公开(公告)号：US06456951B1

公开(公告)日：2002-09-24

申请号：US09553944

申请日：2000-04-21

申请人： Shunji Maeda ,  Yasuhiro Yoshitake ,  Kenji Oka ,  Masataka Shiba ,  Atsushi Shimoda

发明人： Shunji Maeda ,  Yasuhiro Yoshitake ,  Kenji Oka ,  Masataka Shiba ,  Atsushi Shimoda

IPC分类号： G06F1132

CPC分类号： H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention is related to an inspection data processing method for processing inspection data composed of coordinates data and characteristic quantity data about a defect generated on a subject of inspection detected with a visual inspection apparatus. The inspection data processing method comprises the following steps: a preparation step of storing a first fatality judgment data group corresponding to the kinds of areas on the subject of inspection and a second fatality judgment data group corresponding to categories of defects beforehand; a first fatality judgment step of judging a first fatality level of a defect corresponding to the kind of an area where the defect exists; a category giving step of giving category to the defect in the inspection data; and a second fatality judgment step of judging a second fatality of the defect based on second fatality judgment data selected according to the category which are given based on the first fatality level of defects judged in the first fatality judgment step.

摘要翻译： 本发明涉及一种用于处理检查数据的检查数据处理方法，该检查数据由关于在用目视检查装置检测到的检查对象上产生的缺陷的坐标数据和特征量数据组成。 检查数据处理方法包括以下步骤：预先存储与检查对象的区域的种类对应的第一死亡判定数据组和对应于缺陷类别的第二死亡判定数据组的准备步骤; 判断与存在缺陷的区域的种类相对应的缺陷的第一死亡水平的第一死亡判定步骤; 类别给出检查数据中的缺陷类别的步骤; 以及第二死亡判定步骤，基于根据在第一死亡判定步骤中判断的缺陷的第一死亡水平给出的根据类别选择的第二死亡判定数据来判断缺陷的第二死亡。

公开(公告)号：US07916929B2

公开(公告)日：2011-03-29

申请号：US12359452

申请日：2009-01-26

申请人： Shunji Maeda ,  Kenji Oka ,  Yukihiro Shibata ,  Minoru Yoshida ,  Chie Shishido ,  Yuji Takagi ,  Atsushi Yoshida ,  Kazuo Yamaguchi

发明人： Shunji Maeda ,  Kenji Oka ,  Yukihiro Shibata ,  Minoru Yoshida ,  Chie Shishido ,  Yuji Takagi ,  Atsushi Yoshida ,  Kazuo Yamaguchi

IPC分类号： G06K9/00

CPC分类号： G06T7/001 ,  G01N21/9501 ,  G01N21/95607 ,  G06T7/0004 ,  G06T2207/30148

摘要： A method of inspecting patterns, including: adjusting a brightness of at least one of a first bright field image and a second bright field image detected from a specimen and directed to similar patterns on differing parts of the specimen, so as to more closely match a brightness; comparing the images which are adjusted in brightness to match with each other to detect dissimilarities indicative of a defect of the pattern, wherein in adjusting the brightness, the brightness between the first bright field image and the second bright field image is adjusted by performing a gradation conversion of at least one of the brightness between the first bright field image and the second bright field image; and wherein in the comparing, said defect of the pattern is detected by using information of a scattered diagram of brightness of the first bright field image and the second bright field image.

摘要翻译： 一种检查图案的方法，包括：调整从样本检测到的第一明视野图像和第二亮视场图像中的至少一个的亮度，并且针对样本的不同部分上的相似图案，以便更紧密地匹配 亮度; 将亮度调整后的图像进行比较以相互匹配，以检测表示图案缺陷的不相似性，其中在调整亮度时，通过执行渐变来调整第一亮场图像和第二亮视场图像之间的亮度 第一亮场图像和第二亮场图像之间的亮度中的至少一个的转换; 并且其中在所述比较中，通过使用所述第一亮场图像和所述第二亮视场图像的亮度的散射图的信息来检测所述图案的所述缺陷。

公开(公告)号：US20090214102A1

公开(公告)日：2009-08-27

申请号：US12359452

申请日：2009-01-26

申请人： Shunji Maeda ,  Kenji Oka ,  Yukihiro Shibata ,  Minoru Yoshida ,  Chie Shishido ,  Yuji Takagi ,  Atsushi Yoshida ,  Kazuo Yamaguchi

发明人： Shunji Maeda ,  Kenji Oka ,  Yukihiro Shibata ,  Minoru Yoshida ,  Chie Shishido ,  Yuji Takagi ,  Atsushi Yoshida ,  Kazuo Yamaguchi

