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1.发明授权Method for fabricating light emitting device and method for fabricating liquid crystal display device 有权制造发光器件的方法和用于制造液晶显示器件的方法公开(公告)号：US07858411B2
公开(公告)日：2010-12-28
申请号：US12259748
申请日：2008-10-28
IPC分类号： H01L33/00
CPC分类号： H01L27/1218 , G02F1/133305 , G02F1/1339 , G02F1/13394 , G02F1/1341 , G02F1/1368 , H01L21/2007 , H01L21/67092 , H01L21/6835 , H01L21/76251 , H01L27/1214 , H01L27/124 , H01L27/1259 , H01L27/1262 , H01L27/1266 , H01L27/156 , H01L27/3244 , H01L27/3248 , H01L27/3262 , H01L27/3276 , H01L29/66757 , H01L29/78603 , H01L51/0024 , H01L51/003 , H01L51/0097 , H01L51/56 , H01L2221/6835 , H01L2221/68363 , H01L2227/323 , H01L2227/326 , H01L2251/5338 , H01L2924/30105 , H01L2924/3025 , Y02E10/549
摘要： The object of the invention is to provide a method for fabricating a semiconductor device having a peeled layer bonded to a base material with curvature. Particularly, the object is to provide a method for fabricating a display with curvature, more specifically, a light emitting device having an OLED bonded to a base material with curvature. An external force is applied to a support originally having curvature and elasticity, and the support is bonded to a peeled layer formed over a substrate. Then, when the substrate is peeled, the support returns into the original shape by the restoring force, and the peeled layer as well is curved along the shape of the support. Finally, a transfer object originally having curvature is bonded to the peeled layer, and then a device with a desired curvature is completed.
摘要翻译： 本发明的目的是提供一种用于制造半导体器件的方法，该半导体器件具有以曲率结合到基底材料上的剥离层。 特别地，本发明的目的是提供一种用于制造具有曲率的显示器的方法，更具体地说，提供一种发光器件，该发光器件具有键合到具有曲率的基底材料的OLED。 对原来具有曲率和弹性的支撑件施加外力，并且将支撑件结合到形成在基板上的剥离层。 然后，当基板被剥离时，支撑件通过恢复力返回到原始形状，并且剥离层也沿着支撑件的形状弯曲。 最后，原来具有曲率的转印体被粘合到剥离层上，然后完成具有所需曲率的装置。
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公开(公告)号：US07446339B2
公开(公告)日：2008-11-04
申请号：US11422980
申请日：2006-06-08
IPC分类号： H01L29/06
CPC分类号： H01L27/1218 , G02F1/133305 , G02F1/1339 , G02F1/13394 , G02F1/1341 , G02F1/1368 , H01L21/2007 , H01L21/67092 , H01L21/6835 , H01L21/76251 , H01L27/1214 , H01L27/124 , H01L27/1259 , H01L27/1262 , H01L27/1266 , H01L27/156 , H01L27/3244 , H01L27/3248 , H01L27/3262 , H01L27/3276 , H01L29/66757 , H01L29/78603 , H01L51/0024 , H01L51/003 , H01L51/0097 , H01L51/56 , H01L2221/6835 , H01L2221/68363 , H01L2227/323 , H01L2227/326 , H01L2251/5338 , H01L2924/30105 , H01L2924/3025 , Y02E10/549
摘要： The object of the invention is to provide a method for fabricating a semiconductor device having a peeled layer bonded to a base material with curvature. Particularly, the object is to provide a method for fabricating a display with curvature, more specifically, a light emitting device having an OLED bonded to a base material with curvature. An external force is applied to a support originally having curvature and elasticity, and the support is bonded to a peeled layer formed over a substrate. Then, when the substrate is peeled, the support returns into the original shape by the restoring force, and the peeled layer as well is curved along the shape of the support. Finally, a transfer object original having curvature is bonded to the peeled layer, and then a device with a desired curvature is completed.
