Semiconductor processing process control system and its control method

    公开(公告)号:US06745094B1

    公开(公告)日:2004-06-01

    申请号:US09606173

    申请日:2000-06-29

    IPC分类号: G06F1900

    摘要: A semiconductor processing process control system includes a process controller main body (100) for controlling processes for semiconductor processing independently from semiconductor processing devices and contents of intended processing, and a control variable computation programs (210) for obtaining control conditions for semiconductor processing adaptive to semiconductor processing devices and contents of intended processing. The control variable computation programs (210) are used by plugging necessary one of them into the process controller main body (100). When there is any change in semiconductor processing device and content of processing, the system can cope with such changes by merely modifying the control variable computation programs (210). Therefore, the system flexibly, quickly copes with changes in process for processing, computing method of control variables and processing device.

    Production/manufacturing planning system
    3.
    发明授权
    Production/manufacturing planning system 失效
    生产/制造规划体系

    公开(公告)号:US06546300B1

    公开(公告)日:2003-04-08

    申请号:US09455380

    申请日:1999-12-06

    IPC分类号: G06F1900

    CPC分类号: G06Q10/06 Y02P90/20

    摘要: A production/manufacturing planning system is provided with a production planning planner 10 and a manufacturing planning scheduler 12. The production planning planner 10 makes the production planning for the whole factory, and the manufacturing planing sheduler 12 makes the manufacturing planning schedule for each of manufacturing lines on the basis of the production planning for the whole factory. Thus, it is possible to more precisely make the production planning and manufacturing planning than that in conventional systems.

    摘要翻译: 生产/制造规划系统具有生产计划规划者10和制造计划调度器12.生产计划规划者10对整个工厂进行生产计划,并且制造计划调度器12制定每个制造的制造计划表 在整个工厂的生产计划的基础上。 因此,与传统系统相比,可以更精确地制造生产计划和制造规划。

    Production scheduling management system, and method of managing production scheduling
    4.
    发明授权
    Production scheduling management system, and method of managing production scheduling 失效
    生产调度管理系统,生产调度管理方法

    公开(公告)号:US06438436B1

    公开(公告)日:2002-08-20

    申请号:US09250388

    申请日:1999-02-16

    IPC分类号: G06F1900

    CPC分类号: G06Q10/06 Y02P90/20 Y02P90/86

    摘要: A production scheduling management system includes: a long-range production scheduling unit that receives long-range production scheduling information including at least information on a delivery date of each lot, produces a lot processing schedule based on the delivery date of each lot, and outputs a long-range production schedule; a short-range production scheduling unit that receives the long-range production schedule and short-range production scheduling information, produces a short-range schedule of lot processing so as to fulfill the long-range production schedule, and outputs a short-range production schedule; and a work scheduling unit that receives the short-range production schedule and work scheduling information, produces a work schedule so as to fulfill the short-range production schedule, while taking account of conditions of each machine and conditions of each lot, and generates work schedule.

    摘要翻译: 生产调度管理系统包括:远程生产调度单元,其接收至少包括关于各批次的交货日的信息的长程生产调度信息,根据各批次的交货日期生成批次处理进度,并输出 远程生产计划; 接收远程生产计划和短距离生产调度信息的短距离生产调度单元产生批量处理的短期进度表,以满足远程生产进度,并输出短距离生产 时间表; 以及接收短程生产计划和工作调度信息的工作调度单元,同时考虑到每个机器的条件和每个批次的条件,产生工作进度以满足短距离生产计划,并且生成工作 时间表。

    Production system for manufacturing semiconductor devices by lot
    5.
    发明授权
    Production system for manufacturing semiconductor devices by lot 失效
    制造半导体器件的生产系统

    公开(公告)号:US06463350B2

    公开(公告)日:2002-10-08

    申请号:US09084308

    申请日:1998-05-26

    IPC分类号: G06F1900

    CPC分类号: G05B23/0267 G05B15/02

    摘要: A production system has a plurality of production apparatuses, a conveyer which conveys to each production apparatus at each lot, a lot management computer which controls the degree of progress of the production process in each lot, apparatus management computers which control each of production apparatuses, and an intensive management computer which detects the degree of progress of the production process in each lot and operating state of each production apparatus. User interface sections are connected to the apparatus management computer and the intensive management computer, respectively. The user interface sections comprise display apparatuses, respectively. In the screen of the display apparatuses, operating state of each production apparatus and the degree of progress of the production process of the lot in each production apparatus are displayed. In the screen of the display apparatus of the user interface section, operating state of the corresponding production apparatus and the degree of progress of the production process of the lot in the corresponding production apparatus is displayed.

