Semiconductor device having oxide semiconductor layer
    1.
    发明授权
    Semiconductor device having oxide semiconductor layer 有权
    具有氧化物半导体层的半导体器件

    公开(公告)号:US08324621B2

    公开(公告)日:2012-12-04

    申请号:US12899962

    申请日:2010-10-07

    IPC分类号: H01L29/12

    摘要: Disclosed is a highly reliable semiconductor device and a manufacturing method thereof, which is achieved by using a transistor with favorable electrical characteristics and high reliability as a switching element. The semiconductor device includes a driver circuit portion and a pixel portion over one substrate, and the pixel portion comprises a light-transmitting bottom-gate transistor. The light-transmitting bottom-gate transistor comprises: a transparent gate electrode layer; an oxide semiconductor layer over the gate electrode layer, a superficial layer of the oxide semiconductor layer including comprising a microcrystal group of nanocrystals; and source and drain electrode layers formed over the oxide semiconductor layer, the source and drain electrode layers comprising a light-transmitting oxide conductive layer.

    摘要翻译: 公开了一种高可靠性的半导体器件及其制造方法,其通过使用具有良好的电特性和高可靠性的晶体管作为开关元件来实现。 半导体器件包括驱动电路部分和一个衬底上的像素部分,并且像素部分包括透光底栅晶体管。 透光底栅晶体管包括:透明栅极电极层; 在所述栅极电极层上的氧化物半导体层,所述氧化物半导体层的表面层包括微晶纳米晶体组; 以及形成在所述氧化物半导体层上的源极和漏极电极层,所述源极和漏极电极层包括透光氧化物导电层。

    Semiconductor device
    4.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号:US08530892B2

    公开(公告)日:2013-09-10

    申请号:US12917569

    申请日:2010-11-02

    IPC分类号: H01L29/10 H01L21/16

    摘要: An object is, in a thin film transistor including an oxide semiconductor layer, to reduce contact resistance between the oxide semiconductor layer and source and drain electrode layers electrically connected to the oxide semiconductor layer. The source and drain electrode layers have a stacked-layer structure of two or more layers in which a layer in contact with the oxide semiconductor layer is formed using an oxide of a metal whose work function is lower than the work function of the oxide semiconductor layer or an oxide of an alloy containing such a metal. Layers other than the layer in contact with the oxide semiconductor layer of the source and drain electrode layers are formed using an element selected from Al, Cr, Cu, Ta, Ti, Mo, or W, an alloy containing any of these elements as a component, an alloy containing any of these elements in combination, or the like.

    摘要翻译: 在包括氧化物半导体层的薄膜晶体管中,目的是减少氧化物半导体层与与氧化物半导体层电连接的源电极层和漏电极层之间的接触电阻。 源极和漏极层具有两层或多层的层叠结构,其中使用其功函数低于氧化物半导体层的功函数的金属的氧化物形成与氧化物半导体层接触的层 或含有这种金属的合金的氧化物。 使用选自Al,Cr,Cu,Ta,Ti,Mo或W的元素形成与源极和漏极电极层的氧化物半导体层接触的层以外的层,包含任何这些元素作为 组分,包含任何这些元素组合的合金等。

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE
    5.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE 有权
    用于制造半导体器件的半导体器件和方法

    公开(公告)号:US20110084269A1

    公开(公告)日:2011-04-14

    申请号:US12899265

    申请日:2010-10-06

    IPC分类号: H01L29/786 H01L21/336

    摘要: An object is to reduce contact resistance between an oxide semiconductor layer and source and drain electrode layers electrically connected to the oxide semiconductor layer in a thin film transistor including the oxide semiconductor layer. The source and drain electrode layers have a stacked structure of two or more layers. In this stack of layers, a layer in contact with the oxide semiconductor layer is a thin indium layer or a thin indium-alloy layer. Note that the oxide semiconductor layer contains indium. A second layer or second and any of subsequent layers in the source and drain electrode layers are formed using an element selected from Al, Cr, Cu, Ta, Ti, Mo, and W, an alloy containing any of these elements as a component, an alloy containing any of these elements in combination, or the like.

    摘要翻译: 本发明的目的是减少在包括氧化物半导体层的薄膜晶体管中氧化物半导体层与与氧化物半导体层电连接的源极和漏极电极层之间的接触电阻。 源极和漏极电极层具有两层或更多层的堆叠结构。 在该堆叠层中,与氧化物半导体层接触的层是薄的铟层或薄的铟 - 合金层。 注意,氧化物半导体层含有铟。 使用选自Al,Cr,Cu,Ta,Ti,Mo和W的元素来形成源极和漏极电极层中的第二层或第二层以及后续层中的任何一层,包含任何这些元素作为组分的合金, 合并这些元素中的任何一种的合金等。

    Light-emitting device and method for manufacturing light-emitting device
    6.
    发明授权
    Light-emitting device and method for manufacturing light-emitting device 有权
    发光装置及其制造方法

    公开(公告)号:US08759131B2

    公开(公告)日:2014-06-24

    申请号:US12693818

    申请日:2010-01-26

    IPC分类号: H01L21/28

    摘要: Techniques are provided for manufacturing a light-emitting device having high internal quantum efficiency, consuming less power, having high luminance, and having high reliability. The techniques include forming a conductive light-transmitting oxide layer comprising a conductive light-transmitting oxide material and silicon oxide, forming a barrier layer in which density of the silicon oxide is higher than that in the conductive light-transmitting oxide layer over the conductive light-transmitting oxide layer, forming an anode having the conductive light-transmitting oxide layer and the barrier layer, heating the anode under a vacuum atmosphere, forming an electroluminescent layer over the heated anode, and forming a cathode over the electroluminescent layer. According to the techniques, the barrier layer is formed between the electroluminescent layer and the conductive light-transmitting oxide layer.