摘要翻译： 本发明的目的是提供一种用于制造半导体器件的方法，该半导体器件具有以曲率结合到基底材料上的剥离层。 特别地，本发明的目的是提供一种用于制造具有曲率的显示器的方法，更具体地说，提供一种发光器件，该发光器件具有键合到具有曲率的基底材料的OLED。 对原来具有曲率和弹性的支撑件施加外力，并且将支撑件结合到形成在基板上的剥离层。 然后，当基板被剥离时，支撑件通过恢复力返回到原始形状，并且剥离层也沿着支撑件的形状弯曲。 最后，将具有曲率的转印体原件粘合到剥离层，然后完成具有所需曲率的装置。
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公开(公告)号：US07180093B2
公开(公告)日：2007-02-20
申请号：US10697941
申请日：2003-10-31
申请人： Toru Takayama , Junya Maruyama , Yumiko Ohno , Masakazu Murakami , Toshiji Hamatani , Hideaki Kuwabara , Shunpei Yamazaki
发明人： Toru Takayama , Junya Maruyama , Yumiko Ohno , Masakazu Murakami , Toshiji Hamatani , Hideaki Kuwabara , Shunpei Yamazaki
CPC分类号： H01L27/3276 , H01L27/12 , H01L27/1214 , H01L27/124 , H01L27/1266 , H01L27/14634 , H01L27/14643 , H01L27/14683 , H01L27/3272 , H01L29/66757 , H01L29/78603 , H01L31/105 , H01L51/0024 , H01L51/003 , H01L51/5212 , H01L51/5253 , H01L2221/68368
摘要： The object is to provide a lightened semiconductor device and a manufacturing method thereof by pasting a layer to be peeled to various base materials. In the present invention, a layer to be peeled is formed on a substrate, then a seal substrate provided with an etching stopper film is pasted with a binding material on the layer to be peeled, followed by removing only the seal substrate by etching or polishing. The remaining etching stopper film is functioned as a blocking film. In addition, a magnet sheet may be pasted as a pasting member.
摘要翻译： 本发明的目的是通过将要剥离的层粘贴到各种基材上来提供照明的半导体器件及其制造方法。 在本发明中，在基板上形成被剥离层，然后将具有蚀刻阻挡膜的密封基板用粘合材料粘贴在被剥离层上，然后通过蚀刻或抛光仅去除密封基板 。 剩余的蚀刻阻挡膜用作阻挡膜。 此外，可以将磁片作为粘贴部件粘贴。
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4.发明申请METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE BY TRANSFERRING A LAYER TO A SUPPORT WITH CURVATURE 有权通过将层转移到具有曲线的支持来制造半导体器件的方法公开(公告)号：US20060216909A1
公开(公告)日：2006-09-28
申请号：US11422980
申请日：2006-06-08
CPC分类号： H01L27/1218 , G02F1/133305 , G02F1/1339 , G02F1/13394 , G02F1/1341 , G02F1/1368 , H01L21/2007 , H01L21/67092 , H01L21/6835 , H01L21/76251 , H01L27/1214 , H01L27/124 , H01L27/1259 , H01L27/1262 , H01L27/1266 , H01L27/156 , H01L27/3244 , H01L27/3248 , H01L27/3262 , H01L27/3276 , H01L29/66757 , H01L29/78603 , H01L51/0024 , H01L51/003 , H01L51/0097 , H01L51/56 , H01L2221/6835 , H01L2221/68363 , H01L2227/323 , H01L2227/326 , H01L2251/5338 , H01L2924/30105 , H01L2924/3025 , Y02E10/549
摘要： The object of the invention is to provide a method for fabricating a semiconductor device having a peeled layer bonded to a base material with curvature. Particularly, the object is to provide a method for fabricating a display with curvature, more specifically, a light emitting device having an OLED bonded to a base material with curvature. An external force is applied to a support originally having curvature and elasticity, and the support is bonded to a peeled layer formed over a substrate. Then, when the substrate is peeled, the support returns into the original shape by the restoring force, and the peeled layer as well is curved along the shape of the support. Finally, a transfer object original having curvature is bonded to the peeled layer, and then a device with a desired curvature is completed.
