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    Polyhydric phenol from naphthaldehyde and epoxy resin obtained using the same
    1.
    发明授权
    Polyhydric phenol from naphthaldehyde and epoxy resin obtained using the same 失效
    来自萘甲醛的多元酚和使用其得到的环氧树脂

    公开(公告)号：US5478871A

    公开(公告)日：1995-12-26

    申请号：US287251

    申请日：1994-08-08

    申请人： Kazuo Takebe ,  Takashi Morimoto ,  Yutaka Shiomi ,  Yasuhide Sugiyama ,  Shigeki Naitoh ,  Noriaki Saito ,  Shuichi Kanagawa ,  Kunimasa Kamio

    发明人： Kazuo Takebe ,  Takashi Morimoto ,  Yutaka Shiomi ,  Yasuhide Sugiyama ,  Shigeki Naitoh ,  Noriaki Saito ,  Shuichi Kanagawa ,  Kunimasa Kamio

    IPC分类号： C07D303/24 ,  C08G8/04 ,  C08G59/08 ,  C08G59/32 ,  H01L23/29 ,  C08L63/00

    CPC分类号： C08G59/08 ,  C07D303/24 ,  C08G59/3218 ,  C08G8/04 ,  H01L23/293 ,  H01L2924/0002

    摘要： The present invention provides polyhydric phenols which are starting materials for glycidyl ether compounds which can provide cured products having low moisture absorption, high heat resistance and improved crack resistance and can be used for encapsulating semiconductor devices. The polyhydric phenols are represented by the following formula: ##STR1## wherein R.sup.1 independently represents a halogen atom, an alkyl or cycloalkyl group of 1-9 carbon atoms, an alkoxy group of 4 or less carbon atoms or an aryl group and R.sup.1 may be identical or different when l is 2 or more, R.sup.2 independently represents a halogen atom, an alkoxy group of 4 or less carbon atoms or an alkyl group of 6 or less carbon atoms and R.sup.2 may be identical or different when m is 2 or more, R.sup.3 independently represents a hydrogen atom or an alkyl group of 6 or less carbon atoms, the average recurring unit number n is 0-10, l is 0-4 and m is 0-7, and can be contained as a curing agent in an epoxy resin composition which is used not only for giving cured products but also for encapsulating semiconductor devices.

    摘要翻译： 本发明提供作为缩水甘油醚化合物的原料的多元酚，其可以提供具有低吸湿性，高耐热性和改善的抗裂性的固化产物，并可用于封装半导体器件。 多元酚由下式表示：其中R1独立地表示卤素原子，1-9个碳原子的烷基或环烷基，4个或更少个碳原子的烷氧基或芳基，R1可以是 当l为2以上时，相同或不同，R2独立地表示卤素原子，碳原子数为4以下的烷氧基或碳原子数6以下的烷基，R2可以相同或不同，m为2以上时， R3独立地表示氢原子或碳原子数为6以下的烷基，平均重复单元数n为0〜10，l为0-4，m为0〜7，作为固化剂可以含有 环氧树脂组合物不仅用于提供固化产物，而且用于封装半导体器件。

    Thermosetting resin composition
    7.
    发明授权
    Thermosetting resin composition 失效
    热固性树脂组合物

    公开(公告)号：US4808717A

    公开(公告)日：1989-02-28

    申请号：US45431

    申请日：1987-05-04

    申请人： Yasuhisa Saito ,  Kunimasa Kamio ,  Shuichi Kanagawa ,  Yutaka Shiomi

    发明人： Yasuhisa Saito ,  Kunimasa Kamio ,  Shuichi Kanagawa ,  Yutaka Shiomi

    IPC分类号： C07D251/34 ,  C08F222/40 ,  C08G73/06 ,  C08G73/12

    CPC分类号： C08G73/0644 ,  C07D251/34 ,  C08F222/40 ,  C08G73/12

    摘要： A thermosetting resin composition comprising (i) a polymaleimide compound having at least two maleimide groups in the molecule and (ii) an s-triazine compound having at least two alkenylaryloxy groups in the molecule; a resin-composition for encapsulant comprising said polymaleimide compound, said triazine compound, and an inorganic filler as essential components; and said s-triazine compound.

