公开(公告)号：US20160093546A1

公开(公告)日：2016-03-31

申请号：US14833102

申请日：2015-08-23

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Yu-Cheng Pai ,  Shih-Chao Chiu ,  Chun-Hsien Lin ,  Chih-Wen Fan ,  Cheng-Chia Chen

IPC: H01L23/13 ,  H01L21/56 ,  H01L23/00 ,  H01L21/48

CPC classification number: H01L23/13 ,  H01L21/4857 ,  H01L23/3128 ,  H01L23/498 ,  H01L23/49822 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/37001 ,  H05K3/4682 ,  H05K2203/0152 ,  H05K2203/016 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of fabricating a package structure is provided. The method includes providing a carrier having two opposing surfaces, forming dielectric bodies on the two surfaces of the carrier, respectively, each of the dielectric bodies having a wiring layer embedded therein and a conductive layer formed on the wiring layer, and removing the carrier. Therefore, the wiring layers, the conductive layers and the dielectric bodies are formed on the two surfaces of the carrier, respectively, and the production yield is thus increased. The present invention further provides the package structure thus fabricated.

Abstract translation: 提供一种制造封装结构的方法。 该方法包括提供具有两个相对表面的载体，分别在载体的两个表面上形成介电体，每个绝缘体具有嵌入其中的布线层和形成在布线层上的导电层，并且去除载体。 因此，分别在载体的两个表面上形成布线层，导电层和介电体，从而提高了生产量。 本发明还提供如此制造的封装结构。