公开(公告)号：US11677311B2

公开(公告)日：2023-06-13

申请号：US17763100

申请日：2020-08-18

Applicant: Siemens Aktiengesellschaft

Inventor： Peter Köllensperger ,  Stephan Neugebauer

IPC: H02M7/5388 ,  H02M1/15 ,  H02P29/50 ,  H02M7/48 ,  H02M5/458 ,  H02M7/5387 ,  H02M7/5395

CPC classification number: H02M1/15 ,  H02M7/4803 ,  H02P29/50 ,  H02M5/458 ,  H02M7/4826 ,  H02M7/5387 ,  H02M7/5395

Abstract: In a method for operating a controllable converter with an intermediate circuit capacitor, the control behavior can be improved by transmitting, depending on an intermediate circuit voltage applied to the intermediate circuit capacitor, an additional power component via the controllable converter such that the electric current that is generated by the controllable converter for the additional power component counteracts an oscillation of the intermediate circuit voltage. The additional power component is transmitted by the controllable converter to a connected motor as a pulsating additional torque. Also described is a controllable converter with a control unit for carrying out a method, wherein the controllable converter has semiconductors that can be switched off, and an intermediate circuit capacitor designed as a film-type capacitor.

公开(公告)号：US10699984B2

公开(公告)日：2020-06-30

申请号：US16471472

申请日：2017-12-15

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Stephan Neugebauer ,  Stefan Pfefferlein ,  Ronny Werner

IPC: H01L23/367 ,  H01L23/373

Abstract: A semiconductor module includes a substrate composed of electrically insulating material. A structured metal layer for contact with an electrical component is applied to a top side of the substrate. The structured metal layer is applied to the substrate only in a central region of the substrate, so that an edge region which surrounds the central region and in which the structured metal layer is not applied to the substrate remains on the top side of the substrate. A contact layer for making contact with a cooling body is situated opposite the structured metal layer and applied to a bottom side of the substrate in the central region. A structured supporting structure is further applied to the bottom side of the substrate in the edge region and has a thickness which corresponds to a thickness of the contact layer.

公开(公告)号：US11723177B2

公开(公告)日：2023-08-08

申请号：US17290587

申请日：2019-10-31

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Thomas Bigl ,  Alexander Hensler ,  Stephan Neugebauer ,  Ewgenij Ochs ,  Philipp Oschmann ,  Stefan Pfefferlein ,  Ulrich Wetzel

IPC: H05K7/20 ,  F28F21/08 ,  H01L23/373 ,  H01L23/427

CPC classification number: H05K7/20445 ,  F28F21/085 ,  H05K7/20336 ,  H05K7/20409 ,  H05K7/20936 ,  H01L23/373 ,  H01L23/427

Abstract: A cooling device for heat dissipation from an electronic component includes a heating tube having a heating tube surface, a cooling element having a first cooling element side formed with a slot recess which at least partially encloses the heating tube, and a fiber structure made of fibers and arranged on the heating tube surface in a region in which the heating tube is at least partially enclosed by the slot recess. The fibers on the heating tube surface of the heating tube in the region of the slot recess form a mechanical connection with a cooling element surface of the cooling element.

公开(公告)号：US10420220B2

公开(公告)日：2019-09-17

申请号：US16301064

申请日：2017-05-02

Applicant: Siemens Aktiengesellschaft

Inventor： Thomas Bigl ,  Alexander Hensler ,  Stephan Neugebauer ,  Stefan Pfefferlein ,  Jörg Strogies ,  Klaus Wilke

IPC: H05K1/18 ,  H05K3/46 ,  H05K3/32 ,  H05K1/02

Abstract: Various embodiments may include an electronic assembly comprising: a first circuit carrier having a first mounting face for electronic components; a second circuit carrier having a second mounting face for electronic components; wherein the second mounting face faces the first mounting face and is connected thereto; and an electronic component connected both to the first mounting face and the second mounting face; wherein the first mounting face includes a contact region between the first circuit carrier and the component; and the contact region is flexible in a direction perpendicular to the first mounting face in comparison to an adjacent region of the first circuit carrier surrounding the contact region and in comparison to the second circuit carrier.

