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公开(公告)号:US20040109950A1
公开(公告)日:2004-06-10
申请号:US10660919
申请日:2003-09-13
IPC分类号: B05D003/02
CPC分类号: H01L21/02126 , C08G77/50 , C09D183/14 , H01L21/02203 , H01L21/02214 , H01L21/02282 , H01L21/3122 , H01L21/31695
摘要: Organic polysilica materials containing one or more silicon-containing cross-linking agents having improved modulus and low dielectric constants and methods of preparing such materials are provided. These materials are useful in the manufacture of devices, such as electronic or optoelectronic devices, requiring low dielectric constant materials having good mechanical properties.
摘要翻译: 提供含有一种或多种具有改进的模量和低介电常数的含硅交联剂的有机聚硅酸酯材料及其制备方法。 这些材料可用于制造诸如电子或光电子器件的器件,其需要具有良好机械性能的低介电常数材料。
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公开(公告)号:US20040033700A1
公开(公告)日:2004-02-19
申请号:US10453337
申请日:2003-06-03
发明人: Dana A. Gronbeck , Michael K. Gallagher , Jeffrey M. Calvert , Gregory P. Prokopowicz , Timothy G. Adams
IPC分类号: H01L021/469 , H01L021/4763 , H01L021/31
CPC分类号: H01L21/02126 , C09D183/04 , C09D183/14 , H01L21/02203 , H01L21/02216 , H01L21/02282 , H01L21/31695 , Y10T428/249987
摘要: Methods for depositing uniform, pinhole-defect free organic polysilica coatings are provided. These methods allow for the use of these materials as spin-on cap layers in the manufacture of integrated circuits.
摘要翻译: 提供了沉积均匀的针孔缺陷有机聚硅氧烷涂层的方法。 这些方法允许在制造集成电路中使用这些材料作为旋涂帽层。
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