公开(公告)号：US5300592A

公开(公告)日：1994-04-05

申请号：US971263

申请日：1992-11-04

申请人： Shuichi Kanagawa ,  Kunimasa Kamio ,  Shigeo Hozumi ,  Hiroshi Nakamura ,  Masao Yamagiwa

发明人： Shuichi Kanagawa ,  Kunimasa Kamio ,  Shigeo Hozumi ,  Hiroshi Nakamura ,  Masao Yamagiwa

IPC分类号： C08G59/02 ,  C08G59/08 ,  C08G59/34 ,  C08G73/12 ,  C08L63/04 ,  C08L79/08 ,  C08G59/40

CPC分类号： C08G59/027 ,  C08G59/02 ,  C08G59/08 ,  C08G73/12 ,  C08L63/04 ,  C08L79/08 ,  C08L79/085

摘要： A resin composition comprising a polymeleimide compound having two or more maleimide groups in one molecule, a phenol novolac resin of which phenolic hydroxyl groups are epoxidized and allyl-etherified and, as an optional ingredient, a curing agent, or a resin composition comprising a polymaleimide compound having two or more maleimide groups in one molecule, a phenol novolac resin of which phenolic hydroxyl groups are allyl-etherified and an epoxy resin; and a heat resistant composite material comprising cured product of said resin composition as its matrix phase and containing a fiber as its reinforcing material.

摘要翻译： 一种树脂组合物，其包含在一个分子中具有两个或更多个马来酰亚胺基团的聚咪唑酰亚胺化合物，酚羟基被烯氧基化的苯酚酚醛清漆树脂和作为任选的成分的固化剂或包含聚马来酰亚胺 在一个分子中具有两个或更多个马来酰亚胺基团的化合物，酚羟基被烯丙基醚化的苯酚酚醛清漆树脂和环氧树脂; 以及耐热复合材料，其包含所述树脂组合物的固化产物作为其基质相并含有纤维作为其增强材料。

公开(公告)号：US5041507A

公开(公告)日：1991-08-20

申请号：US360589

申请日：1989-06-02

申请人： Shuichi Kanagawa ,  Kunimasa Kamio ,  Shigeo Hozumi ,  Hiroshi Nakamura ,  Masao Yamagiwa

发明人： Shuichi Kanagawa ,  Kunimasa Kamio ,  Shigeo Hozumi ,  Hiroshi Nakamura ,  Masao Yamagiwa

IPC分类号： C08G59/02 ,  C08G59/08 ,  C08G59/34 ,  C08G73/12 ,  C08L63/04 ,  C08L79/08

CPC分类号： C08G59/027 ,  C08G59/02 ,  C08G59/08 ,  C08G73/12 ,  C08L63/04 ,  C08L79/08 ,  C08L79/085

摘要： A resin composition comprising a polymeleimide compound having two or more maleimide groups in one molecule, a phenol novolac resin of which phenolic hydroxyl groups are epoxidized and allyl-etherified and, as an optional ingredient, a curing agent, or a resin composition comprising a polymaleimide compound having two or more maleimide groups in one molecule, a phenol novolac resin of which phenolic hydroxyl groups are allyl-etherified and an epoxy resin; and a heat resistant composite material comprising cured product of said resin composition as its matrix phase and containing a fiber as its reinforcing material.

公开(公告)号：US4755569A

公开(公告)日：1988-07-05

申请号：US20740

申请日：1987-03-02

申请人： Shuichi Kanagawa ,  Shigeo Hozumi ,  Kunimasa Kamio

发明人： Shuichi Kanagawa ,  Shigeo Hozumi ,  Kunimasa Kamio

IPC分类号： C08L61/14 ,  C08G8/36 ,  C08G59/40 ,  C08G73/12 ,  C08K5/34 ,  C08L61/04 ,  C08G8/30

CPC分类号： C08G59/4042 ,  C08G73/12 ,  C08G8/36

摘要： A thermosetting resin composition comprising (A) a phenol novolac resin, some of the hydroxyl groups of which have been allyl-etherified and the other hydroxyl groups having added thereto a compound having one or more epoxy groups and (B) a polymaleimide compound having two or more maleimide groups in the molecule.

摘要翻译： 一种热固性树脂组合物，其包含（A）苯酚酚醛清漆树脂，其一些羟基已被烯丙基醚化，其它羟基加入具有一个或多个环氧基的化合物和（B）具有两个或多个环氧基的聚马来酰亚胺化合物 或更多的马来酰亚胺基团。

公开(公告)号：US5478871A

公开(公告)日：1995-12-26

申请号：US287251

申请日：1994-08-08

申请人： Kazuo Takebe ,  Takashi Morimoto ,  Yutaka Shiomi ,  Yasuhide Sugiyama ,  Shigeki Naitoh ,  Noriaki Saito ,  Shuichi Kanagawa ,  Kunimasa Kamio

