solution is finished in the flattening step, the first nozzle is moved to move a discharge position of the resist solution from the central portion of the substrate. According to the present invention, the resist solution can be applied uniformly within the substrate.
摘要翻译： 在涂布步骤中，基板高速旋转，并且在该状态下，将抗蚀剂溶液从第一喷嘴排出到基板的中心部分，以将抗蚀剂溶液涂覆在基板上。 随后，在平坦化步骤中，基板的旋转减速，并且基板以低速旋转以使基板上的抗蚀剂溶液平坦化。 在这种情况下，在涂布步骤中，通过第一喷嘴对抗蚀剂溶液的排出进行到平坦化阶段的中间，并且当在平坦化步骤中完成抗蚀剂溶液的排出时，第一喷嘴移动 抗蚀剂溶液从衬底的中心部分的放电位置。 根据本发明，能够将抗蚀剂溶液均匀地涂布在基板内。
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公开(公告)号：US20130068324A1
公开(公告)日：2013-03-21
申请号：US13695844
申请日：2011-03-16
IPC分类号： F17D1/00
CPC分类号： B05D1/02 , B01D29/56 , B01D35/02 , B05C9/06 , B05C11/10 , F17D1/00 , H01L21/67017 , H01L21/6715 , H01L21/67173 , H01L21/67178 , Y10T137/794
摘要： A chemical supply system comprises: a first container and a second container for storing a chemical solution; a first pump, located on a first pipe connecting the first and second containers, for directing the solution stored in the first container to the second container; and a first filter, located in the first pipe, for filtering the solution flowing through the first pipe from the first container toward the second container. The system further includes: a second pipe for connecting the first container and the second container; and a second pump, located on the second pipe, for directing the solution stored in the second container to the first container.
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