摘要翻译： 本发明的目的是提供一种用于制造半导体器件的方法，该半导体器件具有以曲率结合到基底材料上的剥离层。 特别地，本发明的目的是提供一种用于制造具有曲率的显示器的方法，更具体地说，提供一种发光器件，该发光器件具有键合到具有曲率的基底材料的OLED。 对原来具有曲率和弹性的支撑件施加外力，并且将支撑件结合到形成在基板上的剥离层。 然后，当基板被剥离时，支撑件通过恢复力返回到原始形状，并且剥离层也沿着支撑件的形状弯曲。 最后，将具有曲率的转印体原件粘合到剥离层，然后完成具有所需曲率的装置。
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5.发明授权Method for fabricating a semiconductor device by transferring a layer to a support with curvature 失效通过将层转移到具有曲率的支撑体来制造半导体器件的方法公开(公告)号：US07060591B2
公开(公告)日：2006-06-13
申请号：US11079287
申请日：2005-03-15
IPC分类号： H01L21/461
CPC分类号： H01L27/1218 , G02F1/133305 , G02F1/1339 , G02F1/13394 , G02F1/1341 , G02F1/1368 , H01L21/2007 , H01L21/67092 , H01L21/6835 , H01L21/76251 , H01L27/1214 , H01L27/124 , H01L27/1259 , H01L27/1262 , H01L27/1266 , H01L27/156 , H01L27/3244 , H01L27/3248 , H01L27/3262 , H01L27/3276 , H01L29/66757 , H01L29/78603 , H01L51/0024 , H01L51/003 , H01L51/0097 , H01L51/56 , H01L2221/6835 , H01L2221/68363 , H01L2227/323 , H01L2227/326 , H01L2251/5338 , H01L2924/30105 , H01L2924/3025 , Y02E10/549
摘要： The object of the invention is to provide a method for fabricating a semiconductor device having a peeled layer bonded to a base material with curvature. Particularly, the object is to provide a method for fabricating a display with curvature, more specifically, a light emitting device having an OLED bonded to a base material with curvature. An external force is applied to a support originally having curvature and elasticity, and the support is bonded to a peeled layer formed over a substrate. Then, when the substrate is peeled, the support returns into the original shape by the restoring force, and the peeled layer as well is curved along the shape of the support. Finally, a transfer object originally having curvature is bonded to the peeled layer, and then a device with a desired curvature is completed.
摘要翻译： 本发明的目的是提供一种用于制造半导体器件的方法，该半导体器件具有以曲率结合到基底材料上的剥离层。 特别地，本发明的目的是提供一种用于制造具有曲率的显示器的方法，更具体地说，提供一种发光器件，该发光器件具有键合到具有曲率的基底材料的OLED。 对原来具有曲率和弹性的支撑件施加外力，并且将支撑件结合到形成在基板上的剥离层。 然后，当基板被剥离时，支撑件通过恢复力返回到原始形状，并且剥离层也沿着支撑件的形状弯曲。 最后，原来具有曲率的转印体被粘合到剥离层上，然后完成具有所需曲率的装置。
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6.发明授权公开(公告)号：US06953735B2
公开(公告)日：2005-10-11
申请号：US10334076
申请日：2002-12-27
IPC分类号： H01L21/00 , H01L21/20 , H01L21/762 , H01L51/00 , H01L51/40 , H01L51/56 , H01L21/461
CPC分类号： H01L27/1218 , G02F1/133305 , G02F1/1339 , G02F1/13394 , G02F1/1341 , G02F1/1368 , H01L21/2007 , H01L21/67092 , H01L21/6835 , H01L21/76251 , H01L27/1214 , H01L27/124 , H01L27/1259 , H01L27/1262 , H01L27/1266 , H01L27/156 , H01L27/3244 , H01L27/3248 , H01L27/3262 , H01L27/3276 , H01L29/66757 , H01L29/78603 , H01L51/0024 , H01L51/003 , H01L51/0097 , H01L51/56 , H01L2221/6835 , H01L2221/68363 , H01L2227/323 , H01L2227/326 , H01L2251/5338 , H01L2924/30105 , H01L2924/3025 , Y02E10/549
摘要： The object of the invention is to provide a method for fabricating a semiconductor device having a peeled layer bonded to a base material with curvature. Particularly, the object is to provide a method for fabricating a display with curvature, more specifically, a light emitting device having an OLED bonded to a base material with curvature. An external force is applied to a support originally having curvature and elasticity, and the support is bonded to a peeled layer formed over a substrate. Then, when the substrate is peeled, the support returns into the original shape by the restoring force, and the peeled layer as well is curved along the shape of the support. Finally, a transfer object originally having curvature is bonded to the peeled layer, and then a device with a desired curvature is completed.
