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公开(公告)号：US09648427B2
公开(公告)日：2017-05-09
申请号：US14979424
申请日：2015-12-27
申请人： Sijie Chi
发明人： Sijie Chi
CPC分类号： H04R19/04 , H01L2224/16145 , H01L2224/48091 , H04R19/005 , H04R2201/003 , H04R2499/11 , H01L2924/00014
摘要： The present disclosure discloses a MEMS microphone including a MEMS chip, an ASIC chip and an injection molding package. The MEMS chip is stacked on and connected to the ASIC chip by a TSV connector. The MEMS chip comprises a substrate having a cavity, a back plate and a diaphragm for forming a capacitor structure. The cavity is divided by the capacitor structure into a rear acoustic cavity facing the ASIC chip and the front acoustic cavity opposite to the rear acoustic cavity. The size of the MEMS microphone is reduced effectively, as the MEMS chip is stacked on the ASIC chip and connected each other by a TSV connector.
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公开(公告)号：US09900706B2
公开(公告)日：2018-02-20
申请号：US15080252
申请日：2016-03-24
申请人： Sijie Chi
发明人： Sijie Chi
CPC分类号： H04R19/04 , H01F17/00 , H01F17/0013 , H01F2019/085 , H01P1/20345 , H04R3/00 , H04R3/007
摘要： A microstrip filter is provided in the present disclosure. The microstrip filter includes a substrate having a first surface and a second surface opposite to each other, a first spiral metal line formed on the first surface of the substrate, and a second spiral metal line formed on the second surface of the substrate. At least part of the first spiral metal line overlaps and is coupled to the second spiral metal line for forming a filter capacitor. The present disclosure also provides a microphone device using the microstrip filter.
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公开(公告)号：US20160219377A1
公开(公告)日：2016-07-28
申请号：US14979424
申请日：2015-12-27
申请人： Sijie Chi
发明人： Sijie Chi
CPC分类号： H04R19/04 , H01L2224/16145 , H01L2224/48091 , H04R19/005 , H04R2201/003 , H04R2499/11 , H01L2924/00014
摘要： The present disclosure discloses a MEMS microphone including a MEMS chip, an ASIC chip and an injection molding package. The MEMS chip is stacked on and connected to the ASIC chip by a TSV connector. The MEMS chip comprises a substrate having a cavity, a back plate and a diaphragm for forming a capacitor structure. The cavity is divided by the capacitor structure into a rear acoustic cavity facing the ASIC chip and the front acoustic cavity opposite to the rear acoustic cavity. The size of the MEMS microphone is reduced effectively, as the MEMS chip is stacked on the ASIC chip and connected each other by a TSV connector.
摘要翻译： 本公开公开了一种包括MEMS芯片，ASIC芯片和注射成型封装的MEMS麦克风。 MEMS芯片通过TSV连接器堆叠在ASIC芯片上并连接到ASIC芯片。 MEMS芯片包括具有空腔的衬底，背板和用于形成电容器结构的隔膜。 空腔被电容器结构分成面向ASIC芯片的后声腔和与后声腔相对的前声腔。 随着MEMS芯片堆叠在ASIC芯片上并通过TSV连接器相互连接，MEMS麦克风的尺寸得到有效降低。
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公开(公告)号：US20170034633A1
公开(公告)日：2017-02-02
申请号：US15080252
申请日：2016-03-24
申请人： Sijie Chi
发明人： Sijie Chi
CPC分类号： H04R19/04 , H01F17/00 , H01F17/0013 , H01F2019/085 , H01P1/20345 , H04R3/00 , H04R3/007
摘要： A microstrip filter is provided in the present disclosure. The microstrip filter includes a substrate having a first surface and a second surface opposite to each other, a first spiral metal line formed on the first surface of the substrate, and a second spiral metal line formed on the second surface of the substrate. At least part of the first spiral metal line overlaps and is coupled to the second spiral metal line for forming a filter capacitor. The present disclosure also provides a microphone device using the microstrip filter.
摘要翻译： 本公开提供了一种微带滤波器。 微带滤波器包括具有彼此相对的第一表面和第二表面的基板，形成在基板的第一表面上的第一螺旋金属线和形成在基板的第二表面上的第二螺旋金属线。 第一螺旋金属线的至少一部分与第二螺旋金属线重叠并耦合以形成滤波电容。 本公开还提供了使用微带滤波器的麦克风装置。
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