    摘要翻译: 提供了用于制造具有高内部量子效率,消耗较少功率,具有高亮度并且具有高可靠性的发光装置的技术。 这些技术包括形成包含导电透光氧化物材料和氧化硅的导电透光氧化物层,形成阻挡层,其中氧化硅的密度高于导电光上的导电透光氧化物层的密度 形成具有导电透光性氧化物层和阻挡层的阳极,在真空气氛下加热阳极,在加热阳极上形成电致发光层,在电致发光层上形成阴极。 根据该技术,在电致发光层和导电透光性氧化物层之间形成阻挡层。

    Oxide semiconductor device
    7.
    发明授权
    Oxide semiconductor device 有权
    氧化物半导体器件

    公开(公告)号:US08421067B2

    公开(公告)日:2013-04-16

    申请号:US12846572

    申请日:2010-07-29

    IPC分类号: H01L29/12

    摘要: A semiconductor device having a structure which enables sufficient reduction in parasitic capacitance is provided. In addition, the operation speed of thin film transistors in a driver circuit is improved. In a bottom-gate thin film transistor in which an oxide insulating layer is in contact with a channel formation region in an oxide semiconductor layer, a source electrode layer and a drain electrode layer are formed in such a manner that they do not overlap with a gate electrode layer. Thus, the distance between the gate electrode layer and the source electrode layer and between the gate electrode layer and the drain electrode layer are increased; accordingly, parasitic capacitance can be reduced.

    摘要翻译: 提供具有能够充分降低寄生电容的结构的半导体器件。 此外,提高了驱动电路中薄膜晶体管的操作速度。 在其中氧化物绝缘层与氧化物半导体层中的沟道形成区域接触的底栅薄膜晶体管中,以与它们不重叠的方式形成源电极层和漏电极层 栅电极层。 因此,栅极电极层与源电极层之间以及栅极电极层和漏极电极层之间的距离增加; 因此,可以减小寄生电容。

    Light-Emitting Device and Method for Manufacturing Light-Emitting Device
    9.
    发明申请
    Light-Emitting Device and Method for Manufacturing Light-Emitting Device 有权
    发光装置及发光装置的制造方法

    公开(公告)号:US20070164671A1

    公开(公告)日:2007-07-19

    申请号:US11687204

    申请日:2007-03-16

    IPC分类号: H01J1/62

    摘要: Techniques are provided for manufacturing a light-emitting device having high internal quantum efficiency, consuming less power, having high luminance, and having high reliability. The techniques include forming a conductive light-transmitting oxide layer comprising a conductive light-transmitting oxide material and silicon oxide, forming a barrier layer in which density of the silicon oxide is higher than that in the conductive light-transmitting oxide layer over the conductive light-transmitting oxide layer, forming an anode having the conductive light-transmitting oxide layer and the barrier layer, heating the anode under a vacuum atmosphere, forming an electroluminescent layer over the heated anode, and forming a cathode over the electroluminescent layer. According to the techniques, the barrier layer is formed between the electroluminescent layer and the conductive light-transmitting oxide layer.

    摘要翻译: 提供了用于制造具有高内部量子效率,消耗较少功率,具有高亮度并且具有高可靠性的发光装置的技术。 这些技术包括形成包含导电透光氧化物材料和氧化硅的导电透光氧化物层,形成阻挡层,其中氧化硅的密度高于导电光上的导电透光氧化物层的密度 形成具有导电透光性氧化物层和阻挡层的阳极,在真空气氛下加热阳极,在加热阳极上形成电致发光层,在电致发光层上形成阴极。 根据该技术,在电致发光层和导电透光性氧化物层之间形成阻挡层。

    Semiconductor device and manufacturing method for the same
    10.
    发明授权
    Semiconductor device and manufacturing method for the same 有权
    半导体器件及其制造方法相同

    公开(公告)号:US08946700B2

    公开(公告)日:2015-02-03

    申请号:US13552805

    申请日:2012-07-19

    IPC分类号: H01L29/786 H01L27/12

    摘要: An object is to provide a method for manufacturing a highly reliable semiconductor device including thin film transistors which have stable electric characteristics and are formed using an oxide semiconductor. A method for manufacturing a semiconductor device includes the steps of: forming an oxide semiconductor film over a gate electrode with a gate insulating film interposed between the oxide semiconductor film and the gate electrode, over an insulating surface; forming a first conductive film including at least one of titanium, molybdenum, and tungsten, over the oxide semiconductor film; forming a second conductive film including a metal having lower electronegativity than hydrogen, over the first conductive film; forming a source electrode and a drain electrode by etching of the first conductive film and the second conductive film; and forming an insulating film in contact with the oxide semiconductor film, over the oxide semiconductor film, the source electrode, and the drain electrode.

    摘要翻译: 本发明的目的是提供一种用于制造具有稳定电特性并使用氧化物半导体形成的薄膜晶体管的高可靠性半导体器件的方法。 一种制造半导体器件的方法包括以下步骤:在绝缘表面上,在栅极上形成氧化物半导体膜,其中栅极绝缘膜置于氧化物半导体膜和栅电极之间; 在所述氧化物半导体膜上形成包括钛,钼和钨中的至少一种的第一导电膜; 在所述第一导电膜上形成包含具有比氢更低的电负性的金属的第二导电膜; 通过蚀刻第一导电膜和第二导电膜形成源电极和漏电极; 以及在所述氧化物半导体膜,所述源电极和所述漏极上形成与所述氧化物半导体膜接触的绝缘膜。