公开(公告)号：US20050067692A1

公开(公告)日：2005-03-31

申请号：US10676585

申请日：2003-09-30

申请人： Shriram Ramanathan ,  Gregory Chrysler ,  David Chau ,  Ryan Lei

发明人： Shriram Ramanathan ,  Gregory Chrysler ,  David Chau ,  Ryan Lei

IPC分类号： H01L23/38 ,  H01L21/44 ,  H01L21/00 ,  H01L23/34 ,  H01L29/40

CPC分类号： H01L23/38 ,  H01L2924/0002 ,  H01L2924/00

摘要： An embodiment of the present invention is a technique to provide heat extraction for semiconductor devices. At least a thermoelectric film is fabricated onto a bare wafer. The backside of the bare wafer is bonded to an active wafer having at least a device. The bonded bare and active wafers are annealed.

摘要翻译： 本发明的一个实施例是一种为半导体器件提供热提取的技术。 在裸晶片上至少制造热电膜。 裸晶片的背面与至少具有器件的活性晶片结合。 粘合的裸露和活性晶圆进行退火。

公开(公告)号：US20060243315A1

公开(公告)日：2006-11-02

申请号：US11118814

申请日：2005-04-29

申请人： Gregory Chrysler ,  Shriram Ramanathan ,  Tian-An Chen

发明人： Gregory Chrysler ,  Shriram Ramanathan ,  Tian-An Chen

IPC分类号： H01L35/34

CPC分类号： H01L23/38 ,  H01L35/32 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

摘要： Embodiments include electronic assemblies and methods for forming electronic assemblies. Certain methods include forming a thermoelectric cooling (TEC) structure on a die, the TEC structure including a plurality of spaced apart TEC legs. A polymer is positioned between the spaced apart TEC legs of the TEC structure. The TEC structure may be positioned between the die and the heat spreader. In one method, a polymer in solid form is positioned on the TEC legs. The polymer in solid form is heated to a temperature sufficient so that a liquid polymer is formed, and the liquid polymer flows between the TEC legs. After being positioned between the TEC legs, the liquid polymer is solidified. Other embodiments are described and claimed.

摘要翻译： 实施例包括用于形成电子组件的电子组件和方法。 某些方法包括在模具上形成热电冷却（TEC）结构，TEC结构包括多个间隔开的TEC支腿。 聚合物位于TEC结构的间隔开的TEC腿之间。 TEC结构可以位于模具和散热器之间。 在一种方法中，固体形式的聚合物位于TEC腿上。 将固体形式的聚合物加热到足以形成液体聚合物的温度，并且液体聚合物在TEC腿之间流动。 在定位在TEC腿之间时，液体聚合物固化。 描述和要求保护其他实施例。

公开(公告)号：US20060097383A1

公开(公告)日：2006-05-11

申请号：US11298280

申请日：2005-12-09

申请人： Shriram Ramanathan ,  Sarah Kim ,  R. List ,  Gregory Chrysler

发明人： Shriram Ramanathan ,  Sarah Kim ,  R. List ,  Gregory Chrysler

IPC分类号： H01L23/34 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L35/32 ,  H01L23/38 ,  H01L23/50 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L27/16 ,  H01L2224/05001 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48471 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/81801 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/4554

摘要： A microelectronic assembly is provided, having thermoelectric elements formed on a die so as to pump heat away from the die when current flows through the thermoelectric elements. In one embodiment, the thermoelectric elements are integrated between conductive interconnection elements on an active side of the die. In another embodiment, the thermoelectric elements are on a backside of the die and electrically connected to a carrier substrate on a front side of the die. In a further embodiment, the thermoelectric elements are formed on a secondary substrate and transferred to the die.