IPC分类号： G06K9/00

CPC分类号： G06T7/001 ,  G01N21/9501 ,  G01N21/95607 ,  G06T7/0004 ,  G06T2207/30148

摘要： A method of inspecting patterns, including: adjusting a brightness of at least one of a first bright field image and a second bright field image detected from a specimen and directed to similar patterns on differing parts of the specimen, so as to more closely match a brightness; comparing the images which are adjusted in brightness to match with each other to detect dissimilarities indicative of a defect of the pattern, wherein in adjusting the brightness, the brightness between the first bright field image and the second bright field image is adjusted by performing a gradation conversion of at least one of the brightness between the first bright field image and the second bright field image; and wherein in the comparing, said defect of the pattern is detected by using information of a scattered diagram of brightness of the first bright field image and the second bright field image.

摘要翻译： 一种检查图案的方法，包括：调整从样本检测到的第一明视野图像和第二亮视场图像中的至少一个的亮度，并指示到样本的不同部分上的相似图案，以便更紧密地匹配 亮度; 将亮度调整后的图像进行比较以相互匹配，以检测表示图案缺陷的不相似性，其中在调整亮度时，通过执行渐变来调整第一亮场图像和第二亮视场图像之间的亮度 第一亮场图像和第二亮场图像之间的亮度中的至少一个的转换; 并且其中在所述比较中，通过使用所述第一亮场图像和所述第二亮视场图像的亮度的散射图的信息来检测所述图案的所述缺陷。

公开(公告)号：US20080101685A1

公开(公告)日：2008-05-01

申请号：US11858215

申请日：2007-09-20

申请人： Shunji MAEDA ,  Kenji Oka ,  Yukihiro Shibata ,  Minoru Yoshida ,  Chie Shishido ,  Yuji Takagi ,  Atsushi Yoshida ,  Kazuo Yamaguchi

发明人： Shunji MAEDA ,  Kenji Oka ,  Yukihiro Shibata ,  Minoru Yoshida ,  Chie Shishido ,  Yuji Takagi ,  Atsushi Yoshida ,  Kazuo Yamaguchi

IPC分类号： G06K9/00

CPC分类号： G06T7/001 ,  G01N21/9501 ,  G01N21/95607 ,  G06T7/0004 ,  G06T2207/30148

摘要： A method of inspecting patterns to detect a defect of the patterns by using information of a scattered diagram of brightness of said first and second images.

摘要翻译： 通过使用所述第一和第二图像的亮度的散射图的信息来检查图案以检测图案的缺陷的方法。

公开(公告)号：US07092095B2

公开(公告)日：2006-08-15

申请号：US10761493

申请日：2004-01-20

申请人： Yukihiro Shibata ,  Shunji Maeda ,  Kazuo Yamaguchi ,  Minoru Yoshida ,  Atsushi Yoshida ,  Kenji Oka ,  Kenji Watanabe

发明人： Yukihiro Shibata ,  Shunji Maeda ,  Kazuo Yamaguchi ,  Minoru Yoshida ,  Atsushi Yoshida ,  Kenji Oka ,  Kenji Watanabe

IPC分类号： G01J4/00

CPC分类号： G01N21/21 ,  G01N21/9501 ,  G01N21/956 ,  G01N21/95607 ,  G02B21/0016

摘要： A defect inspecting apparatus can detect finer defects with high resolution optical images of those defects. The apparatus includes a sample mounting device for mounting a sample; lighting and detecting apparatus for illuminating a patterned sample mounted on a mount and detecting the optical image of the reflected light obtained therefrom. A display displays the optical image detected by this lighting and detecting apparatus. An optical parameter setting device sets and displays optical parameters for the lighting and detecting apparatus on the display. An optical parameter adjusting apparatus adjusts optical parameters set for the lighting and detecting apparatus according to the optical parameters set by the optical parameter setting apparatus. A storage device stores comparative image data. A defect detecting device detects defects from patterns formed on the sample by comparing the optical image detected by the optical image detecting apparatus with the comparative image data stored in the storage.