    摘要翻译: 一种生产系统具有多个生产装置,一个传送给每个批次的每个生产装置的输送机,一个控制各批次生产过程进度的批量管理计算机,控制每个生产装置的装置管理计算机, 以及密集管理计算机,其检测每个批次中的生产过程的进度和每个生产设备的操作状态。 用户界面部分分别连接到设备管理计算机和密集管理计算机。 用户接口部分分别包括显示装置。 在显示装置的画面中,显示各制造装置的各生产装置的运转状态和批次的生产过程的进度。 在用户接口部的显示装置的画面中,显示相应的制作装置的操作状态和对应的制作装置中批次的制作过程的进度。

    Semiconductor product manufacturing execution system and semiconductor
product manufacturing method
    6.
    发明授权
    Semiconductor product manufacturing execution system and semiconductor product manufacturing method 失效
    半导体产品制造执行系统和半导体产品制造方法

    公开(公告)号:US6112130A

    公开(公告)日:2000-08-29

    申请号:US942442

    申请日:1997-10-01

    摘要: A process flow, in which wafer processing conditions are described for forming a semiconductor through a plurality of processes, is formed for each lot in one type. A wafer processing is formed for each lot in one type of semiconductor in accordance with the process flow. When a different processing condition should be described according to a wafer in the lot in a certain process of the process flow, the process flow forming includes forming a plurality of different flows in that process by defining division/combination locations from a parent flow. When a faulty processing occurs in the wafer processing in a certain process, the process flow associated with that process is reformed, and a reprocessing is performed in accordance with the reformed process flow.

    摘要翻译: 针对每种批次形成一种处理流程,其中描述了通过多个处理形成半导体的晶片处理条件。 根据工艺流程,在一种类型的半导体中为每个批次形成晶片处理。 当根据工艺流程的特定过程中根据批次中的晶片来描述不同的处理条件时,工艺流程形成包括在该过程中形成多个不同的流程,通过从父流程定义分割/组合位置。 当在某一过程中在晶片处理中出现故障处理时,与该过程相关联的处理流程被改造,并且根据重整过程流程进行再处理。

    Bending machine utilizing controlled expandable pressure device to apply
uniform pressure to work material
    8.
    发明授权
    Bending machine utilizing controlled expandable pressure device to apply uniform pressure to work material 失效
    弯曲机利用受控的可膨胀压力装置对工作材料施加均匀的压力

    公开(公告)号:US5408858A

    公开(公告)日:1995-04-25

    申请号:US185395

    申请日:1994-01-24

    申请人: Etsuo Fukuda

    发明人: Etsuo Fukuda

    IPC分类号: B21D5/02 B21D5/01

    CPC分类号: B21D5/0272 B21D5/0209

    摘要: A bending machine having an upper punch containing portion, or beam, and a lower die containing portion, or beam, is modified by incorporating a controlled expandable pressure device whereby the pressure applied to a work material is uniformly distributed throughout the surface of the material. In a first embodiment, the device is mounted in the upper and lower machine portions; in a second embodiment, the device is mounted only in the upper machine portion; in a third embodiment, the device is mounted only in the lower machine portion; and in a fourth embodiment, segmented devices are mounted in the upper machine portion and a single, elongated device is mounted in the lower machine portion.

    摘要翻译: 具有上部冲头容纳部分或梁的弯曲机,以及下模具容纳部分或梁,通过结合受控的可膨胀压力装置来改变,由此施加到工件材料的压力均匀地分布在材料的整个表面上。 在第一实施例中,装置安装在上部和下部机器部分中; 在第二实施例中,装置仅安装在上部机器部分中; 在第三实施例中,装置仅安装在下部机器部分中; 并且在第四实施例中,分段装置安装在上部机器部分中,并且单个细长装置安装在下部机器部分中。

    Die assembly having means for automatically controlling in the angular
orientation of the lower die plate members
    9.
    发明授权
    Die assembly having means for automatically controlling in the angular orientation of the lower die plate members 失效
    模具组件具有用于以下模板构件的角度定向自动控制的装置

    公开(公告)号:US5365766A

    公开(公告)日:1994-11-22

    申请号:US62759

    申请日:1993-05-18

    IPC分类号: B21D5/02 B21D5/01

    CPC分类号: B21D5/0209 B21D5/0263

    摘要: A die assembly for use with a tool for bending flat metal stock, and including a pair of elongated plate members in the lower die member each having a surface to support a piece of flat metal stock, the plate members being pivotably connected and maintained approximately 180 degrees apart when a bending force is not applied to the metal stock. A surface of an expandable pressure container is positioned in contact with a plate support member, the pressure within the container being controlled in a manner such that the vertical position of the plate support member is fixed such that the plate members assume a selected angular orientation to enable the tool to form the desired bend in the metal stock.

    摘要翻译: 一种与用于弯曲扁平金属原料的工具一起使用的模具组件,并且在下模具构件中包括一对细长板构件,每个细长板构件具有用于支撑一片扁平金属坯料的表面,该板构件可枢转地连接并保持在约180° 当不向金属原料施加弯曲力时分开。 可膨胀压力容器的表面被定位成与板支撑构件接触,容器内的压力被控制成使得板支撑构件的垂直位置被固定,使得板构件呈现出选定的角度定向 使工具能够在金属原料中形成所需的弯曲部分。