公开(公告)号：US20050178423A1

公开(公告)日：2005-08-18

申请号：US10778514

申请日：2004-02-12

申请人： Shriram Ramanathan ,  Gregory Chrysler ,  Steven Towle

发明人： Shriram Ramanathan ,  Gregory Chrysler ,  Steven Towle

IPC分类号： H01L21/48 ,  H01L23/38 ,  H01L21/44 ,  H01L21/50 ,  H01L35/34 ,  H01L37/00

CPC分类号： H01L23/38 ,  H01L21/4882 ,  H01L24/48 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A microelectronic assembly is provided, having thermoelectric elements formed on a die so as to pump heat away from the die when current flows through the thermoelectric elements. In one embodiment, the thermoelectric elements are integrated between conductive interconnection elements on an active side of the die. In another embodiment, the thermoelectric elements are on a backside of the die and electrically connected to a carrier substrate on a front side of the die. In a further embodiment, the thermoelectric elements are formed on a secondary substrate and transferred to the die.

公开(公告)号：US20050077619A1

公开(公告)日：2005-04-14

申请号：US10682137

申请日：2003-10-08

申请人： Shriram Ramanathan ,  Sarah Kim ,  R. List ,  Gregory Chrysler

发明人： Shriram Ramanathan ,  Sarah Kim ,  R. List ,  Gregory Chrysler

IPC分类号： H01L21/60 ,  H01L23/38 ,  H01L23/485 ,  H01L23/50 ,  H01L27/16 ,  H01L35/32 ,  H01L23/34 ,  H01L21/44

CPC分类号： H01L35/32 ,  H01L23/38 ,  H01L23/50 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L27/16 ,  H01L2224/05001 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48471 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/81801 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/4554

摘要： A microelectronic assembly is provided, having thermoelectric elements formed on a die so as to pump heat away from the die when current flows through the thermoelectric elements. In one embodiment, the thermoelectric elements are integrated between conductive interconnection elements on an active side of the die. In another embodiment, the thermoelectric elements are on a backside of the die and electrically connected to a carrier substrate on a front side of the die. In a further embodiment, the thermoelectric elements are formed on a secondary substrate and transferred to the die.

摘要翻译： 提供了一种微电子组件，其具有形成在模具上的热电元件，以便当电流流过热电元件时将热量从模具中排出。 在一个实施例中，热电元件集成在管芯的有源侧上的导电互连元件之间。 在另一实施例中，热电元件位于管芯的背面，并与管芯前侧的载体基板电连接。 在另一个实施例中，热电元件形成在二次基板上并转移到管芯上。

公开(公告)号：US20050257821A1

公开(公告)日：2005-11-24

申请号：US10849964

申请日：2004-05-19

申请人： Shriram Ramanathan ,  Gregory Chrysler

发明人： Shriram Ramanathan ,  Gregory Chrysler

IPC分类号： F25B21/02 ,  H01L23/38 ,  H01L23/52 ,  H01L35/00 ,  H01L35/18 ,  H01L35/30 ,  H01L35/32

CPC分类号： H01L35/30 ,  H01L23/38 ,  H01L35/18 ,  H01L35/32 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01079

摘要： Apparatus and method of fabricating a heat dissipation device that includes at least one thermoelectric device fabricated with nano-wires for drawing heat from at least one high heat area on a microelectronic die. The nano-wires may be formed from bismuth containing materials and may be clustered of optimal performance.

摘要翻译： 一种制造散热装置的装置和方法，其包括至少一个用纳米线制造的热电装置，用于从微电子管芯上的至少一个高热区域吸取热量。 纳米线可以由含铋材料形成，并且可以聚集成最佳性能。

公开(公告)号：US20070000256A1

公开(公告)日：2007-01-04

申请号：US11174313

申请日：2005-06-30

申请人： David Chau ,  Gregory Chrysler

发明人： David Chau ,  Gregory Chrysler

IPC分类号： F25B21/02 ,  F25D23/12

CPC分类号： F25B21/02 ,  H01L23/38 ,  H01L35/30 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

摘要： An apparatus and associated method to provide localized cooling to a microelectronic device are generally described. In this regard, according to one example embodiment, a cooling system comprising one or more thermoelectric cooler(s) is thermally coupled to a heat spreader to provide cooling to one or more hot spot(s) of a microelectronic device.