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7.发明申请Method for fabricating a semiconductor device by transferring a layer to a support with curvature 失效通过将层转移到具有曲率的支撑体来制造半导体器件的方法公开(公告)号：US20050164470A1
公开(公告)日：2005-07-28
申请号：US11079287
申请日：2005-03-15
IPC分类号： H01L21/00 , H01L21/20 , H01L21/762 , H01L51/00 , H01L51/40 , H01L51/56 , B32B9/00 , B32B33/00 , H01L21/8249
CPC分类号： H01L27/1218 , G02F1/133305 , G02F1/1339 , G02F1/13394 , G02F1/1341 , G02F1/1368 , H01L21/2007 , H01L21/67092 , H01L21/6835 , H01L21/76251 , H01L27/1214 , H01L27/124 , H01L27/1259 , H01L27/1262 , H01L27/1266 , H01L27/156 , H01L27/3244 , H01L27/3248 , H01L27/3262 , H01L27/3276 , H01L29/66757 , H01L29/78603 , H01L51/0024 , H01L51/003 , H01L51/0097 , H01L51/56 , H01L2221/6835 , H01L2221/68363 , H01L2227/323 , H01L2227/326 , H01L2251/5338 , H01L2924/30105 , H01L2924/3025 , Y02E10/549
摘要： The object of the invention is to provide a method for fabricating a semiconductor device having a peeled layer bonded to a base material with curvature. Particularly, the object is to provide a method for fabricating a display with curvature, more specifically, a light emitting device having an OLED bonded to a base material with curvature. An external force is applied to a support originally having curvature and elasticity, and the support is bonded to a peeled layer formed over a substrate. Then, when the substrate is peeled, the support returns into the original shape by the restoring force, and the peeled layer as well is curved along the shape of the support. Finally, a transfer object originally having curvature is bonded to the peeled layer, and then a device with a desired curvature is completed.
摘要翻译： 本发明的目的是提供一种用于制造半导体器件的方法，该半导体器件具有以曲率结合到基底材料上的剥离层。 特别地，本发明的目的是提供一种用于制造具有曲率的显示器的方法，更具体地说，提供一种发光器件，该发光器件具有键合到具有曲率的基底材料的OLED。 对原来具有曲率和弹性的支撑件施加外力，并且将支撑件结合到形成在基板上的剥离层。 然后，当基板被剥离时，支撑件通过恢复力返回到原始形状，并且剥离层也沿着支撑件的形状弯曲。 最后，原来具有曲率的转印体被粘合到剥离层上，然后完成具有所需曲率的装置。
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公开(公告)号：US08237164B2
公开(公告)日：2012-08-07
申请号：US12759999
申请日：2010-04-14
申请人： Toru Takayama , Junya Maruyama , Yumiko Ohno , Masakazu Murakami , Toshiji Hamatani , Hideaki Kuwabara , Shunpei Yamazaki
发明人： Toru Takayama , Junya Maruyama , Yumiko Ohno , Masakazu Murakami , Toshiji Hamatani , Hideaki Kuwabara , Shunpei Yamazaki
IPC分类号： H01L29/772
CPC分类号： H01L27/3276 , H01L27/12 , H01L27/1214 , H01L27/124 , H01L27/1266 , H01L27/14634 , H01L27/14643 , H01L27/14683 , H01L27/3272 , H01L29/66757 , H01L29/78603 , H01L31/105 , H01L51/0024 , H01L51/003 , H01L51/5212 , H01L51/5253 , H01L2221/68368
摘要： (OBJECT) The object is to provide a lightened semiconductor device and a manufacturing method thereof by pasting a layer to be peeled to various base materials.(MEANS FOR SOLVING THE PROBLEM) In the present invention, a layer to be peeled is formed on a substrate, then a seal substrate provided with an etching stopper film is pasted with a binding material on the layer to be peeled, followed by removing only the seal substrate by etching or polishing. The remaining etching stopper film is functioned as a blocking film. In addition, a magnet sheet may be pasted as a pasting member.