摘要翻译： 缺陷检查装置可以利用这些缺陷的高分辨率光学图像检测更细的缺陷。 该装置包括用于安装样品的样品安装装置; 照明和检测装置，用于照亮安装在安装件上的图案样品，并检测由其获得的反射光的光学图像。 显示器显示由该照明和检测装置检测的光学图像。 光学参数设定装置在显示器上设置并显示照明和检测装置的光学参数。 光学参数调整装置根据由光学参数设定装置设定的光学参数来调整对照明和检测装置设定的光学参数。 存储装置存储比较图像数据。 缺陷检测装置通过将由光学图像检测装置检测的光学图像与存储在存储器中的比较图像数据进行比较来检测在样本上形成的图案的缺陷。

公开(公告)号：US07061600B2

公开(公告)日：2006-06-13

申请号：US10098478

申请日：2002-03-18

申请人： Shunji Maeda ,  Yasuhiko Nakayama ,  Minoru Yoshida ,  Hitoshi Kubota ,  Kenji Oka

发明人： Shunji Maeda ,  Yasuhiko Nakayama ,  Minoru Yoshida ,  Hitoshi Kubota ,  Kenji Oka

IPC分类号： G01N21/00

CPC分类号： G01N21/8806 ,  G01N21/9501 ,  G01N21/956 ,  G01N21/95607 ,  G01N2021/95615 ,  G01N2201/0618 ,  G01N2201/0634

摘要： A pattern detection method and apparatus for inspecting, with high resolution, a micro fine defect of a pattern on an inspected object, and a semiconductor substrate manufacturing method and system with a high yield. A micro fine pattern on the inspected object is inspected by annular-looped illumination through an objective lens onto a wafer, the wafer having micro fine patterns thereon. The illumination may be polarized and controlled according to an image detected on the pupil of the objective lens, and image signals are obtained by detecting a reflected light from the wafer. The image signals are compared with reference image signals and a part of the pattern showing inconsistency is detected as a defect. Simultaneously, micro fine defects on the micro-fine pattern are detected with high resolution. Further, process conditions of a manufacturing line are controlled by analyzing a cause of defect and a factor of defect.

公开(公告)号：US06947587B1

公开(公告)日：2005-09-20

申请号：US09294137

申请日：1999-04-20

申请人： Shunji Maeda ,  Kenji Oka ,  Yukihiro Shibata ,  Minoru Yoshida ,  Chie Shishido ,  Yuji Takagi ,  Atsushi Yoshida ,  Kazuo Yamaguchi

发明人： Shunji Maeda ,  Kenji Oka ,  Yukihiro Shibata ,  Minoru Yoshida ,  Chie Shishido ,  Yuji Takagi ,  Atsushi Yoshida ,  Kazuo Yamaguchi

IPC分类号： G01N21/95 ,  G01N21/956 ,  G06K9/00 ,  G06T7/00

CPC分类号： G06T7/001 ,  G01N21/9501 ,  G01N21/95607 ,  G06T7/0004 ,  G06T2207/30148

摘要： A method of inspecting defects of a plurality of patterns that are formed on a substrate to have naturally the same shape. According to this method, in order to detect very small defects of the patterns with high sensitivity without being affected by irregular brightness due to the thickness difference between the patterns formed on a semiconductor wafer, a first pattern being inspected is detected to produce a first image of the first pattern, the first image is stored, a second pattern being inspected is detected to produce a second image of said second pattern, the stored first image and the second image are matched in brightness, and the brightness-matched first and second images are compared with each other so that the patterns can be inspected.

摘要翻译： 检查在基板上形成的具有自然相同形状的多个图案的缺陷的方法。 根据该方法，为了以高灵敏度检测图案的非常小的缺陷，不受由于在半导体晶片上形成的图案之间的厚度差而引起的不规则亮度的影响，检测出被检查的第一图案以产生第一图像 第一图案被存储，检测出被检查的第二图案以产生所述第二图案的第二图像，所存储的第一图像和第二图像的亮度相匹配，并且亮度匹配的第一和第二图像 彼此进行比较，从而可以检查图案。

公开(公告)号：US06263099B1

公开(公告)日：2001-07-17

申请号：US09107432

申请日：1998-06-30

申请人： Shunji Maeda ,  Yasuhiko Nakayama ,  Minoru Yoshida ,  Hitoshi Kubota ,  Kenji Oka

发明人： Shunji Maeda ,  Yasuhiko Nakayama ,  Minoru Yoshida ,  Hitoshi Kubota ,  Kenji Oka

IPC分类号： G06K900

CPC分类号： G01N21/8806 ,  G01N21/9501 ,  G01N21/956 ,  G01N21/95607 ,  G01N2021/95615 ,  G01N2201/0618 ,  G01N2201/0634

摘要： A pattern detection method and apparatus thereof for inspecting with high resolution a micro fine defect of a pattern on an inspected object and a semiconductor substrate manufacturing method and system for manufacturing semiconductor substrates such as semiconductor wafers with a high yield. A micro fine pattern on the inspected object is inspected by irradiating an annular-looped illumination through an objective lens onto a wafer mounted on a stage, the wafer having micro fine patterns thereon. The illumination light may be circularly or elliptically polarized and controlled according to an image detected on the pupil of the objective lens and image signals are obtained by detecting a reflected light from the wafer. The image signals are compared with reference image signals and a part of the pattern showing inconsistency is detected as a defect so that simultaneously, a micro fine defect or defects on the micro fine pattern are detected with high resolution. Further, process conditions of a manufacturing line are controlled by analyzing a cause of defect and a factor of defect which occurs on the pattern.