发明人： Kazuo Takebe ,  Takashi Morimoto ,  Yutaka Shiomi ,  Yasuhide Sugiyama ,  Shigeki Naitoh ,  Noriaki Saito ,  Shuichi Kanagawa ,  Kunimasa Kamio

IPC分类号： C07D303/24 ,  C08G8/04 ,  C08G59/08 ,  C08G59/32 ,  H01L23/29 ,  C08L63/00

CPC分类号： C08G59/08 ,  C07D303/24 ,  C08G59/3218 ,  C08G8/04 ,  H01L23/293 ,  H01L2924/0002

摘要： The present invention provides polyhydric phenols which are starting materials for glycidyl ether compounds which can provide cured products having low moisture absorption, high heat resistance and improved crack resistance and can be used for encapsulating semiconductor devices. The polyhydric phenols are represented by the following formula: ##STR1## wherein R.sup.1 independently represents a halogen atom, an alkyl or cycloalkyl group of 1-9 carbon atoms, an alkoxy group of 4 or less carbon atoms or an aryl group and R.sup.1 may be identical or different when l is 2 or more, R.sup.2 independently represents a halogen atom, an alkoxy group of 4 or less carbon atoms or an alkyl group of 6 or less carbon atoms and R.sup.2 may be identical or different when m is 2 or more, R.sup.3 independently represents a hydrogen atom or an alkyl group of 6 or less carbon atoms, the average recurring unit number n is 0-10, l is 0-4 and m is 0-7, and can be contained as a curing agent in an epoxy resin composition which is used not only for giving cured products but also for encapsulating semiconductor devices.

摘要翻译： 本发明提供作为缩水甘油醚化合物的原料的多元酚，其可以提供具有低吸湿性，高耐热性和改善的抗裂性的固化产物，并可用于封装半导体器件。 多元酚由下式表示：其中R1独立地表示卤素原子，1-9个碳原子的烷基或环烷基，4个或更少个碳原子的烷氧基或芳基，R1可以是 当l为2以上时，相同或不同，R2独立地表示卤素原子，碳原子数为4以下的烷氧基或碳原子数6以下的烷基，R2可以相同或不同，m为2以上时， R3独立地表示氢原子或碳原子数为6以下的烷基，平均重复单元数n为0〜10，l为0-4，m为0〜7，作为固化剂可以含有 环氧树脂组合物不仅用于提供固化产物，而且用于封装半导体器件。

公开(公告)号：US4913697A

公开(公告)日：1990-04-03

申请号：US281458

申请日：1988-12-08

申请人： Yasuhisa Saito ,  Kunimasa Kamio ,  Shuichi Kanagawa ,  Yutaka Shiomi

发明人： Yasuhisa Saito ,  Kunimasa Kamio ,  Shuichi Kanagawa ,  Yutaka Shiomi

IPC分类号： C07D251/34 ,  C08F222/40 ,  C08G73/06 ,  C08G73/12

CPC分类号： C08G73/0644 ,  C07D251/34 ,  C08F222/40 ,  C08G73/12

摘要： A thermosetting resin composition comprising (i) a polymaleimide compound having at least two maleimide groups in the molecule and (ii) an s-triazine compound having at least two alkenylaryloxy groups in the molecule; a resin-composition for encapsulant comprising said polymaleimide compound, said traizine compound, and an inorganic filler as essential components; and said s-triazine compound.

公开(公告)号：US4871832A

公开(公告)日：1989-10-03

申请号：US146684

申请日：1988-01-21

申请人： Yasuhisa Saito ,  Shuichi Kanagawa ,  Katsuya Watanabe ,  Kunimasa Kamio

发明人： Yasuhisa Saito ,  Shuichi Kanagawa ,  Katsuya Watanabe ,  Kunimasa Kamio

IPC分类号： C07D403/04 ,  C08G59/40 ,  C08G59/50 ,  C08G59/62 ,  C08G73/10

CPC分类号： C07D403/04 ,  C08G59/4042 ,  C08G59/5053 ,  C08G59/62 ,  C08G73/10 ,  C08G73/1067

摘要： The invention provides an imide compound represented by the general formula (I), ##STR1## wherein X represents a hydroxyl or amino group, Ar.sub.1 and Ar.sub.2 independently represent an aromatic residue, R.sub.1 represents a hydrogen atom or a C.sub.1 -C.sub.10 alkyl group, R.sub.2 represents a hydrogen atom, a C.sub.1 -C.sub.20 alkyl or alkoxy group or a hydroxyl group, and n represents a number of from 0 to 6, and also provides an epoxy resin composition containing the imide compound (B) and epoxy resins (A) as essential components.

