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公开(公告)号：US11723177B2
公开(公告)日：2023-08-08
申请号：US17290587
申请日：2019-10-31
发明人： Thomas Bigl , Alexander Hensler , Stephan Neugebauer , Ewgenij Ochs , Philipp Oschmann , Stefan Pfefferlein , Ulrich Wetzel
IPC分类号： H05K7/20 , F28F21/08 , H01L23/373 , H01L23/427
CPC分类号： H05K7/20445 , F28F21/085 , H05K7/20336 , H05K7/20409 , H05K7/20936 , H01L23/373 , H01L23/427
摘要： A cooling device for heat dissipation from an electronic component includes a heating tube having a heating tube surface, a cooling element having a first cooling element side formed with a slot recess which at least partially encloses the heating tube, and a fiber structure made of fibers and arranged on the heating tube surface in a region in which the heating tube is at least partially enclosed by the slot recess. The fibers on the heating tube surface of the heating tube in the region of the slot recess form a mechanical connection with a cooling element surface of the cooling element.
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公开(公告)号：US11056460B2
公开(公告)日：2021-07-06
申请号：US16481758
申请日：2018-01-22
发明人： Stefan Pfefferlein , Thomas Bigl
IPC分类号： H01L23/00 , H01L23/498 , H05K1/18 , H05K3/28 , H05K3/34
摘要： A method for producing an electric circuit in which a contact carrier comprising a first contact area and a second contact area is provided. An insulating body is applied to the circuit carrier and at least partially covers the first contact area and the second contact area. The insulating body comprises cut-outs in regions both contact areas. A flowable electrical conducting medium is introduced into the insulating body.
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公开(公告)号：US20210410299A1
公开(公告)日：2021-12-30
申请号：US17469453
申请日：2021-09-08
发明人： Stefan Pfefferlein
摘要： A circuit carrier includes a first side, two layers arranged to define an intermediate space there between, with at least one of the two layers being electrically conductive and attached to the first side. The at least one of the two layers has a region deformed such as to exhibit an indentation and has a trace structure in the indentation. A first insulating material fills the intermediate space, and a second insulating material fills the indentation, A second side in opposition to the first side is shaped to have in the deformed region a cut-out for receiving a bare die such as to come into an electrical contact with the at least one of the two layers.
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公开(公告)号：US10420220B2
公开(公告)日：2019-09-17
申请号：US16301064
申请日：2017-05-02
发明人： Thomas Bigl , Alexander Hensler , Stephan Neugebauer , Stefan Pfefferlein , Jörg Strogies , Klaus Wilke
摘要： Various embodiments may include an electronic assembly comprising: a first circuit carrier having a first mounting face for electronic components; a second circuit carrier having a second mounting face for electronic components; wherein the second mounting face faces the first mounting face and is connected thereto; and an electronic component connected both to the first mounting face and the second mounting face; wherein the first mounting face includes a contact region between the first circuit carrier and the component; and the contact region is flexible in a direction perpendicular to the first mounting face in comparison to an adjacent region of the first circuit carrier surrounding the contact region and in comparison to the second circuit carrier.
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公开(公告)号：US10306794B2
公开(公告)日：2019-05-28
申请号：US15762451
申请日：2016-08-08
IPC分类号： H05K7/00 , H05K7/14 , H01G4/40 , H01G9/15 , H01G4/28 , H01G4/32 , H01G9/28 , H01G2/08 , H01G2/10 , H02M7/00 , H05K1/18 , H02M5/458
摘要： An electrical circuit arrangement has at least one capacitor (1) and at least one other circuit part (4) electrically cooperating with the first capacitor (1). The first capacitor (1) is part of a first capacitor arrangement (2) which annularly surrounds the cavity (3). The other circuit part (4) is provided at least partially within the cavity (3) and is electrically connected to the first capacitor (1). The first capacitor arrangement (2) has fastening elements (7) by means of which the circuit arrangement can be mechanically fastened to a holding element (8).
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公开(公告)号：US11153977B2
公开(公告)日：2021-10-19
申请号：US17033127
申请日：2020-09-25
发明人： Stefan Pfefferlein
IPC分类号： H05K1/11 , H05K1/16 , H05K1/18 , H05K3/00 , H05K3/30 , H05K5/06 , H01L21/00 , H01L21/48 , H01L21/50 , H01L21/56 , H01L23/00 , H01L23/28 , H01L23/31 , H01L23/498 , H01L23/552 , H05K3/46 , H05K3/40
摘要： A circuit carrier includes a first side, two layers arranged to define an intermediate space there between, with at least one of the two layers being electrically conductive and attached to the first side. The at least one of the two layers has a region deformed such as to exhibit an indentation and has a trace structure in the indentation. A first insulating material fills the intermediate space, and a second insulating material fills the indentation, A second side in opposition to the first side is shaped to have in the deformed region a cut-out for receiving a bare die such as to come into an electrical contact with the at least one of the two layers.
