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公开(公告)号：US11424170B2
公开(公告)日：2022-08-23
申请号：US15301772
申请日：2015-03-30
发明人： Nora Busche , Joerg Strogies , Klaus Wilke
IPC分类号： H01L23/057 , H01L23/498 , H01L23/373 , H01L23/00 , H01L21/50 , H01L23/10 , H01L21/48 , H01L23/473
摘要： A method for mounting an electrical component on a substrate is disclosed. According to the method, joining is simplified using a cover, or hood, that includes a contact structure on an inner side of the hood, wherein when the hood is mounted, the contact structure is joined to the underlying structure at different joining levels simultaneously using an additional material. Moreover, a joining pressure, e.g., for diffusion or sintered bonds for electrical contacts, can be applied using such a hood.
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公开(公告)号：US11285568B2
公开(公告)日：2022-03-29
申请号：US16607574
申请日：2018-04-23
IPC分类号： B23K35/00 , B23K35/02 , B23K35/26 , B23K35/30 , B23K101/36
摘要： Various embodiments include a solder preform for establishing a diffusion solder connection comprising: a microstructure including a solder material and a metallic material; a first joining surface for a first joining partner and a second joining surface for a second joining partner; and a diffusion zone comprising an intermetallic compound of at least some of the solder material and at least some of the metallic material. The first joining surface and the second joining surface include at least some solder material.
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3.发明申请公开(公告)号：US20220336408A1
公开(公告)日：2022-10-20
申请号：US17640937
申请日：2020-09-03
摘要： Various embodiments of the teachings herein include a semifinished product for use in the populating of a power electronics component by a connecting method. The product includes an electrically insulating prepreg frame electrically insulated. The prepreg frame is configured for surrounding an applied connecting material at a metallized installation site during the population. A material of the prepreg frame enables simultaneous processability of electrical connection and electrical insulation by compression of the insulation material in the form of the semifinished product since the processing parameters of the electrical connecting material and the semifinished product are compatible.
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公开(公告)号：US10004147B2
公开(公告)日：2018-06-19
申请号：US15025515
申请日：2014-09-11
发明人： Joerg Strogies , Klaus Wilke
CPC分类号： H05K3/341 , H01L24/05 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/33 , H01L24/83 , H01L2224/04026 , H01L2224/05552 , H01L2224/05557 , H01L2224/05647 , H01L2224/29011 , H01L2224/29034 , H01L2224/291 , H01L2224/29111 , H01L2224/3003 , H01L2224/3011 , H01L2224/30131 , H01L2224/30134 , H01L2224/30177 , H01L2224/3201 , H01L2224/32058 , H01L2224/32059 , H01L2224/32221 , H01L2224/32503 , H01L2224/33107 , H01L2224/83385 , H01L2224/83447 , H01L2224/8381 , H01L2224/83815 , H01L2224/83825 , H05K1/11 , H05K1/181 , H01L2924/014 , H01L2924/01047 , H01L2924/01029 , H01L2924/00014 , H01L2924/00012
摘要： A diffusion soldering method for joining an electronic component to a substrate is provided. The joining surfaces are designed such that cavities are formed in a joining gap between the component and substrate. The formation of such cavities can be provided, e.g., by depressions in a mounting surface of the component and/or in a contact surface of the substrate, the depressions being cup-shaped and/or defining channels that surround columnar structural elements, the end faces of which define the mounting surface and/or contact surface. The cavities are designed such that solder material can leak into the cavities when the component during a heating process to achieve a desired width of the joining gap. This allows for the formation of a narrow-width joining having a diffusion zone that bridges the joining gap upon soldering. In this manner, a diffusion solder connection can be produced even using standard solder.
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5.发明申请Method For Mounting An Electrical Component In Which A Hood Is Used, And A Hood That Is Suitable For Use In This Method 审中-公开用于安装使用罩的电气部件的方法以及适用于该方法的罩子公开(公告)号：US20170033024A1
公开(公告)日：2017-02-02
申请号：US15301772
申请日：2015-03-30
发明人： Nora Busche , Joerg Strogies , Klaus Wilke
IPC分类号： H01L23/057 , H01L23/373 , H01L21/48 , H01L23/498
摘要： A method for mounting an electrical component on a substrate is disclosed. According to the method, joining is simplified using a cover, or hood, that includes a contact structure on an inner side of the hood, wherein when the hood is mounted, the contact structure is joined to the underlying structure at different joining levels simultaneously using an additional material. Moreover, a joining pressure, e.g., for diffusion or sintered bonds for electrical contacts, can be applied using such a hood.