    摘要翻译： 一种热固性树脂组合物，其包含（i）分子中具有至少两个马来酰亚胺基团的聚马来酰亚胺化合物和（ii）在分子中具有至少两个烯基芳氧基的s-三嗪化合物; 用于包含所述聚马来酰亚胺化合物，所述三嗪化合物和无机填料作为必要组分的密封剂的树脂组合物; 和所述s-三嗪化合物。

    Thermosetting resin composition
    8.
    发明授权
    Thermosetting resin composition 失效
    热固性树脂组合物

    公开(公告)号：US4908417A

    公开(公告)日：1990-03-13

    申请号：US347157

    申请日：1989-05-02

    申请人： Yutaka Shiomi ,  Kunimasa Kamio ,  Satoru Haraguchi ,  Shigeki Naitoh

    发明人： Yutaka Shiomi ,  Kunimasa Kamio ,  Satoru Haraguchi ,  Shigeki Naitoh

    IPC分类号： C08G77/455 ,  C08L61/14 ,  C08L79/08

    CPC分类号： C08L79/085 ,  C08G77/455 ,  C08L61/14

    摘要： A thermosetting resin composition is prepared by mixing(A) a phenol novolak resin having hydroxy groups and allyl-etherified hydroxy groups,(B) a polymaleimide compound having two or more maleimide groups in the molecule, and(C) at least one silicone resin having the following formula (I); ##STR1## wherein R.sub.1 and R.sub.2, which may be the same or different, are methyl or phenyl; R.sub.3 and R.sub.4, which may be the same or different, are methyl, phenyl, hydrogen or a group having an amino group or an epoxy group but at least one of R.sub.3 and R.sub.4 is hydrogen or a group having an amino group or an epoxy group; and l and m, which may be the same or different, are a number of 0-400. The thermosetting resin composition of the present invention can be suitably used for encapsulating electric devices, for example, and gives, by curing, a cured resin product of high quality.

    Thermosetting resin composition and use thereof for an electronic part
    10.
    发明授权
    Thermosetting resin composition and use thereof for an electronic part 失效
    热固性树脂组合物及其用于电子部件的用途

    公开(公告)号：US5252687A

    公开(公告)日：1993-10-12

    申请号：US677451

    申请日：1991-03-29

    申请人： Yutaka Shiomi ,  Shigeki Naitoh ,  Yasuhiro Hirano ,  Kazuo Takebe

    发明人： Yutaka Shiomi ,  Shigeki Naitoh ,  Yasuhiro Hirano ,  Kazuo Takebe

    IPC分类号： C08G8/28 ,  C08G77/42 ,  C08G77/50 ,  C08K5/3415 ,  C08L61/14 ,  C08L79/08 ,  H05K1/03 ,  C08F283/04

    CPC分类号： C08L61/14 ,  C08G77/42 ,  C08G77/50 ,  C08G8/28 ,  C08K5/3415 ,  C08L79/085 ,  H05K1/0353

    摘要： A thermosetting resin composition is provide, which contains a compound of ##STR1## wherein substituents R.sub.1 -R.sub.6 each represents a hydrogen atom or a saturated alkyl group having 1-6 carbon atoms, substituents R.sup.7 -R.sup.12 each represents a hydrogen atom, a saturated alkyl group having 1-4 carbon atoms or an alkoxy group having 1-4 carbon atoms, X.sub.a -X.sub.e each represents a hydrogen atom, a chlorine atom or a bromine atome, and the average repeating unit number n denotes a numeral from 0 to 5, and a polyamide compound having two or more maleimide groups and, if desired, a compound of ##STR2## wherein R.sub.1 and R.sub.2 each represents a methyl group or a phenyl group, and R.sub.3 represents a hydrogen atom or a functional group containing an amino group, a glycidyl group or an alicylic epoxy group, l denotes a numeral in the range of 0-500, and m denotes a numeral in the range of 1-500, or ##STR3## wherein R.sub.1 and R.sub.2 each represents a methyl group or a phenyl group, and R.sub.3 represents a hydrogen atom or a functional group containing an amino group, a glycidyl group or an alicyclic epoxy group, and p denotes a numeral in the range of 0-500. The composition is useful for electronic parts.