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公开(公告)号：US10998249B2
公开(公告)日：2021-05-04
申请号：US16958067
申请日：2018-11-19
发明人： Stefan Pfefferlein , Thomas Bigl , Ewgenij Ochs
IPC分类号： H01L23/10 , H01L23/34 , H01L23/367 , H01L23/498 , H01L21/48 , H05K7/20
摘要： A semiconductor assembly includes a semiconductor element having contacts on a first surface electrically connected with contacts of a carrier element by electrically conductive material. A second surface opposite the first surface has a convex curvature with a first radius or a concave curvature with a second radius. The second surface of the convex curvature or the second surface of the concave curvature is connected in a positive-fit manner to a cooling body surface of a concave cooling body curvature of the cooling body, and, during operation at a selected barrier layer temperature, the first radius of the convex curvature deviates by at most 10% from a third radius of the concave cooling body curvature, or the second radius of the concave curvature deviates by at most 10% from a fourth radius of the convex cooling body curvature.
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公开(公告)号：US20200305302A1
公开(公告)日：2020-09-24
申请号：US16607595
申请日：2018-04-11
发明人： Stefan Pfefferlein
IPC分类号： H05K7/20
摘要： A cooling apparatus for cooling an electronic component includes a heat sink, a heat sink cover to close a top area opening of the heat sink, a tube-shaped cooling element arranged inside the heat sink for some cooling ribs of the heat sink in mechanical contact with an outer side of the tube-shaped cooling element, and an impeller with blades for generating a cooling flow of a cooling medium. The tube-shaped cooling element forms a first cooling duct to conduct the cooling flow in a first cooling flow direction. A second cooling duct opposite the first cooling duct is formed between an inner area of the heat sink and the outer side of the tube-shaped cooling element to conduct the cooling flow in a second cooling flow direction. The cooling flow is redirected from the first cooling duct to the second cooling duct or vice versa.
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公开(公告)号：US10191091B2
公开(公告)日：2019-01-29
申请号：US15882273
申请日：2018-01-29
发明人： Stefan Pfefferlein , Ulrich Wetzel
IPC分类号： G01R15/24 , G02B6/42 , H05K1/02 , G01R33/032 , G02B6/12
摘要： A circuit board with a conductor path having a recess, an implant with left, right, lower and upper edges arranged in the recess, where the implant has first and second optical layers, a second optical layer and a conductor arranged between them, the first and the second optical layer each have at least one light-conducting structure with first and second ends, where a light-conductor is arranged in a right edge of the implant, in which respective second ends of the light-conducting structures are located, such that light fed in at the first end of the optical fiber of the first optical layer is deflected to the second end of the light-conducting structure of the second optical layer such that a beam path of the light encompasses the conductor, and the circuit also includes an optical transmitter and an optical receiver with and evaluator that form a fiber optic current sensor.
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公开(公告)号：US20240304587A1
公开(公告)日：2024-09-12
申请号：US18277443
申请日：2021-12-10
IPC分类号： H01L23/00
CPC分类号： H01L24/32 , H01L24/83 , H01L2224/32225 , H01L2224/8384
摘要： The invention relates to a power module (1) comprising a substrate (2). an electrically conductive intermediate layer (3) which is arranged on the substrate (2) and which has a joining region (4) produced by means of sintering, and at least one power component (5) which is arranged on the intermediate layer (3) and the sintered joining region (4) and is connected thereto (in particular at the load connection of the power component (5)) and which has at least one connection point (6) (e.g. a control connection) connected to the intermediate layer (3), wherein the intermediate layer (3) has. in the region of the associated connection point (6). a solder region (7) produced by means of a solder preform and spaced and/or electrically insulated from the sintered joining region (4). The large active surface, which is subjected to high thermomechanical stress in the service life test. can therefore be connected via the sintered joining region (4), which ensures an especially long-lasting, reliable and resilient mechanical connection between the associated power component (5) and the substrate (2). At the associated connection point (6), e.g. the gate of a transistor, the thermomechanical stress is usually much less, which is why there in the intermediate layer (3) a solder preform can be used for producing the connection between the associated power component (5) and the substrate (2), such solder preforms being relatively cost-effectively obtainable. Furthermore. an electrical device (10) has at least one such power module (1). The joining region (4) produced by means of sintering can be formed by means of a sinter preform or by means of 3D printing. by means of a coating method or by means of screen printing/stencil printing. In the method for producing the power module (1). the intermediate layer (3) can be heated to the melting temperature of the solder if the melting temperature of the solder is higher than the sintering temperature or to the sintering temperature if the sintering temperature is higher than the melting temperature of the solder, and the layer thickness (9) of the sintering material for the joining region (4) produced by means of sintering can be larger or smaller than the layer thickness (9) of the solder for the associated solder region (7) if the sintering temperature is correspondingly lower or higher than the melting temperature of the solder. Alternatively. the melting temperature of the solder can be substantially the same as the sintering temperature, and the layer thickness (9) of the sintering material for the joining region (4) produced by means of sintering can be substantially the same as the layer thickness (9) of the solder for the associated solder region (7). The sintered joining region (4) can have a sintering core (4″) which is in the form of solid material and which has. on each of its two sides. i.e. facing the power component (5) and facing the substrate (2), a sintering material (4′): also envisageable would be a layered. sintered joining region (4) in which sintering material and solid material alternate layer-by-layer. i.e. sintering material-solid material-sintering material-solid material-sintering material.
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