摘要翻译： 公开了一种将电气部件安装在基板上的方法。 根据该方法，使用包括罩的内侧上的接触结构的盖或罩来简化接合，其中当安装罩时，接触结构以不同的接合水平同时连接到下面的结构，同时使用 一种额外的材料。 此外，可以使用这种罩来施加例如用于电接触的扩散或烧结接合的接合压力。
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公开(公告)号：US20220285311A1
公开(公告)日：2022-09-08
申请号：US17630030
申请日：2020-06-15
发明人： Matthias Heimann , Bernd Müller , Christian Nachtigall-Schellenberg , Jörg Strogies , Klaus Wilke
IPC分类号： H01L23/00 , H01L23/498 , H01L21/48 , H01L21/683
摘要： Various embodiments include a method for installing an electronic assembly having a die and a substrate with a reference plane. The method may include: providing a product carrier having recesses with varying dimensions different from one another; and arranging planar molded parts, joining materials, and the die on the product carrier. The die is in electrical contact with at least one planar molded part and at least one joining material. The method further includes forming functional elements from the planar molded parts and/or the die and the joining materials, the functional elements supporting the substrate and electrically contacting the reference plane.
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公开(公告)号：US11373984B2
公开(公告)日：2022-06-28
申请号：US17046974
申请日：2019-04-17
发明人： Jörg Strogies , Klaus Wilke , Bernd Müller
IPC分类号： H01L25/07 , H01L23/367 , H01L23/48 , H01L23/498
摘要： Various embodiments include a power module comprising: a first power electronics device arranged on a first substrate board; and a second power electronics device mounted on a second substrate board. The first substrate board, the first device, the second substrate board, and the second device are arranged on a first baseplate stacked above one another or in planar fashion beside one another.
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公开(公告)号：US11282822B2
公开(公告)日：2022-03-22
申请号：US16967655
申请日：2019-01-14
发明人： Wilhelm Meyrath , Franz Pfleger , Peter Prankh , Jörg Strogies , Bernd Müller , Klaus Wilke , Matthias Heimann
IPC分类号： H01L25/16 , H01L25/18 , H01L25/11 , H01L23/64 , H01L23/473 , H01L23/495
摘要： Various embodiments of the teachings herein include power electronic circuits comprising: interconnected power modules, each with a power electronic element and a plurality of capacitors in parallel. The power electronic elements are mounted on a first side of substrate plates. The capacitors are mounted in a plurality of planes one above the other on a second side of the substrate plates. The substrate plates, with the power electronic elements forward and alongside each other, are fixed onto an assembly side of a base circuit carrier.
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公开(公告)号：US11212918B2
公开(公告)日：2021-12-28
申请号：US16631651
申请日：2018-06-19
发明人： Rene Blank , Martin Franke , Peter Frühauf , Rüdiger Knofe , Bernd Müller , Stefan Nerreter , Jörg Strogies , Klaus Wilke
摘要： Various embodiments include an electrical assembly with: an electronic switching element electrically contacted on an underside and arranged on a flexible first wiring support; wherein the electronic switching element is electrically contacted on an upper side lying opposite the lower side; and a second wiring support arranged lying opposite the first wiring support on the upper side electrical contacting area of the electronic switching element. The first wiring support and the second wiring support each comprise a permanently elastic, electrically insulating, thermally conductive material.
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公开(公告)号：US20210351151A1
公开(公告)日：2021-11-11
申请号：US17268296
申请日：2019-08-20
摘要： Various embodiments include a circuit carrier comprising: an installation place for an electronic component; and a deposit of a joining adjuvant applied to the installation place. The installation place has at an edge, a recess forming a depression in a surface of the circuit carrier. The deposit comprises a sintered material with a protuberance at an edge of the deposit.
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