公开(公告)号：US09408296B2

公开(公告)日：2016-08-02

申请号：US13976630

申请日：2011-12-26

申请人： Shuji Tahara ,  Kiyomi Yasuda

发明人： Shuji Tahara ,  Kiyomi Yasuda

IPC分类号： H05K1/02 ,  C08L79/04 ,  H05K1/03 ,  H05K3/28 ,  C08G18/28 ,  C08G18/76 ,  C08G18/80 ,  C08G18/00 ,  H05K3/46

CPC分类号： H05K1/0213 ,  B32B2457/08 ,  C08G18/003 ,  C08G18/282 ,  C08G18/7671 ,  C08G18/8064 ,  C08L79/04 ,  H05K1/0346 ,  H05K3/285 ,  H05K3/4617

摘要： A resin composition which is capable of forming a film that has excellent heat resistance and slidability/bendability; a protective film for circuits, which uses the resin composition; and a dry film or the like which comprises the protective film are provided. Other aspects are a circuit board and a multilayer circuit board, each of which has excellent heat resistance and slidability/bendability. Furthermore, a protective film for circuit boards is provided, which is arranged in contact with a circuit of a printed wiring board, and contains a polyoxazolidone resin that has a weight average molecular weight of 3×104 or more.

摘要翻译： 能够形成耐热性和滑动性/弯曲性优异的膜的树脂组合物; 用于电路的保护膜，其使用树脂组合物; 以及包含保护膜的干膜等。 其他方面是电路板和多层电路板，其各自具有优异的耐热性和滑动性/弯曲性。 此外，设置与印刷电路板的电路接触的电路板用保护膜，并含有重均分子量为3×10 4以上的聚恶唑烷酮树脂。

公开(公告)号：US20130269985A1

公开(公告)日：2013-10-17

申请号：US13976630

申请日：2011-12-26

申请人： Shuji Tahara ,  Kiyomi Yasuda

发明人： Shuji Tahara ,  Kiyomi Yasuda

IPC分类号： H05K1/02

CPC分类号： H05K1/0213 ,  B32B2457/08 ,  C08G18/003 ,  C08G18/282 ,  C08G18/7671 ,  C08G18/8064 ,  C08L79/04 ,  H05K1/0346 ,  H05K3/285 ,  H05K3/4617

摘要： A resin composition which is capable of forming a film that has excellent heat resistance and slidability/bendability; a protective film for circuits, which uses the resin composition; and a dry film or the like which comprises the protective film are provided. Other aspects are a circuit board and a multilayer circuit board, each of which has excellent heat resistance and slidability/bendability. Furthermore, a protective film for circuit boards is provided, which is arranged in contact with a circuit of a printed wiring board, and contains a polyoxazolidone resin that has a weight average molecular weight of 3×104 or more.

摘要翻译： 能够形成耐热性和滑动性/弯曲性优异的膜的树脂组合物; 用于电路的保护膜，其使用树脂组合物; 以及包含保护膜的干膜等。 其他方面是电路板和多层电路板，其各自具有优异的耐热性和滑动性/弯曲性。 此外，设置与印刷电路板的电路接触的电路板用保护膜，并含有重均分子量为3×10 4以上的聚恶唑烷酮树脂。

公开(公告)号：US5081206A

公开(公告)日：1992-01-14

申请号：US529433

申请日：1990-05-29

申请人： Kiyomi Yasuda ,  Terufumi Suzuki ,  Toshimasa Takata ,  Isao Kaneko

发明人： Kiyomi Yasuda ,  Terufumi Suzuki ,  Toshimasa Takata ,  Isao Kaneko

IPC分类号： C08G59/06 ,  C08G59/30 ,  C08G59/32 ,  C08G59/38 ,  C08L63/00

CPC分类号： C08L63/00 ,  C08G59/066 ,  C08G59/30 ,  C08G59/3218 ,  C08G59/38

摘要： A heat-resistant, flame-retardant epoxy resin composition is provided by combining or reating members selected from a polyfunctional epoxy resin, a bisphenol type epoxy resin, a highly halogenated bisphenol type epoxy resin, a low halogenated bisphenol type epoxy resin, and a halogenated bisphenol. The composition is suitable as a laminate useful for printed circuit boards.

公开(公告)号：US5677397A

公开(公告)日：1997-10-14

申请号：US663375

申请日：1996-06-13

申请人： Hideo Nakamura ,  Terufumi Suzuki ,  Kiyomi Yasuda

发明人： Hideo Nakamura ,  Terufumi Suzuki ,  Kiyomi Yasuda

IPC分类号： C08G8/28 ,  C08G8/08 ,  C08G8/36 ,  C08G59/08 ,  C08G59/62 ,  C08L61/04 ,  C08L61/10 ,  C08L63/00 ,  C08L63/04 ,  H05K1/03 ,  C08F283/10 ,  C08G8/10

CPC分类号： H05K1/0326 ,  C08G59/08 ,  C08G8/08 ,  C08L63/04

摘要： An epoxy resin composition which exhibits a low dielectric constant and a low dielectric dissipation factor as well as an excellent working susceptibility after its curing is provided. The epoxy resin composition contains at least one member selected from a novolak resin (A) prepared by condensing formalin and an alkylphenol compound; and an epoxy resin (B) prepared by glycidylating said novolak resin (A) with an epihalohydrin.

摘要翻译： 提供了表现出低介电常数和低介电损耗因子以及其固化后优异的加工敏感性的环氧树脂组合物。 环氧树脂组合物含有选自由福尔马林和烷基酚化合物缩合制备的酚醛清漆树脂（A）中的至少一种; 和通过用表卤代醇缩水化所述酚醛清漆树脂（A）制备的环氧树脂（B）。

公开(公告)号：US5025067A

公开(公告)日：1991-06-18

申请号：US271815

申请日：1988-11-16

申请人： Yohzoh Yamamoto ,  Goro Suzuki ,  Hideo Nakamura ,  Kiyomi Yasuda

发明人： Yohzoh Yamamoto ,  Goro Suzuki ,  Hideo Nakamura ,  Kiyomi Yasuda

IPC分类号： C08G59/24 ,  C08G59/40 ,  C08L63/00 ,  G03G9/087

CPC分类号： C08G59/40 ,  C08G59/24 ,  C08G59/245 ,  C08L63/00 ,  G03G9/08753 ,  Y10S430/166

摘要： An epoxy resin comprising an active hydrogen compound having at least three active hydrogen atoms capable of reacting with an epoxy group in its molecule or butadine or isoprene as a main monomer is modified with an oligomer having on average at least 1.5 equivalents of active hydrogen capable of reacting with an epoxy group in its molecule. An epoxy resin modified with a bisphenol and a compound having active hydrogen or acid anhydride groups capable of reacting with an epoxy group is also provided. A toner containing the epoxy resin as a binder is useful in electrostatography.