公开(公告)号：US20160329261A1

公开(公告)日：2016-11-10

申请号：US14998048

申请日：2015-12-24

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chung-Jen Hung ,  Chi-An Pan ,  Chi-Hsiang Hsu ,  Liang-Yi Hung

IPC: H01L23/367 ,  H01L23/00 ,  H01L23/31 ,  H01L23/373 ,  H01L21/56

CPC classification number: H01L23/3675 ,  H01L23/3157 ,  H01L23/3736 ,  H01L23/433 ,  H01L24/27 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/2745 ,  H01L2224/29005 ,  H01L2224/29082 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29166 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/00

Abstract: An electronic device is provided, which includes an electronic element and a heat dissipating element disposed on the electronic element through a thermal conductor, wherein a width of the thermal conductor is smaller than a width of the electronic element. The thermal conductor includes silver to thereby greatly increase the thermal conductivity of the thermal conductor and hence improve the thermal conduction efficiency of the electronic device.

Abstract translation: 提供了一种电子设备，其包括通过热导体设置在电子元件上的电子元件和散热元件，其中导热体的宽度小于电子元件的宽度。 热导体包括银，从而大大增加导热体的导热性，从而提高电子器件的热传导效率。

公开(公告)号：US09607923B2

公开(公告)日：2017-03-28

申请号：US14998048

申请日：2015-12-24

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chung-Jen Hung ,  Chi-An Pan ,  Chi-Hsiang Hsu ,  Liang-Yi Hung

IPC: H01L23/367 ,  H01L23/373 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/3675 ,  H01L23/3157 ,  H01L23/3736 ,  H01L23/433 ,  H01L24/27 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/2745 ,  H01L2224/29005 ,  H01L2224/29082 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29166 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/00

Abstract: An electronic device is provided, which includes an electronic element and a heat dissipating element disposed on the electronic element through a thermal conductor, wherein a width of the thermal conductor is smaller than a width of the electronic element. The thermal conductor includes silver to thereby greatly increase the thermal conductivity of the thermal conductor and hence improve the thermal conduction efficiency of the electronic device.