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    Semiconductor device and manufacturing method thereof
    10.
    发明授权
    Semiconductor device and manufacturing method thereof 有权
    半导体装置及其制造方法

    公开(公告)号：US07151015B2

    公开(公告)日：2006-12-19

    申请号：US09852672

    申请日：2001-05-11

    申请人： Hideomi Suzawa ,  Koji Ono ,  Toru Takayama ,  Tatsuya Arao ,  Shunpei Yamazaki

    发明人： Hideomi Suzawa ,  Koji Ono ,  Toru Takayama ,  Tatsuya Arao ,  Shunpei Yamazaki

    IPC分类号： H01L21/00 ,  H01L21/84

    CPC分类号： H01L27/124 ,  H01L21/32136 ,  H01L27/1214 ,  H01L27/127 ,  H01L27/1288 ,  H01L29/42384 ,  H01L29/4908 ,  H01L29/66757 ,  H01L29/78621 ,  H01L29/78627 ,  H01L29/78684 ,  H01L2029/7863

    摘要： There has been a problem that the manufacturing process is complicated and the number of processes is increased when a TFT with an LDD structure or a TFT with a GOLD structure is formed. In a method of manufacturing a semiconductor device, after low concentration impurity regions (24, 25) are formed in a second doping process, a width of the low concentration impurity region which is overlapped with the third electrode (18c) and a width of the low concentration impurity region which is not overlapped with the third electrode can be freely controlled by a fourth etching process. Thus, in a region overlapped with the third electrode, a relaxation of electric field concentration is achieved and then a hot carrier injection can be prevented. And, in the region which is not overlapped with the third electrode, the off-current value can be suppressed.

    摘要翻译： 当形成具有LDD结构的TFT或具有GOLD结构的TFT时，存在制造过程复杂并且处理次数增加的问题。 在制造半导体器件的方法中，在第二掺杂工艺中形成低浓度杂质区（24,25）之后，与第三电极（18c）重叠的低浓度杂质区的宽度和 可以通过第四蚀刻工艺来自由地控制不与第三电极重叠的低浓度杂质区域。 因此，在与第三电极重叠的区域中，实现电场浓度的松弛，然后可以防止热载流子注入。 并且，在不与第三电极重叠的区域中，可以抑制截止电流值。