公开(公告)号：US20160181126A1

公开(公告)日：2016-06-23

申请号：US15054845

申请日：2016-02-26

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Tai-Tsung Hsu ,  Cheng-Yu Chiang ,  Miao-Wen Chen ,  Wen-Jung Chiang ,  Hsin-Hung Lee

IPC: H01L21/56 ,  H01L21/428 ,  H01L23/58 ,  H01L23/367 ,  H01L23/552

CPC classification number: H01L21/56 ,  H01L21/428 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/552 ,  H01L23/585 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2924/1815

Abstract: A multi-chip package structure is provided, including a substrate having a grounding structure; two semiconductor elements disposed on and electrically connected to the substrate; an encapsulant formed on the substrate and encapsulating semiconductor elements, wherein the encapsulant has a plurality of round holes formed between the semiconductor elements; and an electromagnetic shielding structure formed in each of the round holes and connected to the grounding structure to achieve electromagnetic shielding effects. A method for forming the multi-chip package is also provided.

Abstract translation: 提供一种多芯片封装结构，包括具有接地结构的基板; 两个半导体元件设置在基板上并与其电连接; 形成在所述基板上并封装半导体元件的密封剂，其中所述密封剂具有形成在所述半导体元件之间的多个圆形孔; 以及形成在每个圆孔中的电磁屏蔽结构，并连接到接地结构以实现电磁屏蔽效果。 还提供了一种用于形成多芯片封装的方法。

公开(公告)号：US09887102B2

公开(公告)日：2018-02-06

申请号：US15054845

申请日：2016-02-26

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Tai-Tsung Hsu ,  Cheng-Yu Chiang ,  Miao-Wen Chen ,  Wen-Jung Chiang ,  Hsin-Hung Lee

IPC: H01L21/56 ,  H01L23/36 ,  H01L23/552 ,  H01L23/31 ,  H01L21/428 ,  H01L23/367 ,  H01L23/58 ,  H01L25/065

CPC classification number: H01L21/56 ,  H01L21/428 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/552 ,  H01L23/585 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2924/1815

Abstract: A multi-chip package structure is provided, including a substrate having a grounding structure; two semiconductor elements disposed on and electrically connected to the substrate; an encapsulant formed on the substrate and encapsulating semiconductor elements, wherein the encapsulant has a plurality of round holes formed between the semiconductor elements; and an electromagnetic shielding structure formed in each of the round holes and connected to the grounding structure to achieve electromagnetic shielding effects. A method for forming the multi-chip package is also provided.

公开(公告)号：US09305885B2

公开(公告)日：2016-04-05

申请号：US13960064

申请日：2013-08-06

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Tai-Tsung Hsu ,  Cheng-Yu Chiang ,  Miao-Wen Chen ,  Wen-Jung Chiang ,  Hsin-Hung Lee

IPC: H01L23/552 ,  H01L21/00 ,  H01L23/31 ,  H01L23/36 ,  H01L25/065 ,  H01L21/56

CPC classification number: H01L21/56 ,  H01L21/428 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/552 ,  H01L23/585 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2924/1815

Abstract: A multi-chip package structure is provided, including a substrate having a grounding structure; two semiconductor elements disposed on and electrically connected to the substrate; an encapsulant formed on the substrate and encapsulating semiconductor elements, wherein the encapsulant has a plurality of round holes formed between the semiconductor elements; and an electromagnetic shielding structure formed in each of the round holes and connected to the grounding structure to achieve electromagnetic shielding effects. A method for forming the multi-chip package is also provided.

Abstract translation: 提供一种多芯片封装结构，包括具有接地结构的基板; 两个半导体元件设置在基板上并与其电连接; 形成在所述基板上并封装半导体元件的密封剂，其中所述密封剂具有形成在所述半导体元件之间的多个圆形孔; 以及形成在每个圆孔中的电磁屏蔽结构，并连接到接地结构以实现电磁屏蔽效果。 还提供了一种用于形成多芯片封装的方法。

公开(公告)号：US20140231972A1

公开(公告)日：2014-08-21

申请号：US13960064

申请日：2013-08-06

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Tai-Tsung Hsu ,  Cheng-Yu Chiang ,  Miao-Wen Chen ,  Wen-Jung Chiang ,  Hsin-Hung Lee

IPC: H01L23/552 ,  H01L21/56

CPC classification number: H01L21/56 ,  H01L21/428 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/552 ,  H01L23/585 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2924/1815

Abstract: A multi-chip package structure is provided, including a substrate having a grounding structure; two semiconductor elements disposed on and electrically connected to the substrate; an encapsulant formed on the substrate and encapsulating semiconductor elements, wherein the encapsulant has a plurality of round holes formed between the semiconductor elements; and an electromagnetic shielding structure formed in each of the round holes and connected to the grounding structure to achieve electromagnetic shielding effects. A method for forming the multi-chip package is also provided.

Abstract translation: 提供一种多芯片封装结构，包括具有接地结构的基板; 两个半导体元件设置在基板上并与其电连接; 形成在所述基板上并封装半导体元件的密封剂，其中所述密封剂具有形成在所述半导体元件之间的多个圆形孔; 以及形成在每个圆孔中的电磁屏蔽结构，并连接到接地结构以实现电磁屏蔽效果。 还提供了一种用于形成多芯片封装的方法。