摘要翻译： 本发明提供由通式（I）表示的酰亚胺化合物，其中X表示羟基或氨基，Ar 1和Ar 2独立地表示芳族残基，R 1表示氢原子或C 1 -C 10烷基，R 2表示氢原子，C 1〜C 20烷基或烷氧基或羟基，n表示0〜6的数，并且还提供含有酰亚胺化合物（B）和 环氧树脂（A）为必须成分。

公开(公告)号：US4808717A

公开(公告)日：1989-02-28

申请号：US45431

申请日：1987-05-04

申请人： Yasuhisa Saito ,  Kunimasa Kamio ,  Shuichi Kanagawa ,  Yutaka Shiomi

发明人： Yasuhisa Saito ,  Kunimasa Kamio ,  Shuichi Kanagawa ,  Yutaka Shiomi

IPC分类号： C07D251/34 ,  C08F222/40 ,  C08G73/06 ,  C08G73/12

CPC分类号： C08G73/0644 ,  C07D251/34 ,  C08F222/40 ,  C08G73/12

摘要： A thermosetting resin composition comprising (i) a polymaleimide compound having at least two maleimide groups in the molecule and (ii) an s-triazine compound having at least two alkenylaryloxy groups in the molecule; a resin-composition for encapsulant comprising said polymaleimide compound, said triazine compound, and an inorganic filler as essential components; and said s-triazine compound.

摘要翻译： 一种热固性树脂组合物，其包含（i）分子中具有至少两个马来酰亚胺基团的聚马来酰亚胺化合物和（ii）在分子中具有至少两个烯基芳氧基的s-三嗪化合物; 用于包含所述聚马来酰亚胺化合物，所述三嗪化合物和无机填料作为必要组分的密封剂的树脂组合物; 和所述s-三嗪化合物。

公开(公告)号：US4260831A

公开(公告)日：1981-04-07

申请号：US24424

申请日：1979-03-27

申请人： Shunsuke Matsushima ,  Kazuhiko Hata ,  Kentaro Mashita ,  Shuichi Kanagawa ,  Shinji Nakao ,  Kiyoshi Nakai ,  Kunimasa Kamio

发明人： Shunsuke Matsushima ,  Kazuhiko Hata ,  Kentaro Mashita ,  Shuichi Kanagawa ,  Shinji Nakao ,  Kiyoshi Nakai ,  Kunimasa Kamio

IPC分类号： C07C37/14 ,  C07C39/17 ,  C08G64/14

CPC分类号： C07C37/14 ,  C08G64/14 ,  C07C2102/08

摘要： m-Isopropenylphenol oligomer which is useful for the production of synthetic resins such as epoxy resins is produced by polymerizing m-isopropenylphenol at a temperature of 135.degree. to 230.degree. C. using a catalytic amount of an acid catalyst in the presence or absence of a solvent, or freezing m-isopropenylphenol in the presence or absence of an acid catalyst.

摘要翻译： 可用于生产合成树脂如环氧树脂的间 - 异丙烯基苯酚低聚物是通过在135℃至230℃的温度下使用催化量的酸催化剂在存在或不存在 溶剂或冷冻的异丙烯基苯酚在酸催化剂存在或不存在下进行。

公开(公告)号：US4980436A

公开(公告)日：1990-12-25

申请号：US464145

申请日：1990-01-12

申请人： Yasuhisa Saito ,  Kunimasa Kamio ,  Shuichi Kanagawa ,  Yutaka Shiomi

发明人： Yasuhisa Saito ,  Kunimasa Kamio ,  Shuichi Kanagawa ,  Yutaka Shiomi

IPC分类号： C07D251/34 ,  C08F222/40 ,  C08G73/06 ,  C08G73/12

CPC分类号： C08G73/0644 ,  C07D251/34 ,  C08F222/40 ,  C08G73/12

摘要： A thermosetting resin composition comprising (i) a polymaleimide compound having at least two maleimide groups in the molecule and (ii) an s-triazine compound having at least two alkenylaryloxy groups in the molecule; a resin-composition for encapsulant comprising said polymaleimide compound, said triazine compound, and an inorganic filler as essential components; and said s-triazine compound.

公开(公告)号：US4632966A

公开(公告)日：1986-12-30

申请号：US793531

申请日：1985-10-10

申请人： Shuichi Kanagawa ,  Hisao Takagishi ,  Teruho Adachi ,  Kunimasa Kamio

发明人： Shuichi Kanagawa ,  Hisao Takagishi ,  Teruho Adachi ,  Kunimasa Kamio

IPC分类号： C08F290/14 ,  C08K5/3415 ,  C08L61/14 ,  C08G8/30 ,  C08G8/36

CPC分类号： C08K5/3415 ,  C08F290/14 ,  C08L61/14

摘要： A thermosetting resin composition comprising an N,N'-bismaleimide compound and an allylated phenol novolak resin having partially or wholly allyl-etherified phenolic hydroxyl groups and substantially no nucleous-substituted allyl group.

摘要翻译： 一种热固性树脂组合物，其包含N，N'-双马来酰亚胺化合物和具有部分或全部烯丙基醚化的酚羟基并且基本上不含核取代的烯丙基的烯丙基化酚醛清漆树脂。