摘要翻译： 一种用于以高分辨率检查被检查物体上的图案的微细缺陷的图案检测方法及其装置以及以高产率制造半导体晶片等半导体基板的半导体基板的制造方法和系统。 通过将通过物镜的环形照明照射到安装在台架上的晶片上，检查被检查物体上的微细图案，晶片上具有微细精细图案。 照明光可以根据在物镜的光瞳上检测到的图像而被圆形或椭圆偏振并且被控制，并且通过检测来自晶片的反射光来获得图像信号。 将图像信号与参考图像信号进行比较，并且检测出显示不一致的图案的一部分作为缺陷，从而同时以高分辨率检测微细微图案或微细图案上的缺陷。 此外，通过分析缺陷的原因和在图案上发生的缺陷因素来控制生产线的工艺条件。

公开(公告)号：US07221486B2

公开(公告)日：2007-05-22

申请号：US10265659

申请日：2002-10-08

申请人： Hiroshi Makihira ,  Shunji Maeda ,  Kenji Oka ,  Minoru Yoshida ,  Yasuhiko Nakayama

发明人： Hiroshi Makihira ,  Shunji Maeda ,  Kenji Oka ,  Minoru Yoshida ,  Yasuhiko Nakayama

IPC分类号： H04N1/04

CPC分类号： G06T7/0004 ,  G06T2207/30148

摘要： A method and apparatus for sensing by a linear image sensor a two-dimensional image of an object to be sensed includes detecting a position of the object by a position sensor having a first resolution, picking up an image of the object being projected in a direction (V-scan direction) generally perpendicular to an internal scan (H-scan) direction of the linear image sensor in synchronism with relative movement between the object and the linear image sensor, periodically switching a pixel size along the V-scan direction between a plurality of predefined pixel sizes during the relative movement between the object and the linear image sensor in accordance with information of the relative movement detected by the position sensor, and producing from an output of the linear image sensor a two-dimensional image of the projected image having a second resolution of the object to be sensed. The second resolution is a higher resolution than the first resolution.

摘要翻译： 一种用于通过线性图像传感器检测待检测物体的二维图像的方法和装置包括通过具有第一分辨率的位置传感器检测物体的位置，拾取沿着方向投影的物体的图像 （V扫描方向），与物体和线性图像传感器之间的相对运动同步地与线性图像传感器的内部扫描（H扫描）方向大致垂直，周期性地沿着V扫描方向切换像素尺寸， 根据由位置传感器检测到的相对运动的信息，在物体和线性图像传感器之间的相对运动期间的多个预定像素尺寸，并且从线性图像传感器的输出产生投影图像的二维图像 具有要被感测的物体的第二分辨率。 第二项决议是比第一项决议更高的决议。

公开(公告)号：US20070070336A1

公开(公告)日：2007-03-29

申请号：US11605242

申请日：2006-11-29

申请人： Shunji Maeda ,  Yasuhiko Nakayama ,  Minoru Yoshida ,  Hitoshi Kubota ,  Kenji Oka

发明人： Shunji Maeda ,  Yasuhiko Nakayama ,  Minoru Yoshida ,  Hitoshi Kubota ,  Kenji Oka

IPC分类号： G01N21/00

CPC分类号： G01N21/95607 ,  G01N21/8806 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/95615 ,  G01N2201/0618 ,  G01N2201/0634

摘要： A method of inspecting a specimen, including: emitting a light from a lamp of a light source; illuminating a specimen on which plural patterns are formed with the light emitted from the light source and, passed through an objective lens; forming an optical image of the specimen by collecting light reflected from the specimen by the illuminating and passed through the objective lens and a image forming lens; detecting the optical image with a TDI image sensor; and processing a signal outputted from the TDI image sensor and detecting a defect of a pattern among the plural patterns formed on the specimen, wherein the image detected by the TDI image sensor is formed with light having a wavelength selected from the wavelengths of the light emitted from the light source.

摘要翻译： 一种检查样本的方法，包括：从光源的灯发射光; 用从光源发射的光照射形成有多个图案的样本，并通过物镜; 通过照射通过收集从样本反射的光并通过物镜和成像透镜来形成样本的光学图像; 用TDI图像传感器检测光学图像; 并处理从TDI图像传感器输出的信号，并且检测在样本上形成的多个图案之间的图案的缺陷，其中由TDI图像传感器检测到的图像由具有选自发射的光的波长的波长的光形成 从光源。