摘要翻译： （目的）本发明的目的是提供一种减轻半导体器件及其制造方法，该方法是将待剥离的层粘贴到各种基材上。 （解决问题的手段）在本发明中，在基板上形成被剥离层，然后将具有蚀刻阻挡膜的密封基板上的粘合材料粘贴在被剥离层上，然后仅除去 密封衬底通过蚀刻或抛光。 剩余的蚀刻阻挡膜用作阻挡膜。 此外，可以将磁片作为粘贴部件粘贴。
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公开(公告)号：US07741642B2
公开(公告)日：2010-06-22
申请号：US11702058
申请日：2007-02-05
申请人： Toru Takayama , Junya Maruyama , Yumiko Ohno , Masakazu Murakami , Toshiji Hamatani , Hideaki Kuwabara , Shunpei Yamazaki
发明人： Toru Takayama , Junya Maruyama , Yumiko Ohno , Masakazu Murakami , Toshiji Hamatani , Hideaki Kuwabara , Shunpei Yamazaki
CPC分类号： H01L27/3276 , H01L27/12 , H01L27/1214 , H01L27/124 , H01L27/1266 , H01L27/14634 , H01L27/14643 , H01L27/14683 , H01L27/3272 , H01L29/66757 , H01L29/78603 , H01L31/105 , H01L51/0024 , H01L51/003 , H01L51/5212 , H01L51/5253 , H01L2221/68368
摘要： The object is to provide a lightened semiconductor device and a manufacturing method thereof by pasting a layer to be peeled to various base materials.In the present invention, a layer to be peeled is formed on a substrate, then a seal substrate provided with an etching stopper film is pasted with a binding material on the layer to be peeled, followed by removing only the seal substrate by etching or polishing. The remaining etching stopper film is functioned as a blocking film. In addition, a magnet sheet may be pasted as a pasting member.
摘要翻译： 本发明的目的是通过将要剥离的层粘贴到各种基材上来提供照明的半导体器件及其制造方法。 在本发明中，在基板上形成被剥离层，然后将具有蚀刻阻挡膜的密封基板用粘合材料粘贴在被剥离层上，然后通过蚀刻或抛光仅去除密封基板 。 剩余的蚀刻阻挡膜用作阻挡膜。 此外，可以将磁片作为粘贴部件粘贴。
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公开(公告)号：US20090124062A1
公开(公告)日：2009-05-14
申请号：US12259748
申请日：2008-10-28
IPC分类号： H01L21/50
CPC分类号： H01L27/1218 , G02F1/133305 , G02F1/1339 , G02F1/13394 , G02F1/1341 , G02F1/1368 , H01L21/2007 , H01L21/67092 , H01L21/6835 , H01L21/76251 , H01L27/1214 , H01L27/124 , H01L27/1259 , H01L27/1262 , H01L27/1266 , H01L27/156 , H01L27/3244 , H01L27/3248 , H01L27/3262 , H01L27/3276 , H01L29/66757 , H01L29/78603 , H01L51/0024 , H01L51/003 , H01L51/0097 , H01L51/56 , H01L2221/6835 , H01L2221/68363 , H01L2227/323 , H01L2227/326 , H01L2251/5338 , H01L2924/30105 , H01L2924/3025 , Y02E10/549
摘要： The object of the invention is to provide a method for fabricating a semiconductor device having a peeled layer bonded to a base material with curvature. Particularly, the object is to provide a method for fabricating a display with curvature, more specifically, a light emitting device having an OLED bonded to a base material with curvature. An external force is applied to a support originally having curvature and elasticity, and the support is bonded to a peeled layer formed over a substrate. Then, when the substrate is peeled, the support returns into the original shape by the restoring force, and the peeled layer as well is curved along the shape of the support. Finally, a transfer object originally having curvature is bonded to the peeled layer, and then a device with a desired curvature is completed.
摘要翻译： 本发明的目的是提供一种用于制造半导体器件的方法，该半导体器件具有以曲率结合到基底材料上的剥离层。 特别地，本发明的目的是提供一种用于制造具有曲率的显示器的方法，更具体地说，提供一种发光器件，该发光器件具有键合到具有曲率的基底材料的OLED。 对原来具有曲率和弹性的支撑件施加外力，并且将支撑件结合到形成在基板上的剥离层。 然后，当基板被剥离时，支撑件通过恢复力返回到原始形状，并且剥离层也沿着支撑件的形状弯曲。 最后，原来具有曲率的转印体被粘合到剥离层上，然后完成具有所需曲率的装置。
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