公开(公告)号：US12103999B2

公开(公告)日：2024-10-01

申请号：US17440499

申请日：2020-05-25

Applicant: Showa Denko Materials Co., Ltd.

Inventor： Akihiro Nakamura ,  Yuji Takase ,  Hayato Sawamoto ,  Yoshikazu Suzuki ,  Shuji Nomoto ,  Shota Okade

IPC: C08F290/14 ,  G03F7/031 ,  H01L23/14 ,  H05K1/03 ,  H05K3/46

CPC classification number: C08F290/144 ,  G03F7/031 ,  H01L23/145 ,  H05K1/032 ,  H05K3/4676 ,  H05K1/0373

Abstract: The present invention relates to provision of a photosensitive resin composition containing (A) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent, and (B) a photopolymerization initiator, wherein at least one of the components contained in the photosensitive resin composition is a component including a dicyclopentadiene structure; a photosensitive resin film using the foregoing photosensitive resin composition; a printed wiring board and a method for producing the same; and a semiconductor package.