公开(公告)号：US10306794B2

公开(公告)日：2019-05-28

申请号：US15762451

申请日：2016-08-08

Applicant: Siemens Aktiengesellschaft

Inventor： Thomas Bigl ,  Alexander Hensler ,  Stephan Neugebauer ,  Stefan Pfefferlein

IPC: H05K7/00 ,  H05K7/14 ,  H01G4/40 ,  H01G9/15 ,  H01G4/28 ,  H01G4/32 ,  H01G9/28 ,  H01G2/08 ,  H01G2/10 ,  H02M7/00 ,  H05K1/18 ,  H02M5/458

Abstract: An electrical circuit arrangement has at least one capacitor (1) and at least one other circuit part (4) electrically cooperating with the first capacitor (1). The first capacitor (1) is part of a first capacitor arrangement (2) which annularly surrounds the cavity (3). The other circuit part (4) is provided at least partially within the cavity (3) and is electrically connected to the first capacitor (1). The first capacitor arrangement (2) has fastening elements (7) by means of which the circuit arrangement can be mechanically fastened to a holding element (8).

公开(公告)号：US12211629B2

公开(公告)日：2025-01-28

申请号：US18019973

申请日：2021-07-14

Applicant: Siemens Aktiengesellschaft

Inventor： Volker Müller ,  Stephan Neugebauer

IPC: H01B17/56 ,  H01B5/00 ,  H01L23/367 ,  H02G5/10

Abstract: A contact system includes a support body, a heat sink configured to contact the support body in an electrically insulated and/or heat-conducting manner, and an electrically insulating layer arranged between the heat sink and the support body. The heat sink has a first surface which is embodied substantially as a flat area and formed with a recess in a region intended for contacting a periphery of a contact area of the support body. The recess forms an unbroken track on the first surface of the heat sink. The contact area of the support body is located on the heat sink in such a way that the recess extends completely along the periphery of the contact area. The insulating layer between the heat sink and the support body is configured to cover the recess in such a way that a closed channel is formed by the recess and the insulating layer.

公开(公告)号：US11756857B2

公开(公告)日：2023-09-12

申请号：US17617844

申请日：2020-06-05

Applicant: Siemens Aktiengesellschaft

Inventor： Thomas Bigl ,  Alexander Hensler ,  Stephan Neugebauer ,  Stefan Pfefferlein

IPC: H01L23/373 ,  H05K1/11 ,  H01L21/48 ,  H01L25/07 ,  H01L25/00 ,  H05K1/02 ,  H05K1/14 ,  H05K3/34

CPC classification number: H01L23/3735 ,  H01L21/4807 ,  H01L25/072 ,  H01L25/50 ,  H05K1/0204 ,  H05K1/115 ,  H05K1/145 ,  H05K3/341 ,  H05K2201/068

Abstract: An electronic circuit has three circuit carriers and two semiconductor components. A first semiconductor component contacts with its upper side an underside of a first circuit carrier, and with its underside an upper side of a second circuit carrier. The first circuit carrier has vias, with a first via connecting the first semiconductor component to a first conducting path and a second via connecting a connection element forming a second conducting path providing an integral connection between the circuit carriers. A second semiconductor component contacts the underside of the first circuit carrier and is electrically connected to the first or second conducting path. An underside of the second semiconductor component contacts an upper side of the third circuit carrier. A lateral thermal expansion coefficient of the first circuit carrier is greater than a lateral thermal expansion coefficient of both the second and the third circuit carrier.

公开(公告)号：US11129301B2

公开(公告)日：2021-09-21

申请号：US16332676

申请日：2017-08-24

Applicant: Siemens Aktiengesellschaft

Inventor： Angelo Meyer ,  Stephan Neugebauer

IPC: H05K7/20 ,  H01L23/367

Abstract: A thermally conductive insulator includes a first part having first fins arranged on a surface of the first part, and a second part having second fins arranged on a surface of the second part. The first fins and the second fins are arranged in such a way that they mesh with one another. Arranged between the first and second parts in a region of the first and second fins is an insulating layer.