摘要翻译： 通常描述了向微电子器件提供局部冷却的装置和相关方法。 在这方面，根据一个示例性实施例，包括一个或多个热电冷却器的冷却系统热耦合到散热器以向微电子器件的一个或多个热点提供冷却。

公开(公告)号：US20080068792A1

公开(公告)日：2008-03-20

申请号：US11942158

申请日：2007-11-19

申请人： Je-Young Chang ,  Gregory Chrysler

发明人： Je-Young Chang ,  Gregory Chrysler

IPC分类号： H05K7/20

CPC分类号： H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： An apparatus includes a microchannel structure having microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus also includes a plurality of walls coupled to the microchannel structure to define a manifold. The manifold is in communication with at least a plurality of the microchannels. The plurality of walls includes a side wall. The side wall has a port therein. The port allows the coolant to flow in a direction that is either into the manifold or out of the manifold.

摘要翻译： 一种装置包括其中形成有微通道的微通道结构。 微通道将传输冷却剂并且靠近集成电路以将热量从集成电路传递到冷却剂。 该装置还包括耦合到微通道结构以限定歧管的多个壁。 歧管与至少多个微通道连通。 多个壁包括侧壁。 侧壁上有一个端口。 端口允许冷却剂沿着或者进入歧管或歧管内的方向流动。

公开(公告)号：US20070155136A1

公开(公告)日：2007-07-05

申请号：US11323205

申请日：2005-12-30

申请人： Gregory Chrysler ,  Thomas Dory ,  James Maveety ,  Edward Prack ,  Unnikrishnan Vadakkanmaruveedu

发明人： Gregory Chrysler ,  Thomas Dory ,  James Maveety ,  Edward Prack ,  Unnikrishnan Vadakkanmaruveedu

IPC分类号： H01L21/20

CPC分类号： H01L23/373 ,  H01L51/529 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/16152 ,  Y10S977/742 ,  Y10S977/748 ,  Y10S977/847 ,  Y10T29/49126 ,  H01L2224/05599

摘要： A carbon nanotube (CNT) array is patterned on a substrate. The substrate can be a microelectronic die or a heat sink for a die. The patterned CNT array is patterned by using a patterned catalyst on the substrate to form the CNT array by growing. The patterned CNT array can also be patterned by using a patterned mask on the substrate to form the CNT array by growing. A computing system that uses the CNT array for heat transfer from the die is also used.

摘要翻译： 碳纳米管（CNT）阵列在衬底上图案化。 衬底可以是微电子管芯或用于管芯的散热器。 通过在衬底上使用图案化的催化剂来图案化图案化的CNT阵列，以通过生长形成CNT阵列。 图案化的CNT阵列也可以通过使用衬底上的图案化掩模进行图案化，以通过生长形成CNT阵列。 还使用使用CNT阵列从模具进行热传递的计算系统。

公开(公告)号：US20070144182A1

公开(公告)日：2007-06-28

申请号：US11319297

申请日：2005-12-27

申请人： Ioan Sauciuc ,  Gregory Chrysler

发明人： Ioan Sauciuc ,  Gregory Chrysler

IPC分类号： F25B21/02 ,  F25D23/12

CPC分类号： F25B21/02 ,  F25D19/006 ,  H01L23/3677 ,  H01L23/38 ,  H01L2224/16 ,  H01L2924/12044

摘要： Apparatuses and associated methods and systems to provide localized cooling to a microelectronic device are generally described. In this regard, according to one example embodiment, a microelectronic cooling apparatus comprising a microelectronic device thermally coupled to one or more thermally conductive pin(s) provides cooling to one or more hot spot(s) of the microelectronic device.

摘要翻译： 通常描述用于向微电子器件提供局部冷却的装置和相关方法和系统。 在这方面，根据一个示例性实施例，包括热耦合到一个或多个导热引脚的微电子器件的微电子冷却装置向微电子器件的一个或多个热点提供冷却。