摘要:
An embodiment of the present invention is a technique to provide heat extraction for semiconductor devices. At least a thermoelectric film is fabricated onto a bare wafer. The backside of the bare wafer is bonded to an active wafer having at least a device. The bonded bare and active wafers are annealed.
摘要:
An embodiment of the present invention is a technique to provide heat extraction for semiconductor devices. At least a thermoelectric film is fabricated onto a bare wafer. The backside of the bare wafer is bonded to an active wafer having at least a device. The bonded bare and active wafers are annealed.
摘要:
Apparatus and method of fabricating a heat dissipation device that includes at least one thermoelectric device fabricated with nano-wires for drawing heat from at least one high heat area on a microelectronic die. The nano-wires may be formed from bismuth containing materials and may be clustered of optimal performance.
摘要:
Embodiments include electronic assemblies and methods for forming electronic assemblies. Certain methods include forming a thermoelectric cooling (TEC) structure on a die, the TEC structure including a plurality of spaced apart TEC legs. A polymer is positioned between the spaced apart TEC legs of the TEC structure. The TEC structure may be positioned between the die and the heat spreader. In one method, a polymer in solid form is positioned on the TEC legs. The polymer in solid form is heated to a temperature sufficient so that a liquid polymer is formed, and the liquid polymer flows between the TEC legs. After being positioned between the TEC legs, the liquid polymer is solidified. Other embodiments are described and claimed.
摘要:
A microelectronic assembly is provided, having thermoelectric elements formed on a die so as to pump heat away from the die when current flows through the thermoelectric elements. In one embodiment, the thermoelectric elements are integrated between conductive interconnection elements on an active side of the die. In another embodiment, the thermoelectric elements are on a backside of the die and electrically connected to a carrier substrate on a front side of the die. In a further embodiment, the thermoelectric elements are formed on a secondary substrate and transferred to the die.
摘要:
A microelectronic assembly is provided, having thermoelectric elements formed on a die so as to pump heat away from the die when current flows through the thermoelectric elements. In one embodiment, the thermoelectric elements are integrated between conductive interconnection elements on an active side of the die. In another embodiment, the thermoelectric elements are on a backside of the die and electrically connected to a carrier substrate on a front side of the die. In a further embodiment, the thermoelectric elements are formed on a secondary substrate and transferred to the die.
摘要:
A microelectronic assembly is provided, having thermoelectric elements formed on a die so as to pump heat away from the die when current flows through the thermoelectric elements. In one embodiment, the thermoelectric elements are integrated between conductive interconnection elements on an active side of the die. In another embodiment, the thermoelectric elements are on a backside of the die and electrically connected to a carrier substrate on a front side of the die. In a further embodiment, the thermoelectric elements are formed on a secondary substrate and transferred to the die.
摘要:
Embodiments of the invention relate to device, method, and system for separation and/or detection of biological cells and biomolecules using micro-channels, magnetic interactions, and magnetic tunnel junctions. The micro-channels can be integrated into a microfluidic device that may be part of an integrated circuit. Magnetic interactions used for the separation are created, in part, by magnetic stripes associated with the micro-channels. Detection of biological cells and biomolecules is effectuated by a magnetic tunnel junction sensor that comprises two ferromagnetic layers separated by a thin insulating layer. The magnetic tunnel junction sensor can be integrated into a silicon based device, such a microfluidic device, an integrated circuit, or a microarray to achieve rapid and specific separation and/or detection of biomolecules and cells.
摘要:
Embodiments of the invention provide a first component with a compliant interconnect bonded to a second component with a land pad by a metal to metal bond. In some embodiments, the first component may be a microprocessor die